JP2552028Y2 - Solar radiation sensor - Google Patents

Solar radiation sensor

Info

Publication number
JP2552028Y2
JP2552028Y2 JP1990016472U JP1647290U JP2552028Y2 JP 2552028 Y2 JP2552028 Y2 JP 2552028Y2 JP 1990016472 U JP1990016472 U JP 1990016472U JP 1647290 U JP1647290 U JP 1647290U JP 2552028 Y2 JP2552028 Y2 JP 2552028Y2
Authority
JP
Japan
Prior art keywords
solar radiation
photodetector
sensor
output
radiation sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1990016472U
Other languages
Japanese (ja)
Other versions
JPH03109083U (en
Inventor
博文 手塚
真一郎 渡利
俊秀 小谷野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP1990016472U priority Critical patent/JP2552028Y2/en
Publication of JPH03109083U publication Critical patent/JPH03109083U/ja
Application granted granted Critical
Publication of JP2552028Y2 publication Critical patent/JP2552028Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)

Description

【考案の詳細な説明】 〔産業上の利用分野〕 本考案は、太陽電池やホトダイオード等の光検出素子
によって太陽光を受光し、日射量や日射方向を検出する
日射センサに関する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a solar radiation sensor that receives sunlight by a photodetector such as a solar cell or a photodiode and detects the amount and direction of solar radiation.

〔従来の技術〕[Conventional technology]

従来、この種の日射センサとして例えば第6図に示さ
れたものが知られている。図において、A,B,C,Dはそれ
ぞれ四方に向いた方形の支持台の垂直面にとりつけた光
検出素子であり、Eは支持台の水平面に取り付けた光検
出素子を示す。このように光検出素子を支持台の5面に
配設し、各光検出素子の出力を比較・演算することによ
って、日射量や日射方向(太陽の方位、高度)を精度よ
く検出することができる(例えば特開昭51-38137号公報
参照)。
Conventionally, for example, a solar radiation sensor of this type has been known as shown in FIG. In the figure, A, B, C, and D are photodetectors mounted on a vertical surface of a rectangular support pedestal in four directions, respectively, and E is a photodetector mounted on a horizontal surface of the support. By arranging the photodetectors on the five surfaces of the support and comparing and calculating the outputs of the photodetectors, it is possible to accurately detect the amount of solar radiation and the direction of solar radiation (azimuth and altitude of the sun). (For example, see JP-A-51-38137).

〔考案が解決しようとする課題〕[Problems to be solved by the invention]

しかしながら、上記日射センサは支持台上の各光検出
素子から出力を取り出すためのリード線を接続する必要
があり、さらに出力データの処理等を行う回路基板上に
リード線を結線するために、半田付け作業もしくはコネ
クタによる結線作業が必要となり、複雑な工程が多くな
るうえ、自動機械による組立作業はきわめて困難となり
問題である。さらに、上記リード線の結線のために装置
全体が大型化するのでこれも問題である。
However, the above-mentioned solar radiation sensor needs to connect a lead wire for taking out an output from each light detecting element on the support base, and furthermore, to connect a lead wire on a circuit board for processing output data, etc. Attaching work or connecting work with a connector is required, which increases the number of complicated steps and makes assembly work by an automatic machine extremely difficult and problematic. Furthermore, this is also a problem because the entire device is enlarged due to the connection of the lead wires.

〔考案の目的〕[Purpose of the invention]

そこで、本考案は上記問題点を解消するために光検出
素子を立体的に配置したり、光検出素子以外の部品実装
があっても装置が大型化せず、しかも自動機械による大
量生産がきわめて容易になる日射センサを提供すること
を目的とするものである。
Therefore, the present invention solves the above-mentioned problems by arranging the photodetectors three-dimensionally, and even if components other than the photodetectors are mounted, the apparatus does not increase in size, and mass production by an automatic machine is extremely difficult. It is an object of the present invention to provide a solar radiation sensor that is easy to use.

〔課題を解決するための手段〕[Means for solving the problem]

上記課題は以下の手段によって解決される。 The above problem is solved by the following means.

すなわち、 配線パターンが形成された基台上に光検出素子を配設
するとともに、該光検出素子の少なくとも受光面を透明
樹脂で覆い、且つ該透明樹脂と前記基台との間に空隙部
を設け、該空隙部に前記光検出素子の出力の温度特性を
補正する出力補正素子を配設したことを特徴とする日射
センサによって課題は解決される。
That is, the photodetector is arranged on the base on which the wiring pattern is formed, at least the light receiving surface of the photodetector is covered with a transparent resin, and a gap is provided between the transparent resin and the base. This problem is solved by a solar radiation sensor, wherein an output correction element for correcting a temperature characteristic of an output of the light detection element is provided in the gap.

〔作用〕[Action]

本考案によれば光検出素子から出力を取り出すための
リード線を接続する必要がなく、さらに出力データの処
理等を行う回路基板上にリード線を結線するために、半
田付け作業もしくはコネクタにより結線作業も必要でな
いので、工程が簡略化され、自動機械による組立作業が
きわめて容易となる。さらに、リード線さえも不要にな
るので日射センサを小型化することができる。
According to the present invention, it is not necessary to connect a lead wire for taking out an output from the photodetector, and furthermore, a soldering work or a connector is used to connect the lead wire on a circuit board for processing output data. Since no operation is required, the process is simplified, and the assembly operation by an automatic machine becomes extremely easy. Further, since even a lead wire is not required, the solar radiation sensor can be downsized.

〔実施例〕〔Example〕

本考案に係る実施例を図面に基づいて詳細に説明す
る。
Embodiments according to the present invention will be described in detail with reference to the drawings.

第1図は、日射センサS(以下単にセンサSともい
う)が車室内のダッシュボードDの上面に筒状のホルダ
3に挿入されて取付けられている様子を示したものであ
る。
FIG. 1 shows a state in which a solar radiation sensor S (hereinafter, also simply referred to as a sensor S) is inserted into and attached to a cylindrical holder 3 on an upper surface of a dashboard D in a vehicle compartment.

センサSは、一体成形された外装カバー1と、これに
連設される底板2とから外形を構成している。外装カバ
ー1は、太陽光を受光する有頂の筒状上体部1aと、回路
基板を収納した箱状下体部1bとから構成されている。筒
状上体部1aは上端が半球となっており、この筒状上体部
1aをホルダ3に挿入し、半球部分だけを外部に露出させ
ている。
The sensor S has an outer shape composed of an integrally formed exterior cover 1 and a bottom plate 2 connected to the exterior cover 1. The exterior cover 1 includes a cylindrical upper body 1a having sunlight and receiving light, and a box-shaped lower body 1b containing a circuit board. The upper end of the cylindrical body 1a is a hemisphere, and this cylindrical body is
1a is inserted into the holder 3, and only the hemispherical portion is exposed to the outside.

ホルダ3の上面にはフランジ3aを形成しており、ダッ
シュボードDの開口部に挿入することによってその周方
向が位置決めされる。すなわち、ホルダ3の側面3bには
不図示の凸部が形成されており、ダッシュボードDの開
口部はホルダ3の外形に合わせて形成されているのでホ
ルダ3は周方向に自由度がない。また、この側面3bには
略L字状嵌合溝が2箇所設けられており、筒状上体部1a
の外周の2箇所に形成された突出部1c,1cがこれに嵌合
することによりセンサSの周方向が位置決めされる。さ
らに、筒状上体部1aの下端に取着され、ダッシュボード
Dの下面とセンサS間で圧縮されたばね4によって、セ
ンサSは下方へ付勢され、ホルダ3とセンサSとは一層
堅固にダシュボードDに対して固定され、車両の振動に
対しても緩衝作用として働く。
A flange 3a is formed on the upper surface of the holder 3, and its circumferential direction is positioned by inserting the flange 3a into the opening of the dashboard D. That is, a convex portion (not shown) is formed on the side surface 3b of the holder 3, and the opening of the dashboard D is formed according to the outer shape of the holder 3, so that the holder 3 has no flexibility in the circumferential direction. Further, two substantially L-shaped fitting grooves are provided on the side surface 3b, and the cylindrical upper body portion 1a is provided.
The protrusions 1c, 1c formed at two locations on the outer periphery of the sensor S are fitted to the protrusions, whereby the circumferential direction of the sensor S is positioned. Further, the sensor S is urged downward by the spring 4 attached to the lower end of the cylindrical upper body 1a and compressed between the lower surface of the dashboard D and the sensor S, so that the holder 3 and the sensor S are more firmly connected. It is fixed to the dash board D, and also acts as a cushioning function against vibration of the vehicle.

図中Wはフロントガラスであり、センサSはガラス越
しに太陽光を受け、後記する光検出素子が起電力を発生
し、この出力によりデータ処理を行う。
In the figure, W is a windshield, a sensor S receives sunlight through the glass, and a photodetector, which will be described later, generates an electromotive force, and performs data processing based on the output.

第2図は、センサSの内部構造を示す一部断面図であ
り、第1図におけるII-II線断面を示したものである。
FIG. 2 is a partial cross-sectional view showing the internal structure of the sensor S, and shows a cross section taken along line II-II in FIG.

外装カバー1には、光検出素子5が実装された立体成
形基板(基台)6、これが接続される回路基板10、さら
に、回路基板10が接続されるコネクタピン11等が収納さ
れている。
The exterior cover 1 houses a three-dimensional molded board (base) 6 on which the photodetector 5 is mounted, a circuit board 10 to which the board is connected, and connector pins 11 to which the circuit board 10 is connected.

外装カバー1は可視光を含む約600nm以下の光を光検
出素子5に到達させないようにし、かつ耐熱性を持たせ
るために、染料を混入したポリカーボネートを射出成形
によって成形している。また、光検出素子5が覆われ、
外部に露出した筒状上体部1aの半球表面は運転者の防眩
性を向上させるために、シボ加工を施し約数十μmの凹
凸を付け、さらに、この表面には入射光の屈折を防止し
光を有効に取り入れる目的と表面の耐擦傷性を向上させ
る(傷がつかないようにさせる)目的で約5〜10μmの
透明のシリコン樹脂等で被覆している。ここで、半球部
の厚みは約1.5mmとなっている。また、入射光の屈折を
抑え、筒状上体部1a内の耐湿性、耐震性を向上させるた
めに、半球内部には透明のシリコン樹脂12を封入し、光
検出素子5の少なくとも受光面を覆うようにしている。
The exterior cover 1 is formed by injection-molding a polycarbonate mixed with a dye in order to prevent light having a wavelength of about 600 nm or less including visible light from reaching the light detecting element 5 and to provide heat resistance. Also, the photodetector 5 is covered,
The hemispherical surface of the cylindrical upper body portion 1a exposed to the outside is subjected to a graining process to give irregularities of about several tens of μm in order to improve the anti-glare property of the driver, and furthermore, this surface is provided with a refraction of incident light. It is covered with a transparent silicon resin or the like of about 5 to 10 μm for the purpose of preventing and effectively taking in light and improving the scratch resistance of the surface (to prevent scratching). Here, the thickness of the hemisphere is about 1.5 mm. Further, in order to suppress the refraction of the incident light and improve the moisture resistance and the seismic resistance in the cylindrical body 1a, a transparent silicon resin 12 is sealed inside the hemisphere, and at least the light receiving surface of the light detecting element 5 is formed. I cover it.

次に、第3図〜第5図を参照しながら立体成形基板6
について説明する。図中F,B,L,R,Tはそれぞれ前,後,
左,右,上方向を示し、F方向に車両のフロントガラ
ス。第3図は立体成形基板6を上から見た図、第4図は
第3図におけるR方向から視た図、第5図は第3図にお
けるF方向から視た図である。
Next, the three-dimensional molded substrate 6 will be described with reference to FIGS.
Will be described. In the figure, F, B, L, R, T are before, after,
Shows left, right, and upward directions, and the windshield of the vehicle in the F direction. 3 is a view of the three-dimensional molded substrate 6 as viewed from above, FIG. 4 is a view as viewed from the R direction in FIG. 3, and FIG. 5 is a view as viewed from the F direction in FIG.

立体成形基板6は半田耐熱性を有する液晶ポリマ(全
芳香族系ポリエステル)を用いて射出成形で一体に成形
し、無電解メッキにより配線パターン7を形成したもの
を用いている。立体成形基板6は光検出素子5を実装す
る略四角柱状の基板頭部6aとサーミスタチップ8等が搭
載された基板胴部6bとこれら各素子の出力を回路基板10
へ導出するための基板足部6cとからなっている。ここ
で、図から明らかなように光検出素子5の出力の温度補
正を行う出力補正素子であるサーミスタチップは、シリ
コン樹脂12と立体成形基板6との間に設けた空隙部に配
設されている。
The three-dimensional molded substrate 6 is formed by integrally molding a liquid crystal polymer (wholly aromatic polyester) having solder heat resistance by injection molding and forming a wiring pattern 7 by electroless plating. The three-dimensional molded substrate 6 has a substantially quadrangular prism-shaped substrate head 6a on which the photodetecting element 5 is mounted, a substrate body 6b on which the thermistor chip 8 and the like are mounted, and outputs of these elements to a circuit board 10
And a board foot 6c for leading out to the outside. Here, as is apparent from the figure, a thermistor chip as an output correction element for correcting the temperature of the output of the light detection element 5 is disposed in a gap provided between the silicon resin 12 and the three-dimensional molded substrate 6. I have.

光検出素子5は約6mm×6mm角、0.4mm厚の単結晶シリ
コン太陽電池を用いており、基板頭部6aの各面、すなわ
ち、底面を除く5面5f,5b,5l,5r,5t(各添字はそれぞれ
方向F,B,L,R,Tに対応する)に実装されている。各光検
出素子5は表面側が−極、裏面側が+極となっており、
出力が取り出せるように、基板頭部6aの各面には不図示
の記録パターンが形成され、基板頭部6a及び胴部6bには
不図示のスルーホールも形成されている。また、サーミ
スタチップ8は各光検出素子5に対し並列に接続される
ように基板胴部において配線されており、各光検出素子
5の出力温度特性を補正する。基板足部6cには先端6dに
まで合計6本の配線パターンが形成されており、そのう
ち5本の7f,7b,7l,7r,7tは各光検出素子の+極の出力用
配線パターンであり、7gはその−極(コモン)の出力用
配線パターンである。先端6dは回路基板10に半田付けさ
れて各素子の出力が回路基板10へ入力されるようになっ
ている。
The photodetecting element 5 is a single crystal silicon solar cell having a size of about 6 mm × 6 mm square and 0.4 mm thick, and each face of the substrate head 6a, that is, five faces 5f, 5b, 5l, 5r, and 5t excluding the bottom face ( Each subscript corresponds to the direction F, B, L, R, T). Each photodetector 5 has a negative pole on the front side and a positive pole on the back side.
A recording pattern (not shown) is formed on each surface of the substrate head 6a so that an output can be taken out, and through holes (not shown) are also formed on the substrate head 6a and the body 6b. The thermistor chip 8 is wired in the body of the substrate so as to be connected in parallel to each of the light detecting elements 5, and corrects the output temperature characteristics of each of the light detecting elements 5. A total of six wiring patterns are formed on the substrate foot 6c up to the tip 6d, and five of the wiring patterns 7f, 7b, 7l, 7r, and 7t are wiring patterns for output of the positive pole of each photodetector. , 7g are the negative (common) output wiring patterns. The tip 6d is soldered to the circuit board 10 so that the output of each element is input to the circuit board 10.

なお、光検出素子5は基板頭部6aにクリーム半田及び
紫外線硬化型接着剤で固定され、熱処理炉で焼成され
る。また、基板胴部6bに形成された凸部6eは外装カバー
1の内側に形成された不図示の凹部に嵌合し、外装カバ
ー1に対して立体成形基板6を位置決めするようにして
いる。また、基板頭部6aはやや傾いているが、これはダ
ッシュボードの傾きに合わせており、光検出素子5tが水
平となるように傾きを設定している。
The photodetector 5 is fixed to the substrate head 6a with cream solder and an ultraviolet curable adhesive, and is fired in a heat treatment furnace. Further, the convex portion 6e formed on the substrate body 6b is fitted into a concave portion (not shown) formed inside the exterior cover 1 so as to position the three-dimensional molded substrate 6 with respect to the exterior cover 1. Although the substrate head 6a is slightly inclined, this is matched with the inclination of the dashboard, and the inclination is set so that the photodetector 5t is horizontal.

回路基板10はガラスエポキシ樹脂の両面基板であり、
コネクタピン11はリン青銅/Cu,Snの2層メッキとなって
おり、コネクタピン11が回路基板10に直に実装され、ポ
リカーボネートの底板12で外装カバー2内に収納される
ことによってレセプタクルコネクタを形成する。
The circuit board 10 is a glass epoxy resin double-sided board,
The connector pin 11 is formed by two-layer plating of phosphor bronze / Cu, Sn. The connector pin 11 is directly mounted on the circuit board 10 and is housed in the outer cover 2 by the bottom plate 12 of polycarbonate, so that the receptacle connector is formed. Form.

以上のように日射センサが構成されることにより、日
射量、日射方向のデータが付図示の空調制御装置へシリ
アルデータとして伝送され、この情報をもとに送風温度
を調節し、かつ車室内に設けられた各々の吹出口ごとに
風量を制御することができる。また、上記日射センサさ
例えば観測用機器に用いてもよく、車両用に限定されな
い。
With the configuration of the solar radiation sensor as described above, the amount of solar radiation and the direction of the solar radiation are transmitted as serial data to the air-conditioning control device shown in the drawings, the blast temperature is adjusted based on this information, and The air volume can be controlled for each of the provided outlets. Further, the solar radiation sensor may be used for an observation device, for example, and is not limited to a vehicle.

〔考案の効果〕[Effect of the invention]

以上述べたように、本考案の日射センサによれば、光
検出素子から出力を取り出すためのリード線が不要とな
り、リード線を結線するための半田付け作業やコネクタ
による結線作業も不要となるので、製造工程が簡略化さ
れ、自動機械等による組立て作業をきわめて容易かつ迅
速に行うことが可能となる上、小型の日射センサを提供
できる。
As described above, according to the solar radiation sensor of the present invention, the lead wire for extracting the output from the light detection element is not required, and the soldering work for connecting the lead wire and the connection work using the connector are also unnecessary. In addition, the manufacturing process is simplified, the assembling operation using an automatic machine or the like can be performed extremely easily and quickly, and a small solar radiation sensor can be provided.

さらに、基台と透明樹脂との間に設けた空隙部に、サ
ーミスタ等の光検出素子の出力の温度補正を行う出力補
正素子を配設することにより、小型で且つ精度の高い非
常に優れた日射センサを提供することができる。
Further, by providing an output correction element for correcting the temperature of the output of the light detection element such as a thermistor in a gap provided between the base and the transparent resin, a very excellent small-size and high-precision is obtained. An insolation sensor can be provided.

【図面の簡単な説明】[Brief description of the drawings]

第1図〜第5図は、本考案に係る一実施例を示す図であ
り、第1図は日射センサをダッシュボードに取り付けた
様子を示す一部断面図、第2図は日射センサの第1図に
おけるII-II線一部断面図、第3図は立体成形基板の頭
部側から視た図、第4図は第3図におけるR方向から視
た図、第5図は第3図におけるF方向から視た図であ
る。 第6図は従来の日射センサを示す斜視図である。 1……外装カバー、3……ホルダ、4……ばね、5……
光検出素子、6……立体成形基板、10……回路基板、D
……ダッシュボード、S……日射センサ。
1 to 5 are views showing one embodiment according to the present invention. FIG. 1 is a partial sectional view showing a state where a solar radiation sensor is attached to a dashboard, and FIG. 1 is a partial sectional view taken along the line II-II in FIG. 1, FIG. 3 is a view from the head side of the three-dimensional molded substrate, FIG. 4 is a view from the R direction in FIG. 3, and FIG. It is the figure seen from the F direction in. FIG. 6 is a perspective view showing a conventional solar radiation sensor. 1 ... exterior cover, 3 ... holder, 4 ... spring, 5 ...
Photodetector element, 6: three-dimensional molded board, 10: circuit board, D
...... Dashboard, S ... Insolation sensor.

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 実開 昭62−114387(JP,U) 特表 平4−506111(JP,A) ──────────────────────────────────────────────────続 き Continuation of the front page (56) References Japanese Utility Model Showa Sho 62-1114387 (JP, U) Tokuhyo Hei 4-506111 (JP, A)

Claims (1)

(57)【実用新案登録請求の範囲】(57) [Scope of request for utility model registration] 【請求項1】配線パターンが形成された基台上に光検出
素子を配設するとともに、該光検出素子の少なくとも受
光面を透明樹脂で覆い、且つ該透明樹脂と前記基台との
間に空隙部を設け、該空隙部に前記光検出素子の出力の
温度特性を補正する出力補正素子を配設したことを特徴
とする日射センサ。
1. A photodetector is provided on a base on which a wiring pattern is formed, at least a light receiving surface of the photodetector is covered with a transparent resin, and between the transparent resin and the base. An insolation sensor comprising: a gap; and an output correction element for correcting a temperature characteristic of an output of the photodetector in the gap.
JP1990016472U 1990-02-21 1990-02-21 Solar radiation sensor Expired - Fee Related JP2552028Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990016472U JP2552028Y2 (en) 1990-02-21 1990-02-21 Solar radiation sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990016472U JP2552028Y2 (en) 1990-02-21 1990-02-21 Solar radiation sensor

Publications (2)

Publication Number Publication Date
JPH03109083U JPH03109083U (en) 1991-11-08
JP2552028Y2 true JP2552028Y2 (en) 1997-10-27

Family

ID=31519737

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990016472U Expired - Fee Related JP2552028Y2 (en) 1990-02-21 1990-02-21 Solar radiation sensor

Country Status (1)

Country Link
JP (1) JP2552028Y2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005162177A (en) * 2003-12-05 2005-06-23 Asmo Co Ltd Sun visor device for vehicle
JP2007093235A (en) * 2005-09-27 2007-04-12 Kansai Electric Power Co Inc:The Stereoscopic pyranometer

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0541425Y2 (en) * 1986-01-10 1993-10-20
JPS63134568U (en) * 1987-02-26 1988-09-02
JPH01312891A (en) * 1988-06-10 1989-12-18 Matsushita Electric Works Ltd Manufacture of stereo molding printed circuit board

Also Published As

Publication number Publication date
JPH03109083U (en) 1991-11-08

Similar Documents

Publication Publication Date Title
AU2017392558B2 (en) Camera module and mobile terminal
JPS63176A (en) Composite type photosensor
JP6968884B2 (en) Array camera modules with different altitudes, circuit board assemblies and their manufacturing methods, and electronic devices
CN109698894A (en) Photosensory assembly and camera module based on metallic support
CN101859786B (en) Image sensor module
CN108363159A (en) One camera lens and camera module and its manufacturing method
CN206807579U (en) Split type array camera module
US20050161581A1 (en) Photodetector
US20030146998A1 (en) Small-size imaging apparatus, in particular photographic appliance or camera
CN209859155U (en) Fingerprint identification device and electronic equipment
JP2002204400A (en) Imaging element module with lens
CN109104509B (en) Time-of-flight subassembly and electronic equipment
CN209345253U (en) Illuminant module
JP2552028Y2 (en) Solar radiation sensor
US8785858B2 (en) Solar sensor for the detection of the direction of incidence and the intensity of solar radiation
KR102447477B1 (en) Camera module
CN108270949B (en) Split type array camera module and manufacturing method thereof
KR20200137690A (en) Camera module
JP2544715Y2 (en) Sunlight sensor
JP3166216B2 (en) Solid-state imaging device with on-chip lens and method of manufacturing the same
CN110661935A (en) Lens module
US20040211890A1 (en) Positional encoder assembly
CN212163451U (en) Lens, camera module and terminal
CN100544009C (en) Locate accurate image chip encapsulating structure
TW202244555A (en) Non-reflow type sensor lens

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees