CN209345253U - Illuminant module - Google Patents
Illuminant module Download PDFInfo
- Publication number
- CN209345253U CN209345253U CN201920096757.3U CN201920096757U CN209345253U CN 209345253 U CN209345253 U CN 209345253U CN 201920096757 U CN201920096757 U CN 201920096757U CN 209345253 U CN209345253 U CN 209345253U
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- Prior art keywords
- plastic parts
- illuminant module
- transparent panel
- substrate
- photosensitive element
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Abstract
A kind of illuminant module is may be disposed in an electronic device, and to receive a light of the camera lens in electronic device, illuminant module includes: a base assembly, a photosensitive element, one first plastic parts and a transparent panel.Base assembly includes a substrate, and it includes the ontology of metal material that substrate, which has one,.Photosensitive element is set on substrate and the ontology of adjacent substrates.First plastic parts connects base assembly and to protect photosensitive element.Transparent panel is set on the first plastic parts.When illuminant module is received from the light for passing through camera lens, light is across transparent panel to photosensitive element.
Description
Technical field
This disclosure relates to a kind of illuminant module, in particular to a kind of illuminant module with a transparent panel and photosensitive element.
Background technique
With the development of science and technology, many electronic devices (such as tablet computer or smart mobile phone) are equipped with lens module now
And have the function of taking a picture or making video recording, even being configured with bimirror head module, bring people's visual enjoyment abundant.When user makes
When with the electronic device for being furnished with lens module, the situation that might have shaking occurs, so that shadow captured by lens module
It is fuzzy as generating.However, requirement of the people for image quality is increasingly increased, therefore the shockproof function of lens module is also increasingly heavy
It wants.
In addition, the photosensitive element in lens module, due to there is a large amount of heat of meeting to generate when actuation, and the sense that pixel is higher
Heat caused by optical element is also higher, so that the temperature of entire lens module rapidly rises, so may cause module can not
Normal operation is even damaged.And people also pursue miniaturization, the electronic product that intended volume is smaller, more frivolous, to obtain now
It obtains therefore how richer usage experience designs more good product, is an important topic.
Utility model content
Embodiments herein provides a kind of illuminant module, is that may be disposed in an electronic device, to receive across electricity
One light of the camera lens in sub-device, illuminant module include: a base assembly, a photosensitive element, one first plastic parts and one
Transparent panel.Base assembly includes a substrate, and it includes the ontology of metal material that substrate, which has one,.Photosensitive element is set on substrate
And the ontology of adjacent substrates.First plastic parts connects base assembly and to protect photosensitive element.Transparent panel is located at the first plastic cement
On part.When illuminant module is received from the light for passing through camera lens, light is across transparent panel to photosensitive element.
In an embodiment, aforementioned illuminant module further includes a heat-conducting glue, is set between substrate and photosensitive element.Substrate
Component also includes one first insulating layer, a line layer and a second insulating layer, wherein the first insulating layer is set to substrate and route
Layer between, line layer is set between the first insulating layer and second insulating layer, second insulating layer exposed line layer at least one
Electric connection point, electric connection point are electrically connected photosensitive element.First insulating layer and second insulating layer respectively have an opening, and lead
Hot glue is set in these openings, and passes through these contact photosensitive elements that are open.
In an embodiment, aforementioned first plastic parts has at least one perforative through-hole, and the first plastic parts has a square
Shape structure, through-hole are located at the one side wall of rectangular configuration and through the side walls.Through-hole has an exterior open cell and an open interior, exterior open cell
Compared with open interior far from photosensitive element, and exterior open cell compared with open interior close to a surface reference face of substrate.
In an embodiment, aforementioned illuminant module further includes one second plastic parts, and wherein transparent panel is located at the first plastic parts
Between the second plastic parts, and by the first plastic parts and the second plastic parts institute sandwiched.Illuminant module further includes a lead assemblies, even
Photosensitive element and base assembly are connect, the first plastic parts coats lead assemblies.In an embodiment, the first plastic parts and base assembly
An accommodation space is formed, and photosensitive element and lead assemblies are located in accommodation space.Illuminant module further includes one second plastic parts,
It connects and is set on the outside of the first plastic parts, the second plastic parts carries transparent panel, and wherein lead assemblies are set to the first plastic parts
Outside, and coated and do not contacted with the first plastic parts by the second plastic parts.In an embodiment, aforementioned illuminant module further includes
One second plastic parts is connected and is set on the inside of the first plastic parts, and the second plastic parts carries transparent panel, and wherein lead assemblies are by the
Two plastic parts are coated and are not contacted with the first plastic parts.
In an embodiment, aforementioned illuminant module further includes a weld assembly, connection photosensitive element and base assembly, and from
The direction of light incidence is observed, and weld assembly is overlapped in photosensitive element.Illuminant module further includes one second plastic parts, is set to
On one plastic parts, wherein transparent panel is located on the first plastic parts and the second plastic parts, and is set on the second plastic parts and not
It is contacted with the first plastic parts.
In an embodiment, aforesaid base plate also includes a route submount, and wherein route submount have a wears groove, substrate
Ontology be set in wears groove.Ontology and route subbase all have metal material, and the metal that ontology and route submount have
Material is not identical.In an embodiment, photosensitive element is set in wears groove and is surrounded by route submount, and substrate this
Body covers wears groove.
In an embodiment, aforementioned illuminant module further includes a shaking assembly, is set on the first plastic parts and to drive
Dynamic transparent panel, wherein shaking assembly is at least partly Chong Die with photosensitive element from the direction of light incidence.Shaking assembly includes
At least two vibration components, for one first vibration component and one second vibration component, the two is set on the first plastic parts and is used in combination
To drive transparent panel, wherein the first vibration component driving transparent panel is moved in a first direction, the second vibration component driving is transparent
Plate is moved in a second direction, and first direction is different from second direction.Illuminant module further includes multiple transparent panels, along light
Incident direction is arranged, and shaking assembly driving is further away from one of photosensitive element transparent panel.Illuminant module further includes
One captures part, is set to the outside of the first plastic parts and adjacent to transparent panel, will be on transparent panel by shaking assembly to capture
Shake the dust to get off.
Detailed description of the invention
Fig. 1 is the illuminant module for the embodiment for indicating the application and the schematic diagram of optical drive mechanism collocation.
Fig. 2 is the explosive view for indicating the optical drive mechanism in Fig. 1.
Fig. 3 is the explosive view for indicating the illuminant module in Fig. 1.
Fig. 4 A~Fig. 4 G is the process flow chart for indicating illuminant module.
Fig. 5 is indicated in Fig. 4 G along the cross-sectional view of line segment 5-5.
Fig. 6 A is the schematic diagram for indicating the illuminant module of another embodiment of the application.
Fig. 6 B is indicated in Fig. 6 A along the cross-sectional view of line segment 6B-6B.
Fig. 7 A is the schematic diagram for indicating the illuminant module of another embodiment of the application.
Fig. 7 B is indicated in Fig. 7 A along the cross-sectional view of line segment 7B-7B.
Fig. 8 A is the schematic diagram for indicating the illuminant module of another embodiment of the application.
Fig. 8 B is indicated in Fig. 8 A along the cross-sectional view of line segment 8B-8B.
Fig. 9 is the schematic diagram for indicating the illuminant module of another embodiment of the application.
Figure 10 A is the schematic diagram for indicating the illuminant module of another embodiment of the application.
Figure 10 B is indicated in Figure 10 A along the cross-sectional view of line segment 10B-10B.
Figure 11 is the schematic diagram for indicating the illuminant module of another embodiment of the application.
Figure 12 A is the schematic diagram for indicating the illuminant module of another embodiment of the application.
Figure 12 B is indicated in Figure 12 A along the cross-sectional view of line segment 12B-12B.
Figure 13 A is the schematic diagram for indicating the illuminant module of another embodiment of the application.
Figure 13 B is indicated in Figure 13 A along the cross-sectional view of line segment 13B-13B.
Figure 14 A is the schematic diagram for indicating the illuminant module of another embodiment of the application.
Figure 14 B is indicated in Figure 14 A along the cross-sectional view of line segment 14B-14B.
Figure 15 is the schematic diagram for indicating the illuminant module of another embodiment of the application.
Description of symbols:
1~8,100,200,300~illuminant module；
10~~substrate；
101~ontology；
102~route submount；
1021~wears groove；
20~the first insulating layers；
201~opening；
30~line layer；
40~second insulating layer；
401~opening；
50~heat-conducting glue；
60~lead assemblies；
60 '~weld assembly；
70~the first plastic parts；
80,85~transparent panel；
90~the second plastic parts；
900~optical drive mechanism；
901~pedestal；
902~frame；
903~load-bearing part；
B~capture part；
C1~coil；
C2~plate coil；
D1~direction；
E~elastomer；
G~base assembly；
H~shell；
I~connector；
M~magnetic element；
MC~electromagnetic drive component；
N~shaking assembly；
N1, N2~first shake component, the second vibration component；
O~light incident direction (or optical axis)；
Q~through-hole；
Q1~exterior open cell；
Q2~open interior；
R~spring assembly；
R1, R2~upper reed plate, lower reed；
S~elastic parts；
SP~accommodation space；
5-5,6B-6B, 7B-7B, 8B-8B, 10B-10B, 12B-12B, 13B-13B, 14B-14B~line segment.
Specific embodiment
Illustrate the optical drive mechanism of embodiments herein below.However, can will readily appreciate that embodiments herein mentions
It may be implemented in wide variety of specific background for many suitable concept of the invention.Disclosed specific embodiment is used only for
It is bright that the application is used with ad hoc approach, not to limit to scope of the present application.
Unless otherwise defined, belonging to whole term (including technology and scientific words) as used herein has and discloses with this piece
The normally understood identical connotation of general those skilled in the art institute.It is appreciated that these terms, such as determines in usually used dictionary
The term of justice, should be interpreted to one and the consistent meanings of background or context of the relevant technologies and the disclosure, without should be with
One idealization or excessively formal mode are interpreted, unless especially definition herein.
An optical drive mechanism 900 referring to Fig. 1, illuminant module 1 that Fig. 1 is the embodiment for indicating the application is arranged in pairs or groups
Schematic diagram.Illuminant module 1 is set to 900 lower section of optical drive mechanism, and optical drive mechanism 900 then can be used to drive and carrying one
Optical element (such as camera lens), the two may be disposed at the inside an of electronic device (such as camera, tablet computer or mobile phone).When next
When entering optical drive mechanism 1 from extraneous light (incident light), incident light is passed through along light incident direction O (or optical axis)
The optical element being disposed therein, and to the photosensitive element on illuminant module 1, to obtain image.First illustrate and photosensitive mould below
The structure for the optical drive mechanism 900 that block 1 is arranged in pairs or groups.
Referring to Fig.2, optical drive mechanism 900 includes a pedestal 901, a frame 902, a load-bearing part 903, an electromagnetic drive
Component MC, a spring assembly R, an elastic parts S and a shell H.Shell H is set on pedestal 901 and is formed an accommodating space,
To accommodate aforesaid frame 902, load-bearing part 903, electromagnetic drive component MC, spring assembly R and elastic parts S.Load-bearing part 903 can
To carry an optical element (such as camera lens), frame 902 is then set to outside load-bearing part 903.Electromagnetic drive component MC includes more
A magnetic element M (such as magnet), a coil C1 and a plate coil (plate coil) C2, wherein coil C1, which is set in, to be held
In holder 903, magnetic element M is arranged on frame 902 and is arranged around load-bearing part 30 and towards coil C1, and plate coil C2
It is arranged on pedestal 901.Spring assembly R includes a upper reed plate R1 and reed R2 once, is movably connected with load-bearing part 903 and frame
902, so that load-bearing part 903 can be relative to 902 activity of frame.
It, can be with magnetism member when applying driving signal (such as driving current) to coil C1 by an external power supply (not shown)
Magnetic force is generated between part M, to drive load-bearing part 903 mobile relative to frame 902, to reach the mesh of optical focusing or sway compensating
's.In addition, it is initial that upper and lower reed R1, R2 can allow 903 opposing frame 902 of load-bearing part to be maintained at one before applying driving signal
Position.Electromagnetic drive component MC in the present embodiment is moving-coil type, then can be moving-magnetic type in other embodiments.
There are four strip elastomers for aforementioned flexible component S tool, are located at four corners of pedestal 901, and connect pedestal 901
With frame 902, make frame 902 can be relative to 901 activity of pedestal.Aforementioned plate coil C2 can be corresponded to each other with magnetic element M, such as
It can be made to generate magnetic force and then drive load-bearing part 903 between magnetic element M by applying driving signal with aforementioned coil C1
Mode magnetic force can be generated between magnetic element M, and then drive carrying by applying driving signal to plate coil C2
Part 903 (with optical element therein is located at), frame 902 are mobile (such as being displaced on X/Y plane), with reach migration with
And shockproof effect.In other embodiments, an elastomer is also can be used and guide mechanism appropriate of arranging in pairs or groups in elastic parts S
The elastomer of (such as sliding rail) or other quantity (such as two or three).
Aforementioned pedestal 901 can be equipped with a magnetic field sensing element, to sense the changes of magnetic field of magnetic element M.Specifically,
Aforementioned magnetic field sensing element can be a Hall effect detectors (Hall Effect Sensor), and magnetic element M then can be for one forever
Long magnet, Hall effect detectors can whereby may be used by detecting the changes of magnetic field of permanent magnet with judging the position of permanent magnet
Detection load-bearing part 903 generates the positional shift of opposite base 901 with the optical element being located therein because of vibration.In another implementation
In example, other kinds of sensing element, such as magnetic resistance inductor (Magnetoresistive is also can be used in magnetic field sensing element
Sensor, MRS) or optical sensor (Optical Sensor), to sense load-bearing part 903, frame 902 and pedestal 901
Relative position.
The application provides the illuminant module of several embodiments, such as following illuminant module 1~8,100,200,300, can be out of the ordinary
It arranges in pairs or groups with aforementioned optical driving mechanism 900 and constitutes a photographing module.Will be described below aforementioned illuminant module 1~8,100,200,
300 detailed construction.
Embodiment 1
Referring to Fig. 3, illuminant module 1 can be used to receive the optical element (such as camera lens) across optical drive mechanism 900
Light comprising a board unit G (includes a substrate 10, one first insulating layer 20, a line layer 30 and a second insulating layer
40), a heat-conducting glue 50, a photosensitive element IM, a lead assemblies 60, one first plastic parts 70, a transparent panel 80 and one second modeling
Glue part 90.Wherein, an ontology 101 of substrate 10 includes metal material, and the first insulating layer 20 is to be set to substrate 10 and line layer
Between 30, and line layer 30 is set between the first insulating layer 20 and second insulating layer 40.First insulating layer 20 can be used to obstruct
Line layer 30 and the substrate 10 of (Z axis) below conduct, and avoid route that short circuit occurs, and second insulating layer 40 then can be used to prevent
Other circuits within the organization or the circuit board assemblies for being positioned above (Z axis) conduct with line layer 30 and short circuit occur and asks
Topic.
It is equipped with aforementioned heat-conducting glue 50 on the substrate 10, may be, for example, a heat-conducting resin, specifically, heat-conducting glue 50 is arranged
It is connect in the opening 201,401 of the first insulating layer 20 and second insulating layer 40, and through opening 201,401 with photosensitive element IM
Touching, and lower section is the ontology 101 for contacting substrate 10, in this way, which photosensitive element IM can be carried out by heat-conducting glue 50, substrate 10
Heat dissipation further promotes the radiating efficiency of illuminant module 1.
Lead assemblies 60 have multiple leads, are arranged around photosensitive element IM, and be electrically connected photosensitive element IM with by the
The multiple electric connection points for the line layer 30 that two insulating layers 40 are exposed, and the first plastic parts 70 be cladding lead assemblies 60 with
It protects.Second plastic parts 90 be transparent panel 80 to be fixed on the first plastic parts 70 and can protect to transparent panel 80,
Middle transparent panel 80 is can be for infrared ray filter plate (infrared filter) or low pass filters (low-pass filter), can
To stop unnecessary temperature or infrared ray.First, second plastic parts 70,90 all has hollow structure, when from the external world
Light passes through the camera lens in optical drive mechanism 900, and when to illuminant module 1, light is sequentially across the transparent of illuminant module 1
Plate 80 and the photosensitive element IM that arrives.In addition, a connection piece I be set on base assembly G in, be electrically connected line layer 30 it is sudden and violent
The electric connection point of dew can be used as the use of the element outside connection illuminant module 1.
Embodiments herein contacts it with photosensitive element IM by the way that heat-conducting glue 50 is arranged, and can help entire illuminant module
1 radiates and radiating efficiency is substantially improved, and makes whole camera system more stable, and firm by the first, second plastic parts 70,90
With protect electric connection structure and transparent panel 80, can hoisting module reliability.In addition, using the substrate 10 with metal material
As substrate (base), because it has good flatness, except can mention reduce photosensitive element IM be arranged relative to substrate 10 it is askew
Except oblique degree, it can also be conducive to be arranged other electronic components (such as connector I) on substrate 10, simplify whole line whereby
Road, to reach the effect of miniaturization.
Fig. 4 A~Fig. 4 G shows the process flow chart of illuminant module 1.As shown in Figure 4 A, a substrate 10, ontology 101 are provided
With metal material, and a first line layer 20 is covered, wherein there are an openings 201 to expose part for first line layer 20
The ontology 101 of substrate 10.Refering to Fig. 4 B, a line layer 30 covers first line layer 20, and a second insulating layer 40 covers line layer
30, and second insulating layer 40 also has an opening 401, the opening 201 of corresponding aforementioned first line layer 20, to expose part
10 ontology 101 of substrate, and second insulating layer 40 also exposes multiple electrical contacts of line layer 30.It is thermally conductive by one refering to Fig. 4 C
Glue 50 is set on substrate 10, and the opening 201,204 stayed by aforementioned first, second insulating layer 20,40 is to contact substrate
10, and by an optical element IM thermal contact conductance glue 50.
Refering to Fig. 4 D, a lead assemblies 60 are provided to be electrically connected multiple electric connections of optical element IM Yu line layer 30
Point.Refering to Fig. 4 E, one first plastic parts 70 is set to 60 periphery of lead assemblies and is coated with to it and is protected.Refering to Fig. 4 F,
One transparent panel 80 is set on the first plastic parts 70, then one second plastic parts 90 is set to the first plastic parts 70 and transparent panel
On 80 and around transparent panel 80, it is located in transparent panel 80 between first, second plastic parts 70,90 and fixes whereby, and is transparent
The height of plate 80 is lower than the height (Z-direction) of the second plastic parts 90, so can avoid or reduces peripheral cell or part is hit
The situation of transparent panel 80.Refering to Fig. 4 G, a connecting element I is set on substrate 10 and connects with the electric connection point of line layer 30
It connects, to be used as connection outer member/part.
It is worth noting that, the first plastic parts 70 has multiple perforative through-hole Q as shown in the cross-sectional view of Fig. 4 G and Fig. 5,
Four corners of the rectangular configuration of the first plastic parts 70 are located substantially at, or are located on the side wall of rectangular configuration, and pass through
Wear side wall.It can make space and external connection between photosensitive element IM and transparent panel 80 by through-hole Q, so can avoid at other
High thermal high when processing technology and cause the air of 1 internal closed space of illuminant module to deform or destroy because of expansion.This
Outside, it is compared with open interior Q2 far from photosensitive element IM that through-hole Q, which has an exterior open cell Q1 and an open interior Q2, exterior open cell Q1, and external-open
The height and position of hole Q1 is less than the height and position (Z-direction) of open interior Q2, i.e., exterior open cell Q1 is compared with open interior Q2 close to substrate
A 10 surface reference face.As shown in the D1 of direction, i.e. through-hole Q has one towards the inside of illuminant module 1 or towards photosensitive in the direction of through-hole Q
The acclivitous slope of element so can ensure that foreign matter is avoided or substantially lowered in technique enters internal chance.
Embodiment 2
It is the illuminant module 2 for indicating another embodiment of the application refering to Fig. 6 A- Fig. 6 B.The photosensitive mould of the present embodiment
Block 2 and aforementioned illuminant module 1 major difference is that: the first plastic parts 70 is set to the periphery of lead assemblies 60 but does not connect with it
Touching.An accommodation space SP, photosensitive element IM and lead assemblies are formed between first plastic parts 70 and substrate 10 (or base assembly G)
60 are located at SP in accommodation space.Second plastic parts 90 is set on the first plastic parts 70 and carries transparent panel 80, and transparent panel 80
Height be also lower than the second plastic parts 90 (Z-direction), can so reduce transparent panel 80 by the probability hit.
Embodiment 3
It is the illuminant module 3 for indicating another embodiment of the application refering to Fig. 7 A- Fig. 7 B.The photosensitive mould of the present embodiment
Block 3 and aforementioned illuminant module 1 major difference is that: the first plastic parts 70 is set to the inside of lead assemblies 60 and does not connect with it
Touching, and the second plastic parts 90 is set to 70 periphery of the first plastic parts and connects and carry transparent panel 80, because the first plastic parts 70 is set
It is placed in the opening inner side of the second plastic parts 90, the function of the second plastic parts of superior support 90 is made it have, strengthens integrated machine whereby
Tool intensity.The height of transparent panel 80 is lower than the second plastic parts 90 (Z-direction), reduces transparent panel 80 by the probability hit.
Embodiment 4
It is the illuminant module 4 for indicating another embodiment of the application refering to Fig. 8 A- Fig. 8 B.The photosensitive mould of the present embodiment
Block 4 and aforementioned illuminant module 1 major difference is that: the first plastic parts 70 is set to the outside of lead assemblies 60 and does not connect with it
Touching, and the second plastic parts 90 is set to 70 inside of the first plastic parts and carries transparent panel 80, and is coated by the second plastic parts 90
Firmly lead assemblies 60.The second plastic parts 90 is supported by the first plastic parts 70, strengthens overall mechanical strength whereby.In addition, aforementioned
The height of transparent panel 80 is also lower than the second plastic parts 90 (Z-direction), reduces transparent panel 80 by the probability hit.
Embodiment 5
It is the illuminant module 5 for indicating another embodiment of the application refering to Fig. 9.The illuminant module 5 of the present embodiment is with before
State illuminant module 1 major difference is that: illuminant module 5 does not have lead assemblies 60, and including a weld assembly 60 ', tool
There are multiple pads, photosensitive element IM is that line layer 30 is connected to by weld assembly 60 '.From the direction O of light incidence,
Weld assembly 60 ' is overlapped in photosensitive element IM, and passes through 70 clad welded component 60 ' of the first plastic parts and photosensitive element IM, with
Strengthen mechanical structure.Since the illuminant module 5 of the present embodiment does not have any lead, the thickness of integral module can be further reduced
Degree, to reach miniaturization.
Embodiment 6
0A- Figure 10 B refering to fig. 1 is the illuminant module 6 for indicating another embodiment of the application.The present embodiment it is photosensitive
Module 6 and aforementioned illuminant module 1 major difference is that: transparent panel 80 be placed on the second plastic parts 90 and not with the first plastic cement
Part 70 directly contacts, i.e., is located in that the first, second plastic parts 70,90 is different from the transparent panel 80 of embodiment 1, the present embodiment it is saturating
Isotropic disk 80 can be set on the first plastic parts 70 and then be placed on the second plastic parts 90 in the second plastic parts 90, so may be used
Simplify process, and because transparent panel 80 be contacted with the second plastic parts 90 without with the first plastic parts 70, can also lower group
Fill tolerance.
Embodiment 7
Refering to fig. 11, it is the illuminant module 7 for indicating another embodiment of the application.Substrate 10 in the present embodiment can be determined
Justice goes out: an ontology 101 and a route submount 102, and route submount 102 have a wears groove 1021, and ontology 101 is to be set to wear
In slot 1021.The ontology 101 of the present embodiment is to can be used for radiating photosensitive element IM, and route submount 102 then can be used on it
Laying-out.And there is the part for corresponding to photosensitive element IM in 102 part of route submount (in the part for having overlapping in Z-direction)
It is electrical independence.Due to there is wears groove 1021, so that the area corresponding with photosensitive element IM of route submount 102 is reduced, so only
The flatness that these corresponding areas in part need to be controlled, that is, can avoid or be greatly reduced photosensitive element IM inclining relative to substrate 10
Oblique degree, to simplify process i.e. hoisting module reliability.In addition, the thickness for being set to the ontology 101 of wears groove 1021 can be small
In the thickness of route submount 102.In addition, both ontology 101 and route submount 102 may include the metal of unlike material, lift
For example, ontology 101 includes the tool higher metal of thermal coefficient, such as aluminium copper, and route submount 102 include to add
The easy metal of work, such as copper.In another embodiment, aforementioned route submount 102 then can be general plastic circuit plate, i.e.,
Circuit board made of nonmetallic.
Embodiment 8
2A- Figure 12 B refering to fig. 1 is the illuminant module 8 for indicating another embodiment of the application.With the sense in embodiment 7
The difference of optical module 7 is that photosensitive element IM is surrounded by route submount 102, i.e. photosensitive element IM is contained in wears groove
In 1021, and the ontology 101 for covering all the wears groove 1021 of circuit submount 102 is connected to by heat-conducting glue 50.Such one
Come, the integral thickness (Z axis) that can reduce illuminant module 8 is set in wears groove 1021 by photosensitive element IM, and can also from Figure 12 A
See, 101 area of ontology is greater than 10 ontology 101 of substrate in Figure 11 of embodiment 7, this facilitates improving radiating effect.
Embodiment 9
3A- Figure 13 B refering to fig. 1 is the illuminant module 100 for indicating another embodiment of the application.Illuminant module 100 is also
Including a shaking assembly N, it can be an actuator, be set on the second plastic parts 90, to drive or shake transparent panel 80, and
From light incident direction O, shaking assembly N is at least partly Chong Die with photosensitive element IM.Due in process or environment close
Be and may cause foreign matter and be attached on transparent panel 80, by shaking assembly N (such as its can be electrically connected be set to electronics dress
A vibration motor in setting), so that transparent panel 80 is generated vibration to remove foreign matter, to promote shooting quality.In addition, in transparent panel
It is equipped with an elastomer E below 80, connects transparent panel 80 and the second plastic parts 90, can be used to firm and protects transparent when shaking
Plate 80.
Embodiment 10
4A- Figure 14 B refering to fig. 1 is the illuminant module 200 for indicating another embodiment of the application.Illuminant module 10 with
The difference of illuminant module 9 in Figure 13 is, shaking assembly N includes multiple (the present embodiment is two) vibration component N1, N2, two
Person is set on the second plastic parts 90, and to drive transparent panel 80, and from light incident direction O, the two is all at least partly
It is Chong Die with photosensitive element IM, wherein the direction of motion of vibration component N1, N2 driving transparent panel 80 is not identical.For example, it shakes
Component N1 is to drive transparent panel 80 to shake (first direction) in X axis, and shake component N2 and transparent panel 80 is then driven to shake in Y-axis
The effect of removal foreign matter can be so substantially improved in dynamic (second direction).In addition, being captured in the outside of the first plastic parts 70 setting one
Part B, adjacent substrates 10 and transparent panel 80, to collect the dust or foreign matter that fall after transparent panel 80 shakes.
Embodiment 11
Refering to fig. 15, it is the sectional view for indicating the illuminant module 300 of another embodiment of the application.Illuminant module 11 with
The difference of illuminant module 100 in Figure 13 is that illuminant module includes multiple transparent panels 80,85, sets along radiation direction O arrangement
It sets, wherein transparent panel 85 is set on the first plastic parts 70, and transparent panel 80 is then set on the second plastic parts 90.In this implementation
In example, transparent panel 85 is and the completely obscured transparent panel 85 of transparent panel 80 between transparent panel 80 and photosensitive element IM.Transparent panel
85 are fixed on the first plastic parts 70, and transparent panel 80 can still be shaken by shaking assembly N, i.e., driving is further away from photosensitive element
The transparent panel 80 of IM, thus, it is only necessary to shake outermost transparent panel 80, foreign matter or dust can be removed.
In conclusion the embodiment of the present application provides a kind of illuminant module, it is that may be disposed in an electronic device, to connect
A light of the camera lens in electronic device is received, illuminant module includes: a base assembly, a photosensitive element, one first modeling
Glue part and a transparent panel.Base assembly includes a substrate, and it includes the ontology of metal material that substrate, which has one,.Photosensitive element setting
In on substrate and the ontology of adjacent substrates.First plastic parts connects base assembly and to protect photosensitive element.Transparent panel is located at
On first plastic parts.When illuminant module is received from the light for passing through camera lens, light is across transparent panel to photosensitive element.
The embodiment of the present application at least has the advantages that following one of or technical effect, makes itself and sense by the way that heat-conducting glue is arranged
Optical element contact, and by the substrate of tool metal material, the radiating efficiency of illuminant module can be promoted, and pass through the first, second modeling
Glue part is firm and protects electric connection structure and transparent panel, can hoisting module reliability.In addition, using having metal material
Substrate is as substrate, because it has good flatness, reduces the crooked degree that is arranged relative to substrate of photosensitive element except that can mention
Except, it can also be conducive to be arranged other electronic components on substrate, simplify whole route, whereby to reach the effect of miniaturization.
Ordinal number in this specification and claim, such as " first ", " second " etc., there is no suitable each other
Precedence relationship in sequence is only used for mark and distinguishes two different elements with same name.
The above embodiments enable person of ordinary skill in the field through the above description with the narration of enough details
Implement device disclosed in the present application, and it will be appreciated that in the design and range for not departing from the application, when can do
A little variation and retouching, therefore the protection scope of the application is subject to view as defined in claim.
Claims (21)
1. a kind of illuminant module, which is characterized in that the illuminant module includes: to receive the light across a camera lens
One base assembly includes a substrate, and it includes the ontology of metal material that the substrate, which has one,；
One photosensitive element is set to the ontology on the base assembly and adjacent to the substrate；
One first plastic parts connects the base assembly and to protect the photosensitive element；And
One transparent panel is located on first plastic parts；
Wherein when the illuminant module is received from the light for passing through the camera lens, which passes through the transparent panel to the photosensitive member
Part.
2. illuminant module as described in claim 1, which is characterized in that further include a heat-conducting glue, be set to the substrate and the sense
Between optical element.
3. illuminant module as claimed in claim 2, which is characterized in that the base assembly also includes one first insulating layer, a line
Road floor and a second insulating layer, wherein first insulating layer is set between the substrate and the line layer, which is set to
Between first insulating layer and the second insulating layer, at least one electric connection point of the second insulating layer exposure line layer,
The electric connection point is electrically connected the photosensitive element.
4. illuminant module as claimed in claim 3, which is characterized in that first insulating layer and the second insulating layer respectively have one
Opening, and the heat-conducting glue is set in the opening, and contacts the photosensitive element by the opening.
5. illuminant module as described in claim 1, which is characterized in that first plastic parts has at least one perforative through-hole,
And first plastic parts has a rectangular configuration, which is located at the one side wall of the rectangular configuration and through the side wall.
6. illuminant module as claimed in claim 5, which is characterized in that the through-hole has an exterior open cell and an open interior, this is outer
Aperture compared with the open interior far from the photosensitive element, and the exterior open cell compared with the open interior close to a surface reference face of the substrate.
7. illuminant module as described in claim 1, which is characterized in that it further include one second plastic parts, the wherein transparent panel position
Between first plastic parts and second plastic parts, and by first plastic parts and the second plastic parts institute sandwiched.
8. illuminant module as described in claim 1, which is characterized in that further include a lead assemblies, connect the photosensitive element with
The base assembly.
9. illuminant module as claimed in claim 8, which is characterized in that first plastic parts coats the lead assemblies.
10. illuminant module as claimed in claim 8, which is characterized in that first plastic parts and the base assembly form one and hold
Receive space, and the photosensitive element and the lead assemblies are located in the accommodation space.
11. illuminant module as claimed in claim 8, which is characterized in that further include one second plastic parts, connect and be set to this
On the outside of first plastic parts, which carries the transparent panel, and wherein the lead assemblies are set on the outside of first plastic parts,
And it is coated and do not contacted with first plastic parts by second plastic parts.
12. illuminant module as claimed in claim 8, which is characterized in that further include one second plastic parts, connect and be set to this
On the inside of first plastic parts, which carries the transparent panel, wherein the lead assemblies coated by second plastic parts and
It is not contacted with first plastic parts.
13. illuminant module as described in claim 1, which is characterized in that further include a weld assembly, connect the photosensitive element with
The base assembly, and from the direction of light incidence, which is overlapped in the photosensitive element.
14. illuminant module as described in claim 1, which is characterized in that further include one second plastic parts, be set to first modeling
On glue part, wherein the transparent panel is located on first plastic parts and second plastic parts, and is set on second plastic parts
And it is not contacted with first plastic parts.
15. illuminant module as described in claim 1, which is characterized in that the substrate also includes a route submount, wherein the line
Way substrate has a wears groove, and the ontology of the substrate is set in the wears groove.
16. illuminant module as claimed in claim 15, which is characterized in that the ontology and the route subbase all have metal material
Matter, and the metal material that the ontology and the route submount have is not identical.
17. illuminant module as described in claim 1, which is characterized in that the substrate also includes a route submount, wherein the line
Way substrate has a wears groove, which is set in the wears groove and is surrounded by the route submount, and the substrate
The ontology covers the wears groove.
18. illuminant module as described in claim 1, which is characterized in that further include a shaking assembly, be set to first plastic cement
On part and to drive the transparent panel, wherein the shaking assembly is at least partly photosensitive with this from the direction of light incidence
Element overlapping.
19. illuminant module as claimed in claim 18, which is characterized in that the shaking assembly contains at least two vibration component,
For one first vibration component and one second vibration component, the two is set on first plastic parts and to drive the transparent panel；
Wherein the first vibration component drives the transparent panel to move in a first direction, which drives the transparent panel
It is moved in a second direction, and the first direction is different from the second direction.
20. illuminant module as claimed in claim 18, which is characterized in that further include multiple transparent panels, the transparent panel edge should
The incident direction of light is arranged, and the shaking assembly driving further away from the photosensitive element the transparent panel wherein it
One.
21. illuminant module as claimed in claim 18, which is characterized in that further include a capture part, be set to first plastic cement
The outside of part and adjacent to the transparent panel, will shake the dust to get off by the shaking assembly to capture on the transparent panel.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862644869P | 2018-03-19 | 2018-03-19 | |
| US62/644,869 | 2018-03-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209345253U true CN209345253U (en) | 2019-09-03 |
Family
ID=67761772
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920096672.5U Withdrawn - After Issue CN209345252U (en) | 2018-03-19 | 2019-01-21 | Illuminant module |
| CN201910053122.XA Active CN110290292B (en) | 2018-03-19 | 2019-01-21 | Photosensitive module |
| CN201920096757.3U Active CN209345253U (en) | 2018-03-19 | 2019-01-21 | Illuminant module |
| CN201910053477.9A Active CN110290293B (en) | 2018-03-19 | 2019-01-21 | Photosensitive module |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920096672.5U Withdrawn - After Issue CN209345252U (en) | 2018-03-19 | 2019-01-21 | Illuminant module |
| CN201910053122.XA Active CN110290292B (en) | 2018-03-19 | 2019-01-21 | Photosensitive module |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910053477.9A Active CN110290293B (en) | 2018-03-19 | 2019-01-21 | Photosensitive module |
Country Status (1)
| Country | Link |
|---|---|
| CN (4) | CN209345252U (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11561330B2 (en) | 2018-03-19 | 2023-01-24 | Tdk Taiwan Corp. | Photosensitive module having transparent plate and image sensor |
| CN209345252U (en) * | 2018-03-19 | 2019-09-03 | 台湾东电化股份有限公司 | Illuminant module |
| TWI734391B (en) * | 2020-02-27 | 2021-07-21 | 友達光電股份有限公司 | Back light module |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012133059A (en) * | 2010-12-21 | 2012-07-12 | Casio Comput Co Ltd | Mounting structure of optical filter |
| US8791536B2 (en) * | 2011-04-28 | 2014-07-29 | Aptina Imaging Corporation | Stacked sensor packaging structure and method |
| JP5794002B2 (en) * | 2011-07-07 | 2015-10-14 | ソニー株式会社 | Solid-state imaging device, electronic equipment |
| CN203589416U (en) * | 2013-07-12 | 2014-05-07 | 台湾东电化股份有限公司 | Base construction of lens focusing mechanism |
| US9158090B2 (en) * | 2013-12-20 | 2015-10-13 | Apple Inc. | Camera module with artificial muscle actuator and structure for focusing during assembly |
| CN104954638B (en) * | 2014-03-28 | 2019-08-27 | 鸿富锦精密工业（深圳）有限公司 | Camera mould group |
| CN104883484B (en) * | 2015-01-23 | 2018-12-21 | 余姚舜宇智能光学技术有限公司 | Security system, security protection camera module and its manufacturing method |
| CN205050828U (en) * | 2015-10-10 | 2016-02-24 | 苏州晶方半导体科技股份有限公司 | Image sensor chip package structure |
| CN109547680A (en) * | 2016-02-18 | 2019-03-29 | 宁波舜宇光电信息有限公司 | Camera module and its molding circuit board module and manufacturing method based on moulding technology |
| CN209345252U (en) * | 2018-03-19 | 2019-09-03 | 台湾东电化股份有限公司 | Illuminant module |
-
2019
- 2019-01-21 CN CN201920096672.5U patent/CN209345252U/en not_active Withdrawn - After Issue
- 2019-01-21 CN CN201910053122.XA patent/CN110290292B/en active Active
- 2019-01-21 CN CN201920096757.3U patent/CN209345253U/en active Active
- 2019-01-21 CN CN201910053477.9A patent/CN110290293B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN110290292B (en) | 2022-03-15 |
| CN209345252U (en) | 2019-09-03 |
| CN110290293B (en) | 2021-12-31 |
| CN110290292A (en) | 2019-09-27 |
| CN110290293A (en) | 2019-09-27 |
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