CN202841335U

CN202841335U - Anti-shake integrated substrate structure

Info

Publication number: CN202841335U
Application number: CN201220539005.8U
Authority: CN
Inventors: 许之坚; 胡朝彰; 林文章
Original assignee: TDK Taiwan Corp
Current assignee: TDK Taiwan Corp
Priority date: 2012-10-19
Filing date: 2012-10-19
Publication date: 2013-03-27
Anticipated expiration: 2022-10-19

Abstract

The utility model discloses an anti-shake integrated substrate structure. A photographing optical axis is defined. The structure comprises a substrate, a camera module, an anti-shake unit and an image sensing module. The substrate is provided with a framework with a preset thickness and comprises a first surface, a second surface, a first closed circuit and a second closed circuit. The camera module is arranged on the camera optical axis above the substrate. The anti-shake unit is arranged between the camera module and the substrate. The image sensing module is provided with an actuating face and a non-actuating face and arranged on the substrate, and the actuating face is placed on the photographing optical axis and corresponds to the camera module. The anti-shake unit is electrically connected with the first closed circuit and the image sensing module is electrically connected with the second closed circuit. The first closed circuit and the second closed circuit comprise a plurality of first metal leads and second metal leads respectively.

Description

The integrated board structure of anti-hand shake

Technical field

The utility model is relevant for a kind of integrated board structure of anti-hand shake, espespecially a kind of image sensing module and a vibration abatement are arranged on the same substrate jointly, and this substrate provide two different circuit pathways respectively for should image sensing module and this vibration abatement be electrically connected, reduce production costs to reach minimizing spare part number, and further avoid the generation of assembling parts tolerance, but the integrated board structure of a kind of anti-hand shake of Effective Raise product processing procedure efficient and slimming.

Background technology

The progress of the drive information electronic product with rapid changepl. never-ending changes and improvements of science and technology, and various electronic product spare part all strides forward towards compact target.How to make product have more the concept of hommization and multimachine one, the volume-diminished Human Engineering that meets easy to carry more conforms with expectation and demand that consumer's facility is followed the fashion, is one of main subject of development in present electronic product market.And with mobile phone in conjunction with digital camera functionality or even MP3 or notebook computer, or with PAD in conjunction with digital camera functionality, namely be that wherein an important improvement breaks through, how to make its volume more frivolous, manufacture process is more simply assembled more convenient rapid, also will be the main target of industry development.

See also shown in Figure 1ly, Fig. 1 is the generalized section of existing anti-hand shake image sensing structure.Existing anti-hand shake image sensing structure 1, it includes: an image sensing module 11, a substrate 12, a load bearing seat 13, a camera lens module 14, an aseismatic mechanism 15, a circuit board 16 and many wires 17.Wherein, this image sensing module 11 is arranged on this substrate 12, this image sensing module 11 is done being electrically connected with this substrate 12 with these many wires 17.Utilize this load bearing seat 13 to cover these image sensing modules 11 and be arranged on this substrate 12, in order to many wires 17 of protecting this image sensing module 11 and being conducted with this substrate 12.This vibration abatement 15 is arranged at the upper of this circuit board 16 and between this camera lens module 14 and this circuit board 16, further this camera lens module 14 is fixed in this circuit board 16 tops by this vibration abatement 15, and that these circuit board 16 centre are provided with a perforation is 161 corresponding with this camera lens module 14, and this circuit board 16 is arranged on this load bearing seat 13, and because another set perforation 131 of these load bearing seat 13 tops corresponds respectively to this perforation 161 and this image sensing module 11 of these circuit board 16 central authorities, so that this image sensing module 11 is corresponding with this camera lens module 14 via this perforation 131 and this perforation 161 respectively, and by the extraneous image of these camera lens module 14 interior default lens set 141 acquisitions.

Yet, existing anti-hand shake image sensing structure 1, wherein, this image sensing module 11 is located on this substrate 12 and this circuit board 16 respectively with this vibration abatement 15, and this circuit board 16 must be stacked and placed on by this load bearing seat 13 of insulation this place, image sensing module 11 tops, make this camera lens module 14 corresponding with this image sensing module 11 to reach, thus, not only should be anti-the inclination tolerance that produces during with these load bearing seat 13 materials and parts own or combination of easier because this circuit board 16 of hand shake image sensing structure 1, cause the shooting optical axis of image sensing module 11 to produce its imaging deviation, more cause assembling complicated and can't further reach the demand of slimming.

The utility model content

Main purpose of the present utility model, be to provide the integrated board structure of an anti-hand shake, it utilizes a substrate that two groups of different circuit pathways are provided and supplies respectively an image sensing module and a vibration abatement is electrically connected, and simplifies spare part quantity to reach, avoids assembling that tolerance produces and the purpose of thin type.

In order to achieve the above object, the utility model provides a kind of integrated board structure of anti-hand shake, and its definition has a shooting optical axis, and it includes:

One substrate, for having a framework of a thickness, this substrate comprises: a first surface, a second surface, one first circuit pathways and a second circuit path;

One camera lens module is positioned on this shooting optical axis of this substrate top;

One vibration abatement is arranged between this camera lens module and this substrate; And

One image sensing module has a start face and a non-start face, and this image sensing module is arranged on this substrate, and this start face is positioned on this shooting optical axis and is corresponding with this camera lens module;

Wherein, this vibration abatement is electrically connected with this first circuit pathways, and this image sensing module is electrically connected with this second circuit path; This first circuit pathways and this second circuit path comprise respectively a plurality of the first metal lead foots and a plurality of the second metal lead foot.

The integrated board structure of described anti-hand shake, wherein, this substrate center place has a perforation, and this second surface of this substrate is toward recessed rank of the stepped convergent of this first surface direction, this first surface in this substrate is provided with this first circuit pathways, mutually electrically conducts so that a plurality of contacts set on this vibration abatement to be provided; On this second surface of this substrate, be provided with this second circuit path in set these recessed rank, mutually electrically conduct so that a plurality of conducting end set on this image sensing module to be provided; And, this image sensing module is arranged at this start face in these recessed rank of stepped convergent on this second surface of this substrate in the Flip Chip mode, and be covered on this perforation, make this start face be positioned at the upper of this shooting optical axis corresponding with this camera lens module, and a plurality of second metal lead foots of this second circuit path on making a plurality of conducting end of this start face periphery and being positioned at these recessed rank are electrically connected respectively by electric conducting material; This electric conducting material is conducting resinl, scolding tin or connects with the tin ball bonding.

The integrated board structure of described anti-hand shake, wherein, this first surface in this substrate is provided with a groove toward this second surface direction, extends to this first surface in this substrate thickness face and is provided with this first circuit pathways, mutually electrically conducts so that a plurality of contacts set on this vibration abatement to be provided; In this groove of this substrate, be provided with this second circuit path and extend to this first surface and this substrate thickness face, and this second circuit path in this groove provides a plurality of conducting end set on this image sensing module mutually to be electrically connected.

The integrated board structure of described anti-hand shake, wherein, this image sensing module is arranged on the groove bottom of this groove by this non-start face, and it is corresponding with this camera lens module that this start face is positioned on this shooting optical axis, and this second circuit path that makes this image sensing module and embedding invest in this groove is electrically connected mutually.

The integrated board structure of described anti-hand shake, wherein, this image sensing module is electrically connected by many wires respectively by included a plurality of the second metal lead foots of a plurality of conducting end of this start face periphery and this second circuit path in embedding invests this groove.

The integrated board structure of described anti-hand shake, wherein, this image sensing module is electrically connected by electric conducting material respectively with a plurality of second metal lead foots of this second circuit path in embedding invests this groove by a plurality of weld pads set on this non-start face; This electric conducting material is conducting resinl, scolding tin, weld pad or connects with the tin ball bonding.

The integrated board structure of described anti-hand shake, wherein, this substrate is glass substrate, ceramic substrate or printed circuit board (PCB); This camera lens module is zoom lens module or focus lens module; This image sensing module is charge coupled cell or the photo-sensitive cell of complementary metal oxide semiconductors (CMOS).

The integrated board structure of described anti-hand shake wherein, has defined one first axially and one second axial on the plane of this substrate perpendicular to this shooting optical axis, this vibration abatement includes:

At least one piezoelectric element is arranged on this first surface of this substrate, and abuts the bottom surface in this camera lens module; Can order about the camera lens module displacement by piezoelectric element being applied voltage;

One friction plate is incorporated on the bottom surface of this camera lens module, and these friction plate central authorities have a through hole makes this camera lens module corresponding with this image sensing module to provide this shooting optical axis to pass through;

A plurality of flexible members, the four side of this substrate is fixed and laid respectively to this flexible member, be parallel to this shooting optical axis direction with this camera lens module flexible fastening on this substrate; And

At least one position detecting module is arranged on this first surface of this substrate, in order to detect this camera lens module with respect to the displacement deviation amount of this shooting optical axis.

The integrated board structure of described anti-hand shake, wherein, this at least one piezoelectric element comprises two groups of piezoelectric elements, and these two groups of piezoelectric elements are respectively a piezo-electric motor, and relatively be vertical 90 degree and be arranged on this substrate, be responsible for respectively this camera lens module and first axially compensate with this second axial displacement deviation with respect to this of this substrate; These a plurality of flexible members distinctly are the spring that is made of back and forth crooked long and thin metal thin slice in wave shape or elongated metal coil spring.

At least two coils are arranged on this first surface of this substrate;

At least two blocks of magnetites are arranged on the bottom surface of camera lens module, and corresponding with this two coil respectively;

A plurality of messenger wires, fixing and lay respectively at the four side of this substrate, to be parallel to this shooting optical axis direction this camera lens module is fixed in the upper of this substrate; And

At least one position detecting module is arranged on this first surface of this substrate, in order to detect this camera lens module with respect to the displacement deviation amount of this shooting optical axis;

Wherein, two groups of these corresponding coils and this magnetite lay respectively at this first axially and this is second axial upper, and the difference of the direction by input current changes the magnetic line of force direction of this coil, further drives the correction of doing displacement deviation of this camera lens module on this shooting optical axis that is provided with this magnetite.

The beneficial effects of the utility model are: utilize a substrate that two groups of different circuit pathways are provided and supply respectively an image sensing module and a vibration abatement is electrically connected, simplify spare part quantity to reach, avoid assembling that tolerance produces and the purpose of thin type.

Description of drawings

Fig. 1 is the generalized section of existing anti-hand shake image sensing structure;

Fig. 2 is the perspective exploded view of integrated board structure first preferred embodiment of the anti-hand shake of the utility model;

Fig. 3 is the solid combination schematic diagram of integrated board structure first preferred embodiment of the anti-hand shake of the utility model;

Fig. 4 is the generalized section of integrated board structure first preferred embodiment of the anti-hand shake of the utility model;

Fig. 5 is the generalized section of integrated board structure second preferred embodiment of the anti-hand shake of the utility model;

Fig. 6 is the substrate schematic perspective view of integrated board structure second preferred embodiment of the anti-hand shake of the utility model;

Fig. 7 is the generalized section of integrated board structure the 3rd preferred embodiment of the anti-hand shake of the utility model;

Fig. 8 is the generalized section of integrated board structure the 4th preferred embodiment of the anti-hand shake of the utility model;

Fig. 9 is that the vibration abatement of integrated board structure the 4th preferred embodiment of the anti-hand shake of the utility model is overlooked configuration schematic diagram.

The existing anti-hand shake image sensing structure of description of reference numerals: 1-; The 11-image sensing module; The 12-substrate; The 13-load bearing seat; The 131-perforation; The 14-camera lens module; The 141-lens set; The shockproof module of 15-; The 16-circuit board; The 161-perforation; The 17-metal wire; 2, the integrated board structure of 2a, 2b, the anti-hand shake of 2c-; 21,21a-substrate; The 210-perforation; 211,211a-first surface; 212,212a-second surface; 213,213a-the first circuit pathways; 2131,2131a-the first metal lead foot; 214,214a-second circuit path; 2141,2141a-the second metal lead foot; The recessed rank of 215-; The 216a-groove; The 2161a-groove bottom; The 2162a-trough wall surface; The 22-camera lens module; The 2201-bottom surface; The 221-housing; The 222-pedestal; The 2221-accommodation space; The 2222-guiding mechanism; The 223-lens bearing seat; The 224-camera lens; 225-Electromagnetic Drive module; The 2251-magnetic element; The 2252-coil; The 2253-circuit board; 23,23a-vibration abatement; 231,231 '-piezoelectric element; The 232-friction plate; The 2321-through hole; The 233-flexible member; 234,234 ', 234a, 234a '-position detecting module; 235a, 235a '-coil; 236a, 236a '-magnetite; The 237-messenger wire; 24,24a, 24b-image sensing module; 241,241a, 241b-start face; 2411,2411a-conducting end; 242, the non-start face of 242a, 242b-; The 2421b-conducting end; The 4-optical axis of making a video recording; The 5-metal wire; The 6-electric conducting material; 81-first is axial; 82-second is axial.

Embodiment

See also Fig. 2, Fig. 3, shown in Figure 4, Fig. 2 is the perspective exploded view of integrated board structure first preferred embodiment of the anti-hand shake of the utility model.Fig. 3 is the solid combination schematic diagram of integrated board structure first preferred embodiment of the anti-hand shake of the utility model.Fig. 4 is the generalized section of integrated board structure first preferred embodiment of the anti-hand shake of the utility model.

The integrated board structure of the anti-hand shake of the utility model the first preferred embodiment, wherein, the integrated board structure 2 of this anti-hand shake comprises: a substrate 21, a camera lens module 22, a

vibration abatement

23 and 24 common compositions of an image sensing module.This substrate 21 is for having a framework of predetermined thickness, and it comprises: a first surface 211, a second surface 212, first circuit pathways 213 and a second circuit path 214.In addition, this is in utility model one preferred embodiment, this substrate 21 can also be to be made of the stacking institute of a plurality of integrated circuit layer depositions, wherein, each other integrated circuit layer all has a circuit loop respectively, and this circuit loop under the respective layer integrated circuit all can be respectively electrically connects by a plurality of conductive poles are mutual, and this second circuit path 214 that further makes this first circuit pathways 213 that is positioned at this first surface 211 and be positioned at this second surface 212 is electrically connected mutually.This image sensing module 24 comprises: a start face 241 and a non-start face 242.24 definition of this camera lens module 22 and this image sensing module have a shooting optical axis 4 the image light of an external object is assembled and to be imaged on this image sensing module 24 to provide.

In the present embodiment, these substrate 21 centre have a perforation 210 passes through with shooting optical axis 4 paths that 24 of this camera lens module 22 and this image sensing modules are provided, and this second surface 212 is toward recessed rank 215 of the stepped convergent of these first surface 211 directions.This first surface 211 in this substrate 21 is provided with this first circuit pathways 213, mutually electrically conducts so that a plurality of contacts set on this vibration abatement 23 to be provided; On this second surface 212 of this substrate 21, be provided with this second circuit path 214 in set these recessed rank 215, mutually electrically conduct so that this image sensing module 24 to be provided.This substrate 21 can be glass substrate, ceramic substrate or printed circuit board (PCB) (PCB, Printed circuit board) one of them.

In the present embodiment, this first, second circuit pathways 213,214 comprises respectively a plurality of first and second

metal lead foot

2131,2141 formations, and this first, second circuit pathways 213,214 each other this a plurality of first and second

metal lead foot

2131,2141 be a planar strip and roughly be the radiation kenel around also respectively embedding invest on this first, second surface 211,212; Wherein, these the first circuit pathways 213 included a plurality of first metal lead foots 2131 are also bent by these substrate 21 outer edge thickness and embedding invests on this first surface 211, with the usefulness as a plurality of contacts that are electrically connected with this vibration abatement 23, the other end that these a plurality of first metal lead foots 2131 are positioned at these substrate 21 outer edge thickness then provides the usefulness of a plurality of contacts of the control circuit electrical connection of controlling this vibration abatement 23.

In addition, 2141 of included a plurality of the second metal lead foots of this second circuit path 214 are bent respectively by this second surface 212 and extend and embedding invests in these recessed rank 215, with the usefulness as a plurality of contacts that are electrically connected with this image sensing wafer 24, these a plurality of second metal lead foots 2141 are positioned at the usefulness that the other end on this second surface 212 then provides a plurality of contacts that are electrically connected with other electronic components.This first, second circuit pathways 213,214 each other this a plurality of first and second

metal lead foot

2131,2141 can form by sheet metal utilization punching press or etched mode, and are made of one of them material of copper, aluminium, alloy or other conductive metallic materials.

Among the utility model one embodiment, in this substrate 21, more can comprise: the driving element circuit of a passive device, a drive IC and a gyroscope (Gyro); Wherein, the driving element circuit of this passive device, drive IC and gyroscope (Gyro) all can by this first or second circuit path 213,214 externally be electrically connected.This substrate 21 is in order to externally electrically to export the better position of the terminal of (output), namely this first, second circuit path 213,214 each other this a plurality of first and second

metal lead foot

2131,2141 terminal the part of the outer edge thickness (substrate side) that is positioned at this substrate 21 or this second surface 212(substrate bottom surface of this substrate 21 of extending to respectively) part makes this substrate 21 be utilized its outer edge thickness (substrate side), or this second surface 212(substrate bottom surface of this substrate 21), or the mode that arranges all respectively of aforementioned both positions as this first, second circuit path 213,214 externally electrically export the better connecting point position of the terminal of (output).Same, these substrate 21 inner included circuit (passive device, drive IC and gyrostatic driving element circuit) also can externally be electrically connected by the better connecting point position that above-mentioned this substrate 21 is externally electrically exported the terminal of (output).For instance, take this second surface 212(substrate bottom surface) as the terminal position of main electrical output (output) as this substrate 21 as example, this the first metal lead foot 2131 can also extend to from the outer edge thickness (substrate side) of this substrate 21 with this second metal lead foot 2141 and be positioned at identical this second surface 212(substrate bottom surface) on, make this second surface 212 have simultaneously the terminal of this first circuit pathways 213 and the 214 external electrically outputs (output) of second circuit path with the contact as external electrical connection.

This camera lens module 22 can be to have comprised focusing or zoom lens of a plurality of lens; In the present embodiment, this camera lens module 22 can be that to drive zoom lens module or the focus lens module that lens move by the electromagnetic actuator device that coil and magnet consist of be good.In preferred embodiment of the present utility model, this camera lens module 22 more includes: a housing 221, a pedestal 222, a lens bearing seat 223, a camera lens 224 and Electromagnetic Drive module 225; Wherein, this camera lens 224 is arranged at this lens bearing seat 223 centre, and is synchronous shift with this lens bearing seat 223.223 of this lens bearing seat are arranged in the accommodation space 2221 in this pedestal 222, make this lens bearing seat 223 be axial motion along this shooting optical axis 4 in this accommodation space 2221 by the guiding mechanisms 2222 in this pedestal 222.Among another embodiment, this guiding mechanism 2222 can be a reed type CD-ROM drive motor, can be electrically connected with this first circuit pathways 213 or this second circuit path 214 of this substrate 21 by this flexible member 233 by this reed.

This Electromagnetic Drive module 225 more comprises: a magnetic element 2251, a coil 2252 and a circuit board 2253.This magnetic element 2251 is arranged on this lens bearing seat 223, and corresponding with set this coil 2252 on this pedestal 222.This circuit board 2253 cards invest an outside of this pedestal 222, and this circuit board 2253 is covered and are fixed between this housing 221 and this pedestal 222 by this housing 221.This circuit board 2253 can be electrically connected with this first circuit pathways 213 or this second circuit path 214 of this substrate 21 by this flexible member 233.

In preferred embodiment of the present utility model, this magnetic element 2251 is respectively two groups and mutually corresponding with this coil 2252.In the utility model embodiment, this magnetic element 2251 can be a permanent magnet.In other words, produce different magnetic directions by this circuit board 2253 for the scheduled current that this coil 2252 imposes different directions, make corresponding magnetic element 2251 be subject to the impact in magnetic field and be pushed, reach and make this lens bearing seat 223 change and in the moving forward and backward of the direction of this shooting optical axis 4 in this accommodation space 2221 internal cause current fields, reach further that this camera lens 224 that makes this lens bearing seat 223 interior institutes combination is focused or the purpose of zoom.

And this image sensing module 24 is used for capturing extraneous image, charge coupled device (charge coupled device normally, CCD) or complementary metal oxide semiconductor (complementary metal oxide semiconductor, CMOS) Image sensor apparatus.Image on the photo-sensitive cell of image sensing module 24 via this shooting optical axis 4 by the image light of this camera lens module 22 with external object, and by this image sensing module 24 image light is converted to can be for the digital image data of computer interpretation, and digital camera or the function of digital code camera can be provided.Because this described this camera lens module 22 all can directly be selected in prior art and non-technical characterictic of the present utility model with this image sensing module 24, so do not give unnecessary details its formation.

In the present embodiment, be arranged on the centre of this camera lens module 22 and this substrate 21 in vibration abatement 23 of the present utility model, namely with this camera lens module 22 by these vibration abatement 23 suspentions and corresponding to the top of this image sensing module 24, make this camera lens module 22 be positioned on these shooting optical axis 4 paths, when disengaging is made a video recording optical axis 4 path with this best as sensing module 24 so that this camera lens module 22 is subject to the external force vibrations, the margin of error that this camera lens module 22 can be offset by vibration abatement 23 of the present utility model compensates displacement, reaches to return on normal these better shooting optical axis 4 paths.

This vibration abatement 23 includes: at least one piezoelectric element 231,231 ', one friction plate 232, a plurality of flexible member 233 and at least one position detecting module 234,234 '.This first surface 211 in this substrate 21 has namely vertically defined one first axial 81 and one second axial 82 on the plane of this shooting optical axis 4, this first axial 81 second axial 82 is vertical 90 degree mutually with this, and in this first surface 211 of this substrate 21 provide respectively be positioned at this first axial 81 with these two groups of piezoelectric elements 231 of second axial 82,231 ' with this first surface 211 on included these a plurality of first metal lead foots 2131 of this first circuit pathways 213 be electrically connected by an electric conducting material 6; In other words, two groups of piezoelectric elements 231,231 ' relatively are vertical 90 degree and are arranged on this substrate 21, and further two groups of piezoelectric elements 231,231 ' top are abutted respectively 232, two groups of piezoelectric elements 231 of friction plate set on a bottom surface 2201 of this camera lens module 22,231 ' by with this friction plate 232 so that drive this camera lens module 22 in this first axial 81 with this second axial 82 enterprising line displacement.This electric conducting material 6 can be conducting resinl, scolding tin, weld pad or connect one of them with the tin ball bonding.

That is to say, this first axial 81 with this second axial 82 that is representing respectively the X-axis of this substrate 21 on this first surface 211 and two of Y-axis mutually be vertical axially; In addition, this shooting optical axis 4 respectively perpendicular to this first axial 81 with this second axial 82 Z-axis direction that namely consists of the vertical third dimension of above-mentioned and X-axis, Y-axis.In the utility model embodiment, these two groups of piezoelectric elements (Pizeo member) 231,231 ' are respectively a piezo-electric motor, and the better frequency of utilization of this piezo-electric motor can be 120KHz or other frequencies, in order to be responsible for this camera lens module 22 with respect to this substrate 21 this second axial 82 with the compensation of this displacement deviation of first axial 81.

In the utility model embodiment, when this piezoelectric element 231 is applied voltage, utilize the characteristic of piezo-electric motor can order about camera lens module 22 and carry out along this first axial 81(X axial) linear displacement; In like manner as can be known, when another piezoelectric element 231 ' is applied voltage, then can order about this camera lens module 22 carries out along this second axial 82(Y axial) linear displacement, and then reach axial with this shooting optical axis 4(Z) perpendicular horizontal plane adjusts the function of the position on X-axis and Y direction of this camera lens module 22.

These first surface 211 dual-side predetermined position in this substrate 21 provide respectively a position detecting module 234,234 '.In the utility model embodiment, this position detecting module 234,234 ' can be for example Hall element of reluctance type sensor.This position detecting module 234,234 ' is electrically connected by this electric conducting material 6 and this first circuit pathways 213 included a plurality of the first metal lead foots 2131 respectively, and by this position detecting module 234,234 ' calculates the displacement deviation amount of these camera lens module 22 these shooting optical axises 4 of skew, namely this camera lens module 22 this first axial 81 and this second axial 82 the skew this shooting optical axis 4 degree, and the offset that will revise displacement passes through this piezoelectric element 231 on this substrate 21,231 ' is revised side-play amount for this camera lens module 22 of institute's combination on this friction plate 232 of contact, and this camera lens module 22 and this image sensing module 24 are replied on the path of same better this shooting optical axis 4.

This friction plate 232 is arranged at this bottom surface 2201 of this camera lens module 22 and corresponding with this first surface 211 of this substrate 21, and elasticity is attached on this piezoelectric element 231,231 ' the top, increasing the frictional force between this camera lens module 22 and this piezoelectric element 231,231 ', and be provided with a through hole 2321 to provide this shooting optical axis 4 to pass through in these friction plate 232 centre.In the utility model embodiment, these a plurality of flexible members 233 distinctly be the spring that consisted of by back and forth crooked long and thin metal thin slice in wave shape or elongated metal coil spring one of them.And these a plurality of flexible members 233 more are evenly distributed and are fixed in the nearly corner of four side on every side of this substrate 21 with four groups of springs, utilize this flexible member 233(spring) upper and lower two ends be individually fixed in the mode of this substrate 21 and this camera lens module 22, further these camera lens module 22 elasticity are suspended to these first surface 211 tops of this substrate 21; In other words, by a plurality of flexible member 233(springs) around and be fixed in around this substrate 21, and with the Z-axis direction that namely is parallel to this shooting optical axis 4 perpendicular to these substrate 21 directions with these camera lens module 22 flexible fastenings on this substrate 21, not only can make this camera lens module 22 not can because of vibrations certainly this substrate 21 come off, and more can provide one with this camera lens module 22 towards the drop-down pretension of substrate 21, make the friction plate 232 and this piezoelectric element 231 fixed on the bottom surface 2201 of this camera lens module 22, can possess an amount of frictional force between 231 ' to make this piezoelectric element 231,231 ' can drive this camera lens module 22 moves horizontally.

In the utility model the first preferred embodiment, this start face 241 of this image sensing module 24 is arranged in the mode of Flip Chip in these recessed rank 215 of stepped convergent on this second surface 212 of this substrate 21, and be covered in the upper of this perforation 210, this start face 241 of this image sensing module 24 is positioned on this shooting optical axis 4 corresponding with this camera lens module 22, and makes a plurality of conducting end 2411 of this start face 241 peripheries and be positioned at these recessed rank 215 embedded these attached second circuit paths 214 and be electrically connected.

That is to say, these recessed rank 215 form a suitable drop height with this second surface 212, when making this image sensing wafer 24 that this start face 241 is embedded in this recessed rank 215 with Flip Chip, this start face 241 of this image sensing wafer 24 is embedded on these recessed rank 215, more that a plurality of conducting end 2411 of this start face 241 peripheries of this image sensing wafer 24 and this second circuit path 214 that is positioned at these recessed rank 215 is included a plurality of the second metal lead foots 2141 are electrically connected by this electric conducting material 6 respectively, the risk of short circuit when reducing bridge joint.

In other preferred embodiments of the utility model of the following stated, because of the element of major part the same as or similar to previous embodiment, therefore identical element and will repeating no more below the structure, and identical element will directly give identical title and numbering, and for similar element then give same names but former numbering increase in addition afterwards an English alphabet as a means of the difference and it will not go into details, close chat first bright.

See also Fig. 5, shown in Figure 6, Fig. 5 is the generalized section of integrated board structure second preferred embodiment of the anti-hand shake of the utility model.Fig. 6 is the substrate schematic perspective view of integrated board structure second preferred embodiment of the anti-hand shake of the utility model.The integrated board structure difference of the second preferred embodiment of the integrated board structure of the anti-hand shake of the utility model and the anti-hand shake of above-mentioned Fig. 2 the first preferred embodiment is, the integrated board structure 2a that should prevent the hand shake is provided with a groove 216a in this first surface 211a of this substrate 21a toward this second surface 212a direction, extend to this first surface 211a in this substrate 21a thickness face and be provided with this first circuit pathways 213a, and included a plurality of the first metal lead foot 2131a of this first circuit pathways 213a are in order to provide this piezoelectric element 231 of this vibration abatement 23,231 ' upper set a plurality of contacts electrically conduct mutually.

Groove bottom 2161a in this groove 216a of this substrate 21a is provided with included a plurality of second one of them end of metal lead foot 2141a of this second circuit path 214a, and the other end of these a plurality of the second metal lead foot 2141a via the trough wall surface 2162a of this groove 216a extend to this first surface 211a and further the bending embedding be attached on the thickness face of this substrate 21a.The non-start face 242a of this of this image sensing module 24a is arranged at this groove bottom 2161a in this groove 216a, and be positioned on the zone of this groove bottom 2161a that is not provided with this second circuit path 214a, and then this start face 241a of this image sensing module 24a is positioned on this shooting optical axis 4, and the upper set a plurality of conducting end 2411a of this start face 241a of this image sensing module 24a mode of breaing a metal wire 5 out of the ordinary is electrically connected mutually with upper embedded attached a plurality of the second metal lead foot 2141a of this groove bottom 2161a respectively.

As shown in Figure 6, be positioned at included a plurality of the first metal lead foot 2131a of this first circuit pathways 213a on this substrate 21a respectively with included a plurality of the second metal lead foot 2141a of this second circuit path 214a that is positioned at this groove 216a in first, second axial 81,82 consist of and be staggered mode on this first surface 211a of X-Y axle and be spaced so that when being positioned at this a plurality of second metal lead foot 2141a of this groove 216a and up extending to this first surface 211a not can with this first surface 211a embedded attached should a plurality of first metal lead foot 2131a generations the phenomenon of mutual overlapping or interference.What namely present on this first surface 211a of this substrate 21a and this substrate 21a thickness face is that these a plurality of second metal lead foot 2141a of representing these a plurality of first metal lead foot 2131a of this first circuit pathways 213a and representing this second circuit path 214a distinctly are radial being spaced in the staggered attached mode of embedding and form, and the usefulness of a plurality of contacts that are electrically connected with other electronic components is provided respectively.

See also shown in Figure 7ly, Fig. 7 is the generalized section of integrated board structure the 3rd preferred embodiment of the anti-hand shake of the utility model.The integrated board structure difference of the 3rd preferred embodiment of the integrated board structure of the anti-hand shake of the utility model and the anti-hand shake of above-mentioned Fig. 5 the second preferred embodiment is, should prevent that this non-start face 242b of this image sensing module 24b of the integrated board structure 2b that hand shakes was arranged in this groove 216a, and be positioned on this groove bottom 2161a that is provided with this second circuit path 214a, and then this start face 241b of this image sensing module 24b is positioned on this shooting optical axis 4.

That is to say, being provided with a plurality of conducting end 2421b with this electric conducting material 6(conducting resinl, scolding tin or tin ball in this non-start face 242b of this image sensing module 24b) mode of using welding mutually is electrically connected with included a plurality of the second metal lead foot 2141a of this second circuit path 214a of this groove bottom 2161a in embedding invests this groove 216a respectively, is able to carry out to external world image capture by the electrical control of these a plurality of the second metal lead foot 2141a and by this camera lens module 22 so that be positioned at set this image sensing module 24b of this groove 216a.

See also Fig. 8, shown in Figure 9, Fig. 8 is the generalized section of integrated board structure the 4th preferred embodiment of the anti-hand shake of the utility model.Fig. 9 is that the vibration abatement of integrated board structure the 4th preferred embodiment of the anti-hand shake of the utility model is overlooked configuration schematic diagram.The 4th preferred embodiment of the integrated board structure of the anti-hand shake of the utility model is with the integrated board structure difference of the anti-hand shake of above-mentioned Fig. 5 the second preferred embodiment, and this vibration abatement 23a of the integrated board structure 2c that this anti-hand shakes more includes: at least two coil 235a, 235a ', at least two magnetite 236a, 236a ' and a plurality of messenger wire 237.In the utility model the 4th preferred embodiment, the four side of this substrate 21a is fixed and laid respectively to these a plurality of messenger wires 237, to be parallel to these shooting optical axis 4 directions this camera lens module 22 is fixed in the upper of this substrate 21a, and these a plurality of messenger wires 237 are respectively and do not have elasticity and a vertical messenger wire 237 and consist of.This two coil 235a, 235a ' are arranged at respectively on this first surface 211a of this substrate 21a, and by this electric conducting material 6(conducting resinl, scolding tin or tin ball) mode of using welding respectively with this first surface 211a on included a plurality of the first metal lead foot 2131a of this first circuit pathways 213a mutually be electrically connected.

This two magnetite 236a, 236a ' are arranged at respectively on the bottom surface 2201 of camera lens module, and corresponding with this two coil 235a, 235a ' respectively.Two groups of corresponding this coil 235a, 235a ' and this magnetite 236a, 236a ' lay respectively at this first axial 81 and this is on second axial 82, and the difference of the direction by input current changes the magnetic line of force direction of this coil 235a, 235a ', further drives the correction of doing displacement deviation of this camera lens module 22 on this shooting optical axis 4 that is provided with this magnetite 236a, 236a '.In this first surface 211a of this substrate 21a and lay respectively at the other predetermined position of this two coil 235a, 235a ' one position detecting module 234a, 234a ' are set, this position detecting module 234a, 234a ' are electrically connected by included a plurality of the first metal lead foot 2131a of this electric conducting material 6 and this first circuit pathways 213a respectively, and by this position detecting module 234a, 234a ' calculate this camera lens module 22 in this first axial 81 and the displacement of this this shooting optical axis 4 that is offset on second axial 82.That is to say, change the direction of input current by this first metal lead foot 2131a, change thus the direction of these a plurality of coil 235a, the 235a ' magnetic line of force, further drive the correction of doing displacement deviation of this camera lens module 22 on this shooting optical axis 4 that is provided with this a plurality of magnetite 236a, 236a '.

In sum, the integrated board structure of a kind of anti-hand shake of the utility model, definition has a shooting optical axis 4, and wherein, the integrated board structure 2 of this anti-hand shake includes: a substrate 21, a camera lens module 22, a vibration abatement 23 and an image sensing module 24.This substrate 21 has a framework of predetermined thickness, and it comprises: a first surface 211, a second surface 212, one first circuit pathways 213 and a second circuit path 214.This first, second circuit pathways 213,214 comprises respectively a plurality of first and second

metal lead foot

2131,2141 formations.

This camera lens module 22 is positioned on this shooting optical axis 4 of these substrate 21 tops.This vibration abatement 23 is arranged between this camera lens module 22 and this substrate 21, namely with this camera lens module 22 by these vibration abatement 23 suspentions and corresponding to the top of this image sensing module 24, make this camera lens module 22 be positioned on these shooting optical axis 4 paths.This image sensing module 24 includes a start face 241 and a non-start face 242, and this image sensing module 24 is to be arranged on this substrate 21, and this start face 241 is positioned at the upper of this shooting optical axis 4 and corresponding with this camera lens module 22.This vibration abatement 23 is electrically connected with this first circuit pathways 213, and this image sensing module 24 then is electrically connected with this second circuit path 214.

On second surface 212 by this substrate 21 and the first surface 211 two different the first circuit pathways 213 and second circuit paths 214 are set respectively, to provide respectively this vibration abatement 23 and this image sensing module 24 to be electrically connected, with the spare part number that reaches minimizing and reduce production costs, and further avoid spare part out of the ordinary to cause assembling the phenomenon that this shooting optical axis 4 of rear generation is offset because of the tolerance of itself, but Effective Raise product processing procedure efficiency and precision, and then reach the integrated board structure 2 of a kind of anti-hand shake of whole slimming.

But only above-described embodiment shall not be applied to restriction range of application of the present utility model, and protection range of the present utility model should be take claim content of the present utility model institute definition techniques spirit and the impartial scope that included of changing thereof as main.The equalization of namely generally doing according to the utility model claim changes and modifies, and will not lose main idea of the present utility model place, does not also break away from spirit and scope of the present utility model, and the former capital should be considered as further status of implementation of the present utility model.

Claims

1. the integrated board structure of an anti-hand shake is characterized in that, definition has a shooting optical axis, and it includes:

2. the integrated board structure of anti-hand shake as claimed in claim 1, it is characterized in that, this substrate center place has a perforation, and this second surface of this substrate is toward recessed rank of the stepped convergent of this first surface direction, this first surface in this substrate is provided with this first circuit pathways, mutually electrically conducts so that a plurality of contacts set on this vibration abatement to be provided; On this second surface of this substrate, be provided with this second circuit path in set these recessed rank, mutually electrically conduct so that a plurality of conducting end set on this image sensing module to be provided; And, this image sensing module is arranged at this start face in these recessed rank of stepped convergent on this second surface of this substrate in the Flip Chip mode, and be covered on this perforation, make this start face be positioned at the upper of this shooting optical axis corresponding with this camera lens module, and a plurality of second metal lead foots of this second circuit path on making a plurality of conducting end of this start face periphery and being positioned at these recessed rank are electrically connected respectively by electric conducting material; This electric conducting material is conducting resinl, scolding tin or connects with the tin ball bonding.

3. the integrated board structure of anti-hand shake as claimed in claim 1, it is characterized in that, this first surface in this substrate is provided with a groove toward this second surface direction, extend to this first surface in this substrate thickness face and be provided with this first circuit pathways, mutually electrically conduct so that a plurality of contacts set on this vibration abatement to be provided; In this groove of this substrate, be provided with this second circuit path and extend to this first surface and this substrate thickness face, and this second circuit path in this groove provides a plurality of conducting end set on this image sensing module mutually to be electrically connected.

4. the integrated board structure of anti-hand shake as claimed in claim 3, it is characterized in that, this image sensing module is arranged on the groove bottom of this groove by this non-start face, and it is corresponding with this camera lens module that this start face is positioned on this shooting optical axis, and this second circuit path that makes this image sensing module and embedding invest in this groove is electrically connected mutually.

5. the integrated board structure of anti-hand shake as claimed in claim 4, it is characterized in that, this image sensing module is electrically connected by many wires respectively by included a plurality of the second metal lead foots of a plurality of conducting end of this start face periphery and this second circuit path in embedding invests this groove.

6. the integrated board structure of anti-hand shake as claimed in claim 4, it is characterized in that, this image sensing module is electrically connected by electric conducting material respectively with a plurality of second metal lead foots of this second circuit path in embedding invests this groove by a plurality of weld pads set on this non-start face; This electric conducting material is conducting resinl, scolding tin, weld pad or connects with the tin ball bonding.

7. the integrated board structure of anti-hand shake as claimed in claim 1 is characterized in that, this substrate is glass substrate, ceramic substrate or printed circuit board (PCB); This camera lens module is zoom lens module or focus lens module; This image sensing module is charge coupled cell or the photo-sensitive cell of complementary metal oxide semiconductors (CMOS).

8. the integrated board structure of anti-hand shake as claimed in claim 1 is characterized in that, has defined one first axially on the plane of this substrate perpendicular to this shooting optical axis and one second axial, and this vibration abatement includes:

9. the integrated board structure of anti-hand shake as claimed in claim 8, it is characterized in that, this at least one piezoelectric element comprises two groups of piezoelectric elements, and these two groups of piezoelectric elements are respectively a piezo-electric motor, and relatively be vertical 90 degree and be arranged on this substrate, be responsible for respectively this camera lens module and first axially compensate with this second axial displacement deviation with respect to this of this substrate; These a plurality of flexible members distinctly are the spring that is made of back and forth crooked long and thin metal thin slice in wave shape or elongated metal coil spring.

10. the integrated board structure of anti-hand shake as claimed in claim 1 is characterized in that, has defined one first axially on the plane of this substrate perpendicular to this shooting optical axis and one second axial, and this vibration abatement includes:

At least two coils are arranged on this first surface of this substrate;