CN107664895A - Lens driving apparatus - Google Patents

Lens driving apparatus Download PDF

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Publication number
CN107664895A
CN107664895A CN201710570216.5A CN201710570216A CN107664895A CN 107664895 A CN107664895 A CN 107664895A CN 201710570216 A CN201710570216 A CN 201710570216A CN 107664895 A CN107664895 A CN 107664895A
Authority
CN
China
Prior art keywords
pedestal
circuit board
lens driving
drive
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201710570216.5A
Other languages
Chinese (zh)
Other versions
CN107664895B (en
Inventor
胡朝彰
郭侲圻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Taiwan Corp
Original Assignee
TDK Taiwan Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US201662368843P priority Critical
Priority to US62/368,843 priority
Application filed by TDK Taiwan Corp filed Critical TDK Taiwan Corp
Priority claimed from US15/658,869 external-priority patent/US10365500B2/en
Publication of CN107664895A publication Critical patent/CN107664895A/en
Application granted granted Critical
Publication of CN107664895B publication Critical patent/CN107664895B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/04Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
    • G02B7/08Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B5/00Adjustment of optical system relative to image or object surface other than for focusing
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/64Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
    • G02B27/646Imaging systems using optical elements for stabilisation of the lateral and angular position of the image compensating for small deviations, e.g. due to vibration or shake
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/04Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
    • G02B7/09Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B13/00Viewfinders; Focusing aids for cameras; Means for focusing for cameras; Autofocus systems for cameras
    • G03B13/32Means for focusing
    • G03B13/34Power focusing
    • G03B13/36Autofocus systems
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B29/00Combinations of cameras, projectors or photographic printing apparatus with non-photographic non-optical apparatus, e.g. clocks or weapons; Cameras having the shape of other objects
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B3/00Focusing arrangements of general interest for cameras, projectors or printers
    • G03B3/10Power-operated focusing
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B5/00Adjustment of optical system relative to image or object surface other than for focusing
    • G03B5/02Lateral adjustment of lens
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B5/00Adjustment of optical system relative to image or object surface other than for focusing
    • G03B5/04Vertical adjustment of lens; Rising fronts
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00Details of television systems
    • H04N5/222Studio circuitry; Studio devices; Studio equipment ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
    • H04N5/225Television cameras ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, camcorders, webcams, camera modules specially adapted for being embedded in other devices, e.g. mobile phones, computers or vehicles
    • H04N5/232Devices for controlling television cameras, e.g. remote control ; Control of cameras comprising an electronic image sensor
    • H04N5/23248Devices for controlling television cameras, e.g. remote control ; Control of cameras comprising an electronic image sensor for stable pick-up of the scene in spite of camera body vibration
    • H04N5/23264Vibration or motion blur correction
    • H04N5/2328Vibration or motion blur correction performed by mechanical compensation
    • H04N5/23287Vibration or motion blur correction performed by mechanical compensation by shifting the lens/sensor position
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
    • G02B13/00Optical objectives specially designed for the purposes specified below
    • G02B13/001Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B2205/00Adjustment of optical system relative to image or object surface other than for focusing
    • G03B2205/0007Movement of one or more optical elements for control of motion blur
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B2205/00Adjustment of optical system relative to image or object surface other than for focusing
    • G03B2205/0007Movement of one or more optical elements for control of motion blur
    • G03B2205/0015Movement of one or more optical elements for control of motion blur by displacing one or more optical elements normal to the optical axis
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B2205/00Adjustment of optical system relative to image or object surface other than for focusing
    • G03B2205/0053Driving means for the movement of one or more optical element
    • G03B2205/0076Driving means for the movement of one or more optical element using shape memory alloys
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/144Stacked arrangements of planar printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10121Optical component, e.g. opto-electronic component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces

Abstract

A kind of lens driving apparatus, including pedestal, be arranged at pedestal the first side load bearing seat and the first drive mechanism, be arranged at pedestal the second side relative to the first side the second drive mechanism and the conductive member that is arranged on pedestal.Load bearing seat is carrying camera lens.First drive mechanism is driving load bearing seat to be moved along the optical axis direction of camera lens.Second drive mechanism includes circuit board assemblies and is electrically connected with the memory alloy wire component of circuit board assemblies, and memory alloy wire component is driving pedestal to be moved in the plane perpendicular to optical axis direction.Conductive member is for electrically connecting to the first drive mechanism and the second drive mechanism, and conductive member and circuit board assemblies are connected to an electric connection point, wherein light incident side of the memory alloy wire component compared to electric connection point close to camera lens.

Description

Lens driving apparatus
Technical field
The present invention relates to a kind of lens driving apparatus;More particularly to one kind utilizes memorial alloy (Shape Memory Alloy, SMA) line so that camera lens movement lens driving apparatus.
Background technology
Under the trend of lens driving apparatus miniaturization, many hand-held digital products (handheld device) are for example The all interior function of having photograph or make video recording such as mobile phone or tablet personal computer.The user of requirement increase based on to(for) image quality, tool The lens driving apparatus of standby optical anti-shake (Optical Image Stabilization, OIS) function starts to turn into main flow.
Fig. 1 shows the schematic diagram of optical anti-shake (OIS) mechanism 1000 of an existing lens driving apparatus.Such as institute in figure Show, optical anti-shake mechanism 1000 mainly includes a support member 1001, a movable part 1002 and a plurality of memorial alloy (SMA) Line 1003, wherein memory alloy wire 1003 are configured between support member 1001 and movable part 1002, can pass through driven by power And movable part 1002 is caused to move and control movable part 1002 in support member 1001 relative to support member 1001 Position.Consequently, it is possible to optics rolling can be provided for being arranged on the camera lens module (not shown) of the top of optical anti-shake mechanism 1000 Dynamic compensation.
However, in order to reach the electric connection between aforementioned optical Fang Shouzhen mechanisms 1000 and camera lens module, it is necessary in work The dynamic top of component 1002 forms multiple gooseneck components 1004 (thereon formed with circuit) that the direction towards camera lens module extends, and mirror The pedestal of head module needs to retain the space (groove) for accommodating gooseneck component 1004, and cause the size of camera lens module can increase and The local strength of pedestal can weaken (because the thickness near groove is reduced).In addition, in order to avoid memorial alloy in being operated in mechanism Line 1003 touches gooseneck component 1004 and short circuit or situation about blocking may occur, gooseneck component 1004 also need to be configured to Memory alloy wire 1003 is spaced apart, and the size of optical anti-shake mechanism 1000 can be increased, so as to be unfavorable for mirror The miniaturization of head driving apparatus.
The content of the invention
It is a primary object of the present invention to provide a kind of lens driving apparatus, minimized with further realize.
In view of foregoing existing issue point, the present invention provides a kind of lens driving apparatus, including a pedestal, a load bearing seat, One first drive mechanism, one second drive mechanism and a conductive member.Load bearing seat is arranged at one first side of pedestal, to carry One camera lens.First drive mechanism is arranged at the first side of pedestal, to drive load bearing seat to be moved along an optical axis direction of camera lens. Second drive mechanism is arranged at one second side relative to the first side of pedestal, including a circuit board assemblies and electric connection circuit A memorial alloy (SMA) line component of board component, memory alloy wire component is driving pedestal perpendicular to the optical axis side of camera lens To a plane on move.Conductive member is arranged on pedestal, is for electrically connecting to the first drive mechanism and the second drive mechanism, And conductive member and circuit board assemblies are connected to an electric connection point, wherein memory alloy wire component leans on compared to electric connection point The light incident side of portrait attachment.
According to some embodiments, pedestal has in face of a surface of the second drive mechanism, and the surface is compared to foregoing electricity Light incident side of the property tie point close to camera lens.
According to some embodiments, circuit board assemblies include a first circuit board and a second circuit board, first circuit board are set It is placed between second circuit board and pedestal and connects pedestal.Memory alloy wire component is electrically connected with first circuit board and second circuit Plate, to drive first circuit board to be moved in the plane perpendicular to the optical axis direction of camera lens relative to second circuit board.Wherein, Conductive member forms foregoing electric connection point with first circuit board.
According to some embodiments, first circuit board includes a first substrate and a first line layer, and first line layer is set In on first substrate and formed with a line layer opening.Lens driving apparatus also includes an electrical connection element, in circuit The position of layer opening is electrically connected with conductive member and first line layer.
According to some embodiments, pedestal has a polygon external form, and electrical connection element is positioned proximate in the angle of pedestal Fall.
According to some embodiments, when being watched from an outside of lens driving apparatus, formed with a substrate on first substrate Opening, the foregoing line layer opening of exposure.
According to some embodiments, when being watched along a direction of the optical axis direction perpendicular to camera lens, electrical connection element It is partly overlapping with first substrate.
According to some embodiments, conductive member is formed with an extension, through foregoing line layer opening and base openings.
According to some embodiments, electrical connection element is arranged at first substrate in face of the aforementioned external of lens driving apparatus On one surface.
According to some embodiments, second circuit board includes a second substrate and one second line layer, and the second line layer is set In on second substrate, be electrically connected with foregoing first line layer and extend to the outside of lens driving apparatus.
According to some embodiments, the first drive mechanism includes the corresponding coil and one first magnetic element in position, line Circle is arranged on load bearing seat.Lens driving apparatus also includes a flexible member, is arranged between load bearing seat and pedestal.Wherein, line Circle is electrically connected with aforesaid conductive component via flexible member.
According to some embodiments, lens driving apparatus also includes one second corresponding magnetic element of position and magnetic field sense Component is surveyed, the second magnetic element is arranged on load bearing seat, and sensing magnetic fields component includes a tertiary circuit plate and is arranged at the 3rd electricity A sensing magnetic fields chip on the plate of road.Wherein, coil is electrically connected with tertiary circuit plate via flexible member, then via tertiary circuit Plate is electrically connected with conductive member.
According to some embodiments, lens driving apparatus also includes multiple conductive members, and tertiary circuit plate is electrically connected Multiple conducting terminals, and be configured to surround an opening of pedestal.
According to some embodiments, the first substrate of first circuit board has the positioning piece extended towards the direction of pedestal, and A locating slot on pedestal formed with corresponding to and for engaging keeper.
It is according to the advantages of the present invention:Can provide it is a kind of using memory alloy wire so that camera lens movement Lens driving apparatus, the gooseneck structure for being for electrically connecting to camera lens module and optical anti-shake mechanism in the prior art can be omitted Part, so as to reach the purpose for minimizing lens driving apparatus.
For above and other objects of the present invention, feature and advantage can be become apparent, it is cited below particularly go out preferable implementation Example, and accompanying drawing appended by cooperation, are described in detail below.
Brief description of the drawings
Fig. 1 is the schematic diagram of optical anti-shake (OIS) mechanism of an existing lens driving apparatus.
Fig. 2 is the part explosive view according to a lens driving apparatus of some embodiments of the invention.
Fig. 3 is the explosive view of the optical anti-shake mechanism in Fig. 2.
Upward view after the optical anti-shake mechanism assembling that Fig. 4 is Fig. 3.
Fig. 5 is the explosive view of the camera lens module in Fig. 2.
Sectional view after the camera lens module assembling that Fig. 6 is Fig. 5.
Fig. 7 is the top view of the pedestal of the camera lens module in Fig. 5.
Fig. 8 is the conductive member and optical anti-shake on pedestal in Fig. 5 when being watched from the downside of lens driving apparatus The position relationship schematic diagram of mechanism.
Fig. 9 is the conductive member on pedestal in Fig. 5 when being watched along a direction of the optical axis direction perpendicular to camera lens With the position relationship schematic diagram of optical anti-shake mechanism.
Figure 10 is according to other embodiments of the invention, when being watched from the downside of lens driving apparatus, leading on pedestal Electric components and the position relationship schematic diagram of optical anti-shake mechanism.
Figure 11 is the explosive view according to the camera lens module of other embodiments of the invention.
Figure 12 is the partial sectional view after the camera lens module assembling in Figure 11.
Figure 13 is the top view of the pedestal of the camera lens module in Figure 11.
Figure 14 is the first circuit of the locating slot and optical anti-shake mechanism on the pedestal according to some embodiments of the invention The position relationship schematic diagram of keeper on plate.
Description of reference numerals:
1~lens driving apparatus;
10th, 10 '~camera lens module;
11~framework;
11A~framework perforate;
12~pedestal;
12A~pedestal perforate;
12B~bottom surface;
12C~locating slot;
13~load bearing seat;
13A~through hole;
14~electromagnetic drive mechanism (the first drive mechanism);
15~flexible member;
16~flexible member;
17~sensing magnetic fields component;
17A~circuit board (tertiary circuit plate);
17B~sensing magnetic fields chip;
17C~conducting terminal;
18~cover plate;
20~optical anti-shake mechanism;
21~first circuit board (movable part);
22~second circuit board (support member);
23~memory alloy wire;
30~shell;
210~first substrate;
210A~body;
210B~string arm;
210C~opening portion;
210D~base openings;
210E~keeper;
211~first line layer;
211A~line layer opening;
212~protuberance;
212A~wire connection structure;
220~second substrate;
221~the second line layers;
222~protuberance;
222A~line fixed structure;
1000~optical anti-shake mechanism;
1001~support member;
1002~movable part;
1003~memory alloy wire;
1004~gooseneck component;
A1~circuit board assemblies;
A2~memory alloy wire component;
C~coil;
E~end;
The magnetic element of M1~first;
The magnetic element of M2~second;
O~optical axis, optical axis direction;
P, P1, P2~conductive member;
T~extension;
W~electrical connection element.
Embodiment
Illustrate the lens driving apparatus of the embodiment of the present invention below.Permitted however, can will readily appreciate that the embodiment of the present invention provides More suitable inventive concepts and may be implemented in wide variety of specific background.Disclosed specific embodiment be merely illustrative with Ad hoc approach is not used to limit to the scope of the present invention using the present invention.Protection scope of the present invention is wanted when regarding appended right The scope for asking book to be defined is defined.
Unless otherwise defined, the whole terms (including technology and scientific words) being used below have and this area skill The identical connotation that art personnel are generally understood that.It is appreciated that these terms, such as the use defined in usually used dictionary Language, it should be interpreted to that there is a meaning consistent with the background or context of correlation technique and the disclosure, without should be preferable with one Change or excessively formal mode is understood, unless especially definition herein.
In the following description, alleged orientation " on ", " under ", is intended merely to represent relative position relationship, is not used for The limitation present invention.When addressing one first element and being located on one second element, the first element may be included and the second element is direct Contact or the situation for being separated with one or more other elements.
In addition, in accompanying drawing or specification description, similar or identical part all uses identical symbol.In the accompanying drawings, The shape or thickness of embodiment can expand, to simplify or conveniently indicate.
Please also refer to Fig. 2, a lens driving apparatus 1 according to some embodiments of the invention for example may be disposed at a camera, The inside of the electronic installation such as mobile phone or tablet personal computer, including a camera lens module 10, an optical anti-shake (OIS) mechanism 20 and to House camera lens module 10 and a shell 30 of optical anti-shake mechanism 20.Camera lens module 10 to carry a camera lens (not shown), And camera lens can be driven photosensitive relative to one outside lens driving apparatus 1 along its optical axis direction O (that is, Z-direction in figure) Element (not shown) moves, to reach auto-focusing (Auto-Focus, AF) purpose.Camera lens module 10 also can be for example, by viscous The mode of connecing is fixed on optical anti-shake mechanism 20.Optical anti-shake mechanism 20 is driving camera lens module 10 perpendicular to light Moved in a direction of principal axis O plane (that is, X/Y plane in figure), to provide optics sway compensating, image product can be lifted whereby Matter.
Need to first it be appreciated that, a main purpose of the invention is to provide a kind of lens driving apparatus, can omit existing skill Camera lens module 10 and the gooseneck component of optical anti-shake mechanism 20 are for electrically connecting in art, makes lens driving apparatus so as to reach The effect of miniaturization.First illustrate basic structure and the driving of optical anti-shake mechanism 20 according to some embodiments of the invention below Principle.
As shown in Figure 3 and Figure 4, optical anti-shake mechanism 20 mainly includes a circuit board assemblies A1 and a memorial alloy (SMA) line component A2.Circuit board assemblies A1 includes stacked up and down a first circuit board 21 and a second circuit board 22.Memory is closed Gold thread component A2 includes a plurality of (such as 4) memory alloy wire 23, and its material can include titanium nickel (Ti-Ni) alloy, titanium palladium (Ti- Pd) alloy, titanium ambrose alloy (Ti-Ni-Cu) alloy, titanium nickel palladium (Ti-Ni-Pd) alloy or combinations of the above.The electricity of memory alloy wire 23 Property connection first circuit board 21 and second circuit board 22, and drive signal can be applied to it by an external power source (not shown) (such as electric current) and change its length.For example, when applying drive signal and memory alloy wire 23 is heated up, memorial alloy Line 23 can produce deformation and elongate or shorten;When stopping drive signal, memory alloy wire 23 can then return to script length.
Whereby, by applying appropriate drive signal, it can control the length of memory alloy wire component A2 memory alloy wire 23 Spend and drive first circuit board 21 (movable part) mobile relative to second circuit board 22 (support member).Further, with The movement of first circuit board 21, the camera lens module 10 (Fig. 2) being connected with first circuit board 21 also can be relative to second circuit board 22 It is mobile, and cause lens driving apparatus 1 that there is the function of optical anti-shake and optics sway compensating.
Fig. 3 and Fig. 4 are continued referring to, first circuit board 21 includes a first substrate 210 and a first line layer 211.The One substrate 210 can have a metal material (such as stainless steel), and including a generally rectangular shaped body 210A and from body The string arm 210B of multiple (such as 2) L-shaped of 210A extensions, and string arm 210B is configured to the four of corresponding body 210A Individual side.First line layer 211 is formed on the string arm 210B of first substrate 210, and is extended partially on body 210A. For the purpose electrically isolated, first line layer 211 is coated with an insulating barrier.According to some embodiments, first line layer 211 can be with insert molding (Insert Molding) or three dimensional mold interconnection object (3D Molded Interconnect Device) mode of technology is formed on first substrate 210.
In addition, formed with multiple (such as 2) stair-stepping protuberances 212 in a clinodiagonal of first substrate 210, And each protuberance 212 has multiple (such as 2) wire connection structure 212A.First line layer 211 may extend to protuberance 212 with It is electrically connected with wire connection structure 212A.
Similarly, second circuit board 22 includes a second substrate 220 and one second line layer 221.Second substrate 220 can have There is metal material (such as stainless steel) and be substantially in a rectangle.Second line layer 221 is substantially covered in the upper table of second substrate 220 Face.For the purpose electrically isolated, an insulating barrier (not shown) can be coated with outside the second line layer 221.Second line layer 221 Can also insert molding or three dimensional mold interconnection object technology mode be formed on second substrate 220.
In addition, formed with multiple (such as 2) stair-stepping protuberances 222 in a clinodiagonal of second substrate 220, And each protuberance 222 has multiple (such as 2) line fixed structure 222A.Second line layer 221 may extend to second substrate 220 Protuberance 222 on to be electrically connected with line fixed structure 222A.
As shown in figure 4, after optical anti-shake mechanism 20 assembles, the wire connection structure 212A of first circuit board 21 and second The line fixed structure 222A of circuit board 22 is located at four corners of optical anti-shake mechanism 20 respectively, and in optical anti-shake mechanism A wire connection structure 212A all can be seen in 20 each side and a line fixed structure 222A, each memory alloy wire 23 then electrically connect Wiring connecting structure 212A and line fixed structure 222A.In addition, the first line layer 211 of first circuit board 21 can be for example, by weldering The mode of connecing is electrically connected with the second line layer 221 of second circuit board 22.Although it is not shown, the second line layer 221 may extend to light The outside of Xue Fangshouzhen mechanisms 20 is to be electrically connected with an external power source (not shown).
By the configuration of above-mentioned optical anti-shake mechanism 20 (the second drive mechanism), when to each of memory alloy wire component A2 When memory alloy wire 23 applies appropriate drive signal, memory alloy wire 23 can change its shape (such as elongating or shortening), make Obtain first circuit board 21 and connected camera lens module 10 (Fig. 2) can be relative to second circuit board 22 perpendicular to optical axis direction Moved in an O plane (X/Y plane) (including edge is translated perpendicular to optical axis direction O relative to second circuit board 22, or around Optical axis direction O to be rotated relative to second circuit board 22), to provide optics sway compensating.
Next, besides the structure of bright mirror head module 10 and its electric connection pass between optical anti-shake mechanism 20 System.
As shown in Figure 5 and Figure 6, camera lens module 10 includes a framework 11, a pedestal 12, a load bearing seat 13, an electromagnetic drive Mechanism 14 and multiple flexible members 15,16.
Framework 11 can be combined with each other to house foregoing miscellaneous part/element with pedestal 12.A camera lens in camera lens module 10 (not shown) can carry out the acquisition of shadow to the external world by the framework perforate 11A being formed on framework 11.Shape on pedestal 12 Cheng Youyi pedestal perforate 12A, wherein pedestal perforate 12A and framework perforate 11A are located on the optical axis O of camera lens.Whereby, camera lens module Camera lens in 10 can be with being arranged at a photo-sensitive cell (not shown) of the outside of lens driving apparatus 1 (such as its downside) in optical axis O On focused, and then camera function.
Load bearing seat 13 is arranged at the upside (the first side) of pedestal 12, has to house the pass through aperture 13A of camera lens, wherein Mutual corresponding screwed tooth structure (not shown) can be respectively configured between through hole 13A and camera lens so that camera lens, which can be locked in, to be run through In the 13A of hole.
Electromagnetic drive mechanism 14 (the first drive mechanism) includes a coil C and multiple (such as 4) first magnetic element M1 (such as magnet).Coil C is wound in the outer peripheral face of load bearing seat 13.According to some embodiments, coil C can comply with the shape of load bearing seat 13 Shape and be in quadrangle, hexagon, octagon or other available shapes.First magnetic element M1 of multiple strips is set respectively It is placed on the different madial walls of framework 11, and corresponds to coil C.According to some embodiments, the first magnetic element M1 also can be Triangle, and the corner being respectively arranged between the madial wall of framework 11.
In addition, foregoing load bearing seat 13 and camera lens therein be arranged on flexible member made of elastic material 15,16 (such as Metal spring leaf) between, and the center of framework 11 can be flexibly suspended to by flexible member 15,16.More specifically, carry The top of seat 13 can be connected with flexible member 15, and flexible member 15 is connected with the inwall of framework 11, and the bottom of load bearing seat 13 It can be connected with flexible member 16, and flexible member 16 is connected with the inwall of pedestal 12.
By above-mentioned design, when an external power source (not shown) applies a drive signal (such as electric current) to foregoing coil During C, an electromagnetic actuation force (electromagnetic can be produced by coil C and the first magnetic element M1 magnetic fields Force), to drive load bearing seat 13 and camera lens therein to be moved relative to optical axis direction O (Z-direction) of the framework 11 along camera lens It is dynamic, and then automatic focusing function.Flexible member 15,16 can produce a buffering effect on optical axis direction O, to avoid holding Carry seat 13 and camera lens therein damage.
When camera lens module 10 completes assembling and is connected to optical anti-shake mechanism 20 (please with reference to Fig. 2-Fig. 6, figure 9), optical anti-shake mechanism 20 is located at the downside (the second side) of the pedestal 12 of camera lens module 10, and optical anti-shake mechanism 20 First circuit board 21 is between pedestal 12 and second circuit board 22 and connects pedestal 12.
Further, the coil C of the electromagnetic drive mechanism 14 of foregoing camera lens module 10 can be via flexible member 16 and setting An external power source (not shown) is electrically connected with multiple conductive member P on pedestal 12.More specifically, coil C both ends Multiple conductive members on pedestal 12 can be electrically connected via multiple (such as 2) independent sectors of flexible member 16 in point P.According to some embodiments (referring for example to Fig. 7), can have multiple (such as 4) conductive member P, and two of which on pedestal 12 Multiple independent sectors of conductive member P1 and flexible member 16 are electrically connected with, and another two conductive member P2 then not with flexible member 16 are electrically connected with.Aforesaid conductive component P can have metal material (such as copper), and with insert molding or three dimensional mold interconnection object It is embedded in the mode of technology in pedestal 12.
According to some embodiments, conductive member P can have strip plate body structure (but being not limited), and with around The pedestal opening 12A of pedestal 12 mode configures.In addition, conductive member P surface is adjacent to the bottom surface 12B of pedestal 12, and lead Electric components P only has the end E towards pedestal opening 12A (radially) extensions exposed to the outside of pedestal 12, foregoing to connect The first circuit board 21 of optical anti-shake mechanism 20.
It refer to Fig. 4, Fig. 7, Fig. 8 and Fig. 9, the first line layer on the first circuit board 21 of optical anti-shake mechanism 20 211 can open in the position for being adjacent to a central opening portion 210C for first substrate 210 formed with multiple (such as 2) line layers Mouth 211A is with exposure circuit therein, and line layer opening 211A position correspondence is in the conduction on the pedestal 12 of camera lens module 10 Component P1 end E position (Fig. 8 and Fig. 9).Conductive member P1 end E and the line layer opening of first line layer 211 The circuit exposed in 211A may connect to an electric connection point.
In addition, when from outside (such as downside of an optical anti-shake mechanism 20) viewing of lens driving apparatus 1, first Line layer formed with multiple (such as 2) base openings 210D (Fig. 8), accordingly exposed first line layer 211 on substrate 210 Be open 211A.Base openings 210D can allow an electrical connection element W (such as scolding tin) from the downside of optical anti-shake mechanism 20 Line layer opening 211A position is put on, to be electrically connected with aforesaid conductive component P1 end E and first line layer 211.Again Person, line layer opening 211A can be advantageous to the combination of electrical connection element W and first line layer 211.It should be noted that when along (as shown in Figure 9), electrical connection element W and the part of first substrate 210 during perpendicular to the optical axis direction O of camera lens direction viewing Overlapping.
It is noted that the conductive member P2 not being electrically connected with flexible member 16 on pedestal 12 also can be by electrical Connecting element W (such as scolding tin) and be welded on the first substrate 210 of first circuit board 21, can so improve camera lens module 10 With the bond strength between optical anti-shake mechanism 20.
By above-mentioned design, the electromagnetic drive mechanism 14 (the first drive mechanism) and the anti-hand of optics of camera lens module 10 can reach The electric connection between mechanism 20 (the second drive mechanism) is shaken, and causes lens driving apparatus 1 to possess auto-focusing (AF) and light Learn the function of anti-hand shake (OIS).
It is to be understood that the lens driving apparatus 1 of above-described embodiment eliminates and is for electrically connecting to camera lens in the prior art The gooseneck component of module 10 and optical anti-shake mechanism 20, so as to can reach the effect for minimizing lens driving apparatus.It is brighter For really, because the gooseneck component towards the extension of pedestal 12 of camera lens module 10 need not be set in optical anti-shake mechanism 20, So that need not also retain the space (groove) for accommodating gooseneck component on pedestal 12, and the size of camera lens module 10 can be reduced. Simultaneously as the structural intergrity (structural integrity) of pedestal 12 can be kept, its structure so can be also improved Intensity.
It should be specified, when being watched along a direction of the optical axis direction O perpendicular to camera lens (as shown in Figure 9), Conductive member P1 and circuit board assemblies A1 first circuit board 21 is connected to an electric connection point (equivalent to conductive member P1 in figure End E and electrical connection element W junction position), wherein memory alloy wire component A2 leans on compared to the electric connection point The light incident side (that is, upside of lens driving apparatus 1) of portrait attachment, and pedestal 12 faces a table of optical anti-shake mechanism 20 Face is compared to the electric connection point also close to the light incident side of camera lens.In addition, the electric connection point is located at close to first circuit board 21 central opening portion 210C (or pedestal opening 12A of pedestal 12) position and be away from memory alloy wire component A2 (positions In the outside of first circuit board 21 and pedestal 12), it can also so avoid electric connection point from being contacted with memory alloy wire component A2 And the risk of short circuit occurs.
According to other embodiments (refer to Figure 10), the conductive member P1 on pedestal 12 can be formed with an extension T, court The direction extension of circuit board assemblies A1 first circuit board 21, and the circuit of the first line layer 211 through first circuit board 21 Layer opening 211A (due to angular relationship, not can be appreciated that first line layer 211 and line layer opening 211A in Fig. 10) and substrate Be open 210D.Base openings 210D can allow an electrical connection element W (such as scolding tin) from the downside of optical anti-shake mechanism 20 Put on line layer opening 211A position (now, electrical connection element W be arranged at first circuit board 21 in face of lens driving fill On the surface for putting 1 downside), to be electrically connected with conductive member P1 and first line layer 211.In the case of comparatively ideal, electrically Connecting element W can be coated on the extension T through first substrate 21, to avoid it exposed to the external world.Design whereby, by increasing capacitance it is possible to increase Electrical connection element W and conductive member P1 bonding area, and improve the reliability of assembling operation.
In certain embodiments, electrical connection element W also can be set close to the angle of pedestal 12 (having polygon external form) Fall and spaced apart (consequently, it is possible to conductive member P1 and circuit board assemblies A1 with the opening portion 210C of first substrate 210 The electric connection point that first circuit board 21 is formed also needs accordingly to move).This configuration mode can avoid camera lens by dry Disturb.
Figure 11 shows the explosive view of the camera lens module 10 ' according to other embodiments of the invention, and Figure 12 is shown in Figure 11 Partial sectional view after the assembling of camera lens module 10 '.As shown in Figure 11, Figure 12, implement in camera lens module 10 ' and earlier figures 5- Fig. 7 The Main Differences of the camera lens module 10 of example are that camera lens module 10 ' also includes multiple (such as 2) second magnetic element M2 (examples Such as magnet) and a sensing magnetic fields component 17.Second magnetic element M2 is arranged at the outer peripheral face of load bearing seat 13.It is to be understood that make Sensing precision can be improved with multiple second magnetic element M2, and uses a magnetic with multiple magnetic poles (such as four magnetic poles) Element substitutes multiple second magnetic element M also to can reach similar effect.One cover plate 18 also may be disposed at framework 11 to position First magnetic element M1, can lift positioning precision.Sensing magnetic fields component 17 is arranged on a madial wall of framework 11, and is corresponded to Second magnetic element M2, wherein sensing magnetic fields component 17 include a circuit board 17A (such as flexible circuit board) and are arranged at circuit A sensing magnetic fields chip 17B on plate 17A (tertiary circuit plate).
By sensing changes of magnetic field caused by the second magnetic element M2 movement, sensing magnetic fields chip 17B, which can be learnt, to be held Seat 13 and camera lens therein are carried in the position on optical axis direction O.Further, sensing magnetic fields component 17 can be electrically connected to outside one Portion's power supply (not shown), and the position of load bearing seat 13 of the external power source according to measured by sensing magnetic fields chip 17B can drive one again To the coil C on load bearing seat 13, (according to some embodiments, sensing magnetic fields chip 17B can also have for dynamic signal (such as electric current) application There is control to provide to the function of coil C drive signal size), and then pass through electromagnetic drive caused by field drives mechanism 14 Power is to drive the optical axis direction O (Z-direction) of load bearing seat 13 and camera lens therein along camera lens to be moved to desired position.Borrow This, can be achieved auto-focusing (AF) control of a loop circuit (Closed-loop).
According to some embodiments, coil C can be electrically connected with the circuit board of sensing magnetic fields component 17 via flexible member 16 17A, then it is conductive via multiple (such as 4) on circuit board 17A multiple conducting terminal 17C (Figure 11) electric connection pedestal 12 Component P.As shown in figure 13, conductive member P can have the plate body structure (but being not limited) of strip, and with around pedestal 12 Pedestal opening 12A mode configure.More specifically, each conductive member P one end be configured at pedestal 12 with circuit board 17A Conducting terminal 17C connections side, and the other end then around pedestal 12 pedestal opening 12A configure.In addition, conductive member P Surface be adjacent to the bottom surface 12B of pedestal 12, and conductive member P only has the end E towards pedestal opening 12A (radially) extensions Exposed to the outside of pedestal 12, to connect the first circuit board 21 of aforementioned optical Fang Shouzhen mechanisms 20.
On conductive member P and the first circuit board 21 of optical anti-shake mechanism 20 electric connection mode and its advantage with Previous embodiment is all identical, only omits repeat specification herein.
In addition, according to some embodiments (refer to Fig. 3, Fig. 4, Figure 14), the first circuit board of optical anti-shake mechanism 20 21 first substrate 210 can also have at least positioning piece 210E towards the direction extension of the pedestal 12 of camera lens module 10, and base On seat 12 (such as the outside of pedestal 12 is formed at formed with the corresponding and at least locating slot 12C for engaging keeper 210E The bottom side of wall).Whereby, the positioning that can be easy between camera lens module 10 and optical anti-shake mechanism 20, while can also apply viscous Agent between keeper 210E and locating slot 12C to aid in assembling operation.
In summary, in the lens driving apparatus of the embodiment of the present invention, it can omit and be for electrically connecting in the prior art The gooseneck component of camera lens module and optical anti-shake mechanism, and it is directly electric by the conductive member of the interior pedestal for being embedded in camera lens module Property connection optical anti-shake mechanism, make the effect that lens driving apparatus minimizes and structure simplifies so as to reach.In addition, by The external world is not exposed in the conductive member of pedestal, can also reduce it is influenceed and send out by miscellaneous part (such as memory alloy wire) The chance of raw short circuit.
Although the present invention is disclosed as above with foregoing embodiment, so it is not limited to the present invention.People in the art Member without departing from the spirit and scope of the present invention, when a little change and retouching can be done.Therefore protection scope of the present invention is worked as It is defined depending on the scope that appended claims are defined.

Claims (14)

1. a kind of lens driving apparatus, including:
One pedestal;
One load bearing seat, one first side of the pedestal is arranged at, to carry a camera lens;
One first drive mechanism, first side of the pedestal is arranged at, to drive an optical axis of the load bearing seat along the camera lens Move in direction;
One second drive mechanism, one second side relative to first side of the pedestal is arranged at, including:
One circuit board assemblies;
One memory alloy wire component, is electrically connected with the circuit board assemblies, to drive the pedestal perpendicular to the optical axis direction Moved in one plane;And
One conductive member, it is arranged on the pedestal, is for electrically connecting to first drive mechanism and second drive mechanism, and should Conductive member and the circuit board assemblies are connected to an electric connection point, and wherein the memory alloy wire component is compared to the electric connection A light incident side of the point close to the camera lens.
2. lens driving apparatus as claimed in claim 1, the wherein pedestal have in face of a surface of second drive mechanism, And the light incident side of the surface compared to the electric connection point close to the camera lens.
3. lens driving apparatus as claimed in claim 1, the wherein circuit board assemblies include a first circuit board and one second Circuit board, the first circuit board are arranged between the second circuit board and the pedestal and connect the pedestal, the memory alloy wire group Part is electrically connected with the first circuit board and the second circuit board, to drive the first circuit board perpendicular to the optical axis direction Moved in the plane relative to the second circuit board, wherein, the conductive member forms the electric connection point with the first circuit board.
4. lens driving apparatus as claimed in claim 3, the wherein first circuit board include a first substrate and a First Line Road floor, the first line layer are arranged on the first substrate and also included formed with a line layer opening, the lens driving apparatus One electrical connection element, to be electrically connected with the conductive member and the first line layer in the position of the line layer opening.
5. lens driving apparatus as claimed in claim 4, the wherein pedestal have a polygon external form, and electric connection member Part is positioned proximate in the corner of the pedestal.
6. lens driving apparatus as claimed in claim 4, wherein when being watched from an outside of the lens driving apparatus, this Formed with a base openings, the exposure line layer opening on one substrate.
7. lens driving apparatus as claimed in claim 6, wherein as the side along the optical axis direction perpendicular to the camera lens To during viewing, the electrical connection element and the first substrate are partly overlapping.
8. lens driving apparatus as claimed in claim 6, the wherein conductive member are formed with an extension, through the line layer Opening and the base openings.
9. lens driving apparatus as claimed in claim 8, the wherein electrical connection element are arranged at the first substrate in face of being somebody's turn to do On a surface on the outside of this of lens driving apparatus.
10. lens driving apparatus as claimed in claim 4, the wherein second circuit board include a second substrate and one second line Road floor, second line layer are arranged on the second substrate, are electrically connected with the first line layer and extend to lens driving dress The outside put.
11. the lens driving apparatus as described in any one in claim 1 to 10, wherein first drive mechanism include position A corresponding coil and one first magnetic element, the coil is arranged on the load bearing seat, and the lens driving apparatus also includes one Flexible member, it is arranged between the load bearing seat and the pedestal, wherein, the coil is electrically connected with the conductive structure via the flexible member Part.
12. lens driving apparatus as claimed in claim 11, in addition to one second magnetic element and a magnetic that position is corresponding Field sensing component, second magnetic element are arranged on the load bearing seat, and the sensing magnetic fields component includes a tertiary circuit plate and set The sensing magnetic fields chip being placed on the tertiary circuit plate, wherein, the coil is electrically connected with the 3rd electricity via the flexible member Road plate, then it is electrically connected with the conductive member via the tertiary circuit plate.
13. lens driving apparatus as claimed in claim 12, in addition to multiple conductive members, the 3rd electricity is electrically connected Multiple conducting terminals of road plate, and it is configured to surround an opening of the pedestal.
14. the first substrate of lens driving apparatus as claimed in claim 4, the wherein first circuit board has towards the pedestal Direction extension positioning piece, and formed with corresponding and for engaging a locating slot of the keeper on the pedestal.
CN201710570216.5A 2016-07-29 2017-07-13 Lens driving device Active CN107664895B (en)

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CN202010401935.6A CN111522183A (en) 2016-07-29 2017-07-13 Lens driving device
US15/658,869 US10365500B2 (en) 2016-07-29 2017-07-25 Lens driving device
JP2017145558A JP6876568B2 (en) 2016-07-29 2017-07-27 Lens drive device
US16/445,962 US10782538B2 (en) 2016-07-29 2019-06-19 Lens driving device
US16/994,170 US20200379271A1 (en) 2016-07-29 2020-08-14 Lens driving device

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