CN100544009C - Locate accurate image chip encapsulating structure - Google Patents
Locate accurate image chip encapsulating structure Download PDFInfo
- Publication number
- CN100544009C CN100544009C CNB200610160953XA CN200610160953A CN100544009C CN 100544009 C CN100544009 C CN 100544009C CN B200610160953X A CNB200610160953X A CN B200610160953XA CN 200610160953 A CN200610160953 A CN 200610160953A CN 100544009 C CN100544009 C CN 100544009C
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- Prior art keywords
- image chip
- spacing zone
- spacing
- chip
- lid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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- Solid State Image Pick-Up Elements (AREA)
Abstract
The accurate image chip encapsulating structure in a kind of location comprises a carrier, an image chip, some leads and a lens unit; Image chip is linked on the carrier with the one bottom surface, is formed with an image sensing district on the end face of image chip; Lead is that electrical communication is between image chip and carrier; Lens unit includes positioning piece, a lid and a lens set, keeper is connected on the carrier with its bottom, keeper has one first spacing zone, lid has a support portion, one second spacing zone and an eyeglass holding part, support portion, second spacing zone and eyeglass holding part are formed in one, the support portion is connected on the end face of image chip with its root edge, second spacing zone and eyeglass holding part are that self-supporting portion extends upward and forms, lens set is placed in the eyeglass holding part, and keeper is with its first spacing zone and the lid second spacing zone butt; Whereby, the X of qualification lid, Y-axis are to relative position, and the Z axial location between qualification lid and image chip.
Description
Technical field
The present invention is relevant with chip-packaging structure, the more detailed accurate image chip encapsulating structure in a kind of location that is meant.
Background technology
With known integrated circuit (IC) chip structure dress, generally be directly a chip to be amplexiformed on a circuit board, utilize plain conductor to be soldered on the weld pad and circuit board of this chip again, make this chip can be by the connection of this plain conductor and be electrical being communicated with this circuit board.
When the chip of its structure dress is a kind of when absorbing the chip that image uses, the end face of this chip is to be an image sensing district, with imaging in addition by this image sensing district, because must be in a camera lens or an eyeglass above this image sensing district be set on this circuit board, to see through this camera lens or eyeglass with the in addition imaging in this image sensing district of the light-resource fousing of outside.But, as shown in Figure 1, general known image chip encapsulating structure is an image chip 1 is utilized a viscose 2 and to amplexiform on a circuit board 3, bottom with a lid 4 utilizes a viscose 5 to amplexiform on this circuit board 3 again, make this image chip 1 be positioned at this lid 4 inside, again an eyeglass 6 or camera lens are utilized a viscose 7 and amplexiform on the top of this lid 4, enable by this eyeglass 6 with the light-resource fousing of outside in the image sensing district 8 of this image chip 1.
Since the location that eyeglass 6 and image sensing district are 8 must be suitable accurate, can be correctly with the light-resource fousing of outside in this image sensing district 8, but because this known configurations has too much unreliable factor in this eyeglass 6 to 8 in this image sensing district, one for 3 of this image chip 1 and this circuit boards by the amplexiforming of viscose 2, might be coated with level that 3 of image chip 1 and this circuit boards take place and difference highly to some extent because of the inequality of viscose 2; Its two for 3 of lid 4 and this circuit boards by the amplexiforming of viscose 5, might be coated with level that 3 of lid 4 and this circuit boards take place and difference highly to some extent because of the inequality of viscose 5; Its three for 6 on this lid 4 and this eyeglass by the amplexiforming of viscose 7, might be coated with level that 6 on lid 4 and this eyeglass take place and margin highly to some extent because of the inequality of viscose 7.And one or its two might only take place in above-mentioned three kinds of levelness and highly coarse factor, it would, of course, also be possible to exists for three kinds all simultaneously, therefore cause eyeglass 6 and this chip 1 image sensing district 8 can't the position on correct relative so that the effect of focusing to be provided, and eyeglass 6 must be done once position the adjustment extra and chip-packaging structure that flood tide is small, the effect of focusing can correctly be provided, this not only will expend extra time and manpower is adjusted, and more will cause the qualification rate of finished product not good.
In addition, when the chip of its structure dress is a kind of when absorbing the chip that image uses, the end face of this chip is to be an image sensing district, with imaging in addition by this image sensing district, therefore what this image sensing district must be for extremely is clean, but because in the course of processing of structure dress, still welding lead must be arranged ... Deng operation, therefore very easily cause the image sensing district to have the situation that pollutant spatters cloth to take place, and cause imaging effect not good, or more very have, and then cause damage because of the careless of welding lead misses the situation of clashing into the image sensing district.
Summary of the invention
In view of this, main purpose of the present invention is to provide a kind of location accurate image chip encapsulating structure, is the position error that can reduce when assembling between each member.
Another object of the present invention is to provide a kind of location accurate image chip encapsulating structure, is to avoid its image sensing district to be polluted during lead or damage in welding.
For reaching above-mentioned purpose, the accurate image chip encapsulating structure in a kind of location provided by the present invention includes: a carrier; One image chip is to be linked on this carrier with the one bottom surface, is formed with an image sensing district on the end face of this image chip, and is formed with some chip pad on the neighboring in this image sensing district; One cover body, have an a junction and an overhead guard portion, this connecting portion is to be linked on this image chip, and between this image sensing district and this chip pad, make by this connecting portion and intercepted between this image sensing district and this chip pad, this overhead guard portion is linked on this connecting portion, and is positioned at the top in this image sensing district; Some leads are to be connected on this chip pad with the one end, and the other end then is connected on this carrier, make between this image chip and this carrier by this lead and electrical communication; One lens unit, include positioning piece, one lid and a lens set, this keeper is to be connected on this carrier with its bottom, this keeper has one first spacing zone, this lid has a support portion, one second spacing zone and an eyeglass holding part, this support portion, second spacing zone and this eyeglass holding part are to be formed in one, this support portion is to be connected on the end face of this image chip with its root edge, this second spacing zone and this eyeglass holding part are to extend upward from this support portion to form, this lens set is to be placed in this eyeglass holding part, and this keeper is with its first spacing zone and this lid second spacing zone butt; Whereby, the X, Y-axis that can be limited this lid by the butt of this keeper and this lid be to relative position, and limit Z axial location between this lid and this image chip with being connected of this image chip by this support portion.
Description of drawings
Fig. 1 is a kind of encapsulating structure cross-sectional schematic of known image chip;
Fig. 2 is the cross-sectional schematic of the present invention's first preferred embodiment;
Fig. 3 is the cross-sectional schematic of preferred embodiment shown in Figure 2 along the 3-3 line;
Fig. 4 is the cross-sectional schematic of the present invention's second preferred embodiment;
Fig. 5 is the cross-sectional schematic of preferred embodiment shown in Figure 4 along the 5-5 line.
Embodiment
For enabling that feature of the present invention and purpose are had further understanding and approval, enumerate following preferred embodiment now, and conjunction with figs. is illustrated in the back:
Seeing also Fig. 2 and Fig. 3, is that the present invention's first preferred embodiment provides a kind of location accurate image chip encapsulating structure 10, and it consists predominantly of a carrier 11, an image chip 12, a cover body 13, a some lead 14 and a lens unit 15; Wherein:
This carrier 11 is to can be plastics, reinforced plastics, glass fibre, pottery ... circuit board or the flower stand precasting (Printed Circuit Board, PCB, PRE-MOLD) made etc. material are as this encapsulating structure 10 and the extraneous bridge that electrically connects; This carrier 11 is a tabular, has an end face 111 and one and the opposing bottom surface 112 of this end face 111, is laid with the wiring (not shown) and the some circuit welding pads 113 that electrically communicates with this wiring that are predetermined aspect and quantity on this end face 111.
This image chip 12, has an end face 121 and one and the opposing bottom surface 122 of this end face 121, its bottom surface 122 is by epoxy resin, silicones, low-melting glass or two-sided tape ... Deng sticky stuff, and stick together on the end face 111 that is attached at this carrier 11, end face 121 central position of this image chip 12 are provided with an image sensing district 123 in order to imaging, and on the end face 121 of image chip 12, be positioned at the outer periphery place in this image sensing district 123, be provided with and somely be the chip pad 124 that electrically conducts with this image chip 12.
This cover body 13 includes an a junction 131 and an overhead guard portion 132; This connecting portion 131 is the annular solid that an axle center is permeable type in present embodiment, be can be by plastics, glass, glass fibre, metal or pottery ... material is made, make the inner formation one in its axle center be covered with space 133, this connecting portion 131 is outside being connected in around the image sensing district 123 of these image chip 12 end faces by a viscose (not shown) with one ora terminalis root edge, and be to be connected between this image sensing district 123 and this each chip pad 124, make 123 in this image sensing district in this is covered with space 133, and the neighboring in this image sensing district 123 is sealed, and make this chip pad 124 be able to be separated by this connecting portion 131 with this image sensing district 123 by this connecting portion 131; This overhead guard portion 132 is that the discoid thin plate of an insulation also can be rectangular-shaped thin plate in present embodiment, be can be made by light transmissive materials such as glass, this overhead guard portion 132 be by an adhesion (not shown) and gluing on another ora terminalis apical margin of this connecting portion 131, make this overhead guard portion 132 be sitting at the top in this image sensing district 123, and, make by this overhead guard portion 132 top that this is covered with space 133 is sealed by apart from this image sensing district 123 a predetermined distance being arranged with being connected of this connecting portion 131; In present embodiment, the width area of this overhead guard portion 132 is the width areas that are equal to this connecting portion 131, but when actual design, the width area of this overhead guard portion also can be greater than the width area of this connecting portion.
These leads 14 are by gold, aluminium ... made Deng the conducting metal material, be to utilize wire soldering technology that this each lead 14 is electrically connected with the circuit welding pad 113 of this carrier 11 and the chip pad 124 of this chip 12 respectively; During the bonding wire operation, it is first pad that this lead 14 at first is connected with this circuit welding pad 113 securely in the mode of vertical these carrier 11 circuit welding pads 113, when lead 14 up being stretched to the position of chip 12 end faces 121 again, extend in the mode of almost horizontal that to be connected with this chip pad 124 be second pad, whereby, this chip 12 tops are for the in addition flattening and significantly reduce the height of encapsulating structure 10 of the ccontaining space of lead 14.
This lens unit 15 includes positioning piece 16, a lid 17 and a lens set 18; The cuboid that this keeper 16 is a hollow also can be annular solid, in order to the circuit welding pad 113 that is covered in this carrier 11, outside this image chip 12 and the lead 14, be to be connected on the end face 111 of this carrier 11 with its bottom surface, and the end face of this keeper 16 outside also is formed with one first spacing zone 161, this first spacing zone 161 be one on the end face of this keeper 16 to the zone of lower recess, make this first spacing zone 161 have a spacing sidewall 162 and a spacing diapire 163, this spacing sidewall 162 is perpendicular to the end face 121 of this image chip 12 and is a burnishing surface, this spacing diapire 163 is perpendicular to this spacing sidewall 162 and is parastate with the end face 121 of this image chip 12, is a burnishing surface; This lid 17 is made by one, has a support portion 171, one top board 172, one eyeglass holding part 173 and one second spacing zone 174, this support portion 171 is that a cuboid that axially is permeable type also can be annular solid in present embodiment, make its axial inner form a lid and establish the space, this support portion 171 is to connect on the end face 121 that is butted on this image chip 12 by an adhesion (not shown) with one ora terminalis root edge, and be between the outside and this chip pad 124 of this cover body 13, make this cover body 13 be positioned at this lid and establish the space, this top board 172 is that a rectangular-shaped thin plate also can be annular shape thin plate in present embodiment, this top board 172 is that the apical margin institute level from this support portion 171 stretches out and forms, and extended to form one second spacing zone 174 downwards in the outer peripheral edges of this top board 172, and the bottom surface of this second spacing zone 174 is not contact to some extent with the spacing diapire 163 of this keeper 16, but by the interior sidewall surface 175 of this second spacing zone 174 and spacing sidewall 162 butts that is this first spacing zone 161 and this second spacing zone, 174 sides generation butt of this first spacing zone 161, but should not produce the bottom surface butt, because the present invention utilizes this support portion 171 to connect to be butted on the end face 121 of this image chip 12, to produce the axial precise height location of Z, these top board 172 middle positions are formed with a perforation 176, the aperture of this perforation 176 is slightly larger than overhead guard portion 132 external diameters of this cover body 13, this overhead guard portion 132 is sitting in this perforation 176, and by this top board 172 this lead 14 is covered fully and to cover, this eyeglass holding part 173 is the formation that protrudes out on the perforation 176 periphery end faces of this top board 172, and eyeglass holding part 173 inside are to be up and down saturating empty and be communicated with this perforation 176; This lens set 18 is an eyeglass, is to be fixedly arranged in this eyeglass holding part 173.
Because encapsulating structure 10 of the present invention is before carrying out the bonding wire operation and being about to lead and operation that chip pad and circuit welding pad are connected, by this cover body 13 image sensing district 123 is intercepted with chip pad 124, the thing that can avoid false touch being arranged when the bonding wire operation or polluting image sensing district 123 takes place.Again, the connecting portion 131 and the overhead guard portion 132 of this cover body 13 also can adopt integrally formed made, can simplify the operation of overall package more.
Owing to be used for the eyeglass holding part 173 of ccontaining lens set 18, can be made into integration by a plastic opaque, glass fibre, metal, pottery or transparent glass, quartz, plastic material with these support portion 171 one are made, and this support portion 171 is directly to support to arrive on the end face 121 of this image chip 12, make this lens set 18 and 123 in this image sensing district be direct relativeness, need not as structure commonly used by too much indirect relation and gluing member, can make accurate that lens set 18 positions and the position in 123 in this image sensing district after the assembling can be suitable.Moreover, because this support portion 171 can provide this lens set 18 1 axial location Z axial location, and the contacting of 175 of the interior sidewall surface of the spacing sidewall 162 of this first spacing zone 161 and this second spacing zone 174, then can be provided this lens set 18 in addition two axial location X and Y-axis to the location, make the three-dimensional space position of lens set 18 all restricted, the location when assembling to keep is accurate.
See also Fig. 4 and Fig. 5, it is the accurate image chip encapsulating structure 20 in a kind of location that the present invention's second preferred embodiment is provided, it is same as the previously described embodiments to include a carrier 21, an image chip 22, a cover body 23, a some lead 24 and a lens unit 25, and this lens unit 25 has positioning piece 26, a lid 27 and a lens set 28 equally; Only the main difference with the foregoing description is:
This lens set 28 has a body 281 and some eyeglasses 282, this eyeglass 282 is to be placed in this body 281, be formed with an external screw thread on the outer peripheral face of this body 281, be that internal thread by this external screw thread and this eyeglass holding part 273 is spirally connected, enable by this body 281 of rotation to drive the upper and lower displacement of this eyeglass 282, in order to the focal length of adjusting eyeglass 282.
Though the lens unit of present embodiment structure is different from the above embodiments, it can reach purpose of the present invention equally.
By above-mentioned explanation, first and second embodiment of the present invention is the eyeglass holding part with ccontaining lens set, be made with this support portion one, and this support portion is directly to support to arrive on the end face of this image chip, reach the axial location of Z, and, then can be provided this lens set X and Y-axis to the location by the side butt of this first spacing zone and this second spacing zone, make the three-dimensional space position of lens set all restricted, the location when assembling to keep is accurate.
What further specify is again; first and second spacing zone of the present invention is in order to define this lens set X and Y-axis to the location; therefore be not restricted to the shape in the foregoing description; and does not also limit its residing respectively position, and first restricted area for example of the present invention is to be formed on the keeper, does not directly design on chip but also do not get rid of; therefore; rights protection of the present invention should be foundation with the protection range of claim, but not only for the explanation of the embodiment of the invention.
Claims (10)
1. the accurate image chip encapsulating structure in location is characterized in that, includes:
One carrier;
One image chip is to be linked on this carrier with the one bottom surface, is formed with an image sensing district on the end face of this image chip, and is formed with some chip pad on the neighboring in this image sensing district;
Some leads are to be connected on this chip pad with the one end, and the other end then is connected on this carrier, make between this image chip and this carrier by this lead and electrical communication;
One lens unit, include a lid and a lens set, this lid has a support portion and an eyeglass holding part, this support portion and this eyeglass holding part are to be formed in one, this support portion is to locate mode and its root edge is connected on the end face of this image chip with X and Y-axis, this eyeglass holding part is to extend upward from this support portion to form, and this lens set is to be placed in this eyeglass holding part; Whereby, the X, Y-axis that can limit this lid be to relative position, and limit Z axial location between this lid and this image chip with being connected of this image chip by this support portion.
2. according to the accurate image chip encapsulating structure in the described location of claim 1, it is characterized in that, wherein this lens unit more includes integrated keeper, this keeper is a ducted body, in order to circuit welding pad, this image chip and the lead that covers this carrier, this keeper bottom surface is connected on the end face of this carrier, and the end face of this keeper outside also is formed with one first spacing zone, and this lid has one second spacing zone, and this first spacing zone and this second spacing zone produce the side butt to produce X and Y-axis to locate mode.
3. according to the accurate image chip encapsulating structure in the described location of claim 2, it is characterized in that, wherein this first spacing zone has a spacing sidewall and a spacing diapire, this spacing sidewall is perpendicular to the end face of this image chip and is a burnishing surface, and this spacing diapire is perpendicular to this spacing sidewall and is parastate with the end face of this image chip and is a burnishing surface; This lid more is provided with a top board, this top board is that the apical margin institute level from this support portion stretches out and forms, and extended to form this second spacing zone downwards in the outer peripheral edges of this top board, and the bottom surface of this top board is not contact to some extent with the spacing diapire of this keeper, but by the interior sidewall surface of this second spacing zone and the spacing sidewall butt of this first spacing zone.
4. according to the accurate image chip encapsulating structure in the described location of claim 2, it is characterized in that wherein this second spacing zone is to be formed to be most cylindrical periphery faces on this support portion; This first spacing zone is that most positions and shape are respectively to groove that should second spacing zone, make this second spacing zone be positioned at this first spacing zone, and contact with the spacing sidewall of this first spacing zone by the outer side surface of this second spacing zone, and can be provided X, Y-axis to locating effect.
5. according to the accurate image chip encapsulating structure in the described location of claim 1, it is characterized in that, its chips is provided with one first spacing zone, and this lid has one second spacing zone, and this first spacing zone and this second spacing zone produce the side butt to produce X and Y-axis to locate mode.
6. according to the accurate image chip encapsulating structure in the described location of claim 1, it is characterized in that, wherein more include a cover body, have an a junction and an overhead guard portion, this connecting portion is to be linked on this image chip, and between this image sensing district and this chip pad, makes by this connecting portion to be intercepted between this image sensing district and this chip pad, this overhead guard portion is linked on this connecting portion, is made by the glass light transmissive material.
7. according to the accurate image chip encapsulating structure of claim 1 or 6 described location, it is characterized in that wherein this lid middle position is formed with a perforation, the aperture of this perforation is slightly larger than this overhead guard portion external diameter, and this overhead guard portion is sitting in this perforation.
8. according to the accurate image chip encapsulating structure in the described location of claim 1, it is characterized in that wherein this lid is by being made into integration by plastic opaque, glass fibre, metal, pottery or transparent glass, quartz, plastic material.
9. according to the accurate image chip encapsulating structure in the described location of claim 1, it is characterized in that, wherein be formed with an internal thread on this eyeglass holding part internal face; This lens set has a body and some eyeglasses, this eyeglass is to be placed in this body, being formed with an external screw thread on the outer peripheral face of this body, is that the internal thread by this external screw thread and this eyeglass holding part is spirally connected, and enables by this body of rotation to drive the upper and lower displacement of this eyeglass.
10. according to the accurate image chip encapsulating structure in the described location of claim 1, it is characterized in that wherein this lead is that mode with vertical this carrier is connected on this carrier, and is connected with this chip pad in the mode of level.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200610160953XA CN100544009C (en) | 2006-12-06 | 2006-12-06 | Locate accurate image chip encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200610160953XA CN100544009C (en) | 2006-12-06 | 2006-12-06 | Locate accurate image chip encapsulating structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101197383A CN101197383A (en) | 2008-06-11 |
| CN100544009C true CN100544009C (en) | 2009-09-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB200610160953XA Expired - Fee Related CN100544009C (en) | 2006-12-06 | 2006-12-06 | Locate accurate image chip encapsulating structure |
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| CN (1) | CN100544009C (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5550380B2 (en) * | 2010-02-25 | 2014-07-16 | キヤノン株式会社 | Solid-state imaging device and imaging device |
| CN103378179B (en) * | 2012-04-16 | 2016-08-31 | 源杰科技股份有限公司 | Photoelectric element packaging body and detachable packaging structure |
| CN108933151B (en) * | 2018-07-26 | 2024-02-13 | 苏州晶方半导体科技股份有限公司 | Packaging structure and packaging method of image sensing chip |
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2006
- 2006-12-06 CN CNB200610160953XA patent/CN100544009C/en not_active Expired - Fee Related
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| Publication number | Publication date |
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| CN101197383A (en) | 2008-06-11 |
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