JP2541391Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JP2541391Y2
JP2541391Y2 JP1990407101U JP40710190U JP2541391Y2 JP 2541391 Y2 JP2541391 Y2 JP 2541391Y2 JP 1990407101 U JP1990407101 U JP 1990407101U JP 40710190 U JP40710190 U JP 40710190U JP 2541391 Y2 JP2541391 Y2 JP 2541391Y2
Authority
JP
Japan
Prior art keywords
metal layer
opening
insulating film
aluminum
main component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1990407101U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0494752U (https=
Inventor
博美 長谷川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP1990407101U priority Critical patent/JP2541391Y2/ja
Publication of JPH0494752U publication Critical patent/JPH0494752U/ja
Application granted granted Critical
Publication of JP2541391Y2 publication Critical patent/JP2541391Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/922—Bond pads being integral with underlying chip-level interconnections
    • H10W72/9226—Bond pads being integral with underlying chip-level interconnections with via interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/934—Cross-sectional shape, i.e. in side view

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
JP1990407101U 1990-12-29 1990-12-29 半導体装置 Expired - Fee Related JP2541391Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990407101U JP2541391Y2 (ja) 1990-12-29 1990-12-29 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990407101U JP2541391Y2 (ja) 1990-12-29 1990-12-29 半導体装置

Publications (2)

Publication Number Publication Date
JPH0494752U JPH0494752U (https=) 1992-08-17
JP2541391Y2 true JP2541391Y2 (ja) 1997-07-16

Family

ID=31884089

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990407101U Expired - Fee Related JP2541391Y2 (ja) 1990-12-29 1990-12-29 半導体装置

Country Status (1)

Country Link
JP (1) JP2541391Y2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012005073A1 (ja) * 2010-07-08 2012-01-12 三菱電機株式会社 半導体装置、半導体パッケージ及びそれらの製造方法
JP6002437B2 (ja) * 2012-05-17 2016-10-05 新日本無線株式会社 半導体装置及びその製造方法
WO2013190638A1 (ja) * 2012-06-19 2013-12-27 パイオニア株式会社 導体の接続構造、電子機器

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5731844U (https=) * 1980-07-28 1982-02-19
JPS58192337A (ja) * 1982-05-07 1983-11-09 Hitachi Ltd 半導体装置

Also Published As

Publication number Publication date
JPH0494752U (https=) 1992-08-17

Similar Documents

Publication Publication Date Title
JP3305211B2 (ja) 半導体装置及びその製造方法
JP3482779B2 (ja) 半導体装置およびその製造方法
KR930010981B1 (ko) 반도체장치
US6864562B1 (en) Semiconductor device having active element connected to an electrode metal pad via a barrier metal layer and interlayer insulating film
JPH0546973B2 (https=)
JP2002532882A (ja) 集積回路デバイス
US6200889B1 (en) Semiconductor bonding pad
JP2001351920A (ja) 半導体装置およびその製造方法
JP7709968B2 (ja) 電子部品
JP2006303401A (ja) バンプの形成方法及び構造
EP0541405A1 (en) Bond pad for semiconductor device
US9627344B2 (en) Semiconductor device
JP2541391Y2 (ja) 半導体装置
US4394678A (en) Elevated edge-protected bonding pedestals for semiconductor devices
CA2075462C (en) Bump structure and method for bonding to a semi-conductor device
JPH06177200A (ja) 半導体集積回路装置の形成方法
CN111524818A (zh) 电子器件及其制造方法
JPH01316949A (ja) 腐食耐性ボンディング・パッド
JP2002026064A (ja) 半導体素子のボンディングパッド構造体及びその製造方法
JP2674567B2 (ja) 半導体装置
US8125083B2 (en) Protective barrier layer for semiconductor device electrodes
JPH11121458A (ja) 半導体装置
JP2018142562A (ja) 半導体装置
JP3213507B2 (ja) 半導体装置
EP0631314A1 (en) Multiple-metal-level integrated device and fabrication process thereof

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees