JP2541391Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JP2541391Y2
JP2541391Y2 JP1990407101U JP40710190U JP2541391Y2 JP 2541391 Y2 JP2541391 Y2 JP 2541391Y2 JP 1990407101 U JP1990407101 U JP 1990407101U JP 40710190 U JP40710190 U JP 40710190U JP 2541391 Y2 JP2541391 Y2 JP 2541391Y2
Authority
JP
Japan
Prior art keywords
metal layer
opening
insulating film
aluminum
main component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1990407101U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0494752U (enExample
Inventor
博美 長谷川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP1990407101U priority Critical patent/JP2541391Y2/ja
Publication of JPH0494752U publication Critical patent/JPH0494752U/ja
Application granted granted Critical
Publication of JP2541391Y2 publication Critical patent/JP2541391Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10W72/019—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/536—
    • H10W72/59—
    • H10W72/9226—
    • H10W72/923—
    • H10W72/934—

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
JP1990407101U 1990-12-29 1990-12-29 半導体装置 Expired - Fee Related JP2541391Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990407101U JP2541391Y2 (ja) 1990-12-29 1990-12-29 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990407101U JP2541391Y2 (ja) 1990-12-29 1990-12-29 半導体装置

Publications (2)

Publication Number Publication Date
JPH0494752U JPH0494752U (enExample) 1992-08-17
JP2541391Y2 true JP2541391Y2 (ja) 1997-07-16

Family

ID=31884089

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990407101U Expired - Fee Related JP2541391Y2 (ja) 1990-12-29 1990-12-29 半導体装置

Country Status (1)

Country Link
JP (1) JP2541391Y2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012005073A1 (ja) * 2010-07-08 2012-01-12 三菱電機株式会社 半導体装置、半導体パッケージ及びそれらの製造方法
JP6002437B2 (ja) * 2012-05-17 2016-10-05 新日本無線株式会社 半導体装置及びその製造方法
WO2013190638A1 (ja) * 2012-06-19 2013-12-27 パイオニア株式会社 導体の接続構造、電子機器

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5731844U (enExample) * 1980-07-28 1982-02-19
JPS58192337A (ja) * 1982-05-07 1983-11-09 Hitachi Ltd 半導体装置

Also Published As

Publication number Publication date
JPH0494752U (enExample) 1992-08-17

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees