JP2540040B2 - Optical integrated circuit board device - Google Patents

Description

The present invention relates to an optical integrated circuit board device in which a plurality of optical integrated circuit boards or a combination of these and a plurality of waveguide boards are used.

<Prior Art> An optical integrated circuit substrate (hereinafter referred to as OEIC substrate) is a mixture of electronic elements / circuit parts and optical elements / circuit parts,
In the prior art, it was generally provided as an independent single substrate.

<Problems to be solved by the invention> Therefore, in the case of such a conventional OEIC substrate, one substrate is treated as one unit or module, and a large number of them are organically combined to correspond to various usage modes. Or, in the process of this combination, it is not possible to increase the area ratio of the optical wiring line of the entire device to improve the performance limit of the electronic element / circuit due to signal delay or crosstalk.

<Means for Solving Problems> The present invention has been made in view of the actual situation as described above, and is characterized in that one OEIC substrate is regarded as one unit or module and these OEIC It is an OEIC substrate device in which a plurality of substrates, or a combination of these and a plurality of waveguide substrates, are appropriately adjacent to each other and are combined into a device.

That is, one of the more specific present inventions is a polygonal OEIC.
The light emitting elements 4 and 14 and the light receiving elements 5 and 15 connected to the element component areas 3 and 13 formed on the substrates 1 and 11 and the light receiving elements 5 and 15 are provided at appropriate intervals on the appropriate edges of the substrates 1 and 11, and these OEIC substrates 1 and A plurality of 11 are installed adjacent to each other in a plane, and at the edge portions of the substrates 1, 1, 11, and 11 that are adjacent to each other, the light-emitting elements 4 of the mutual substrates 1, 1, 11, and 11,
An OEIC substrate device is characterized in that 14 and the light receiving elements 5 and 15 or the light receiving elements 5 and 15 and the light emitting elements 4 and 14 are opposed to each other and are optically connected.

Another more specific present invention is a polygonal OEIC substrate.
Element component regions 3 formed on the relevant substrates 1 and 11 at appropriate edges of
Light-emitting elements 4 and 14 and light-receiving elements 5 and 15 connected to 13 are provided at appropriate intervals, and waveguides 6 and 16 that connect the edge portions are provided on the polygonal waveguide substrates 2 and 12 as well. A plurality of OEIC substrates 1 and 11 and waveguide substrates 2 and 12 are arranged adjacent to each other in a plane,
At the edge portions of the substrates 1, 1, 11, 11 adjacent to each other, the light emitting elements 4, 14 and the light receiving elements 5, 14 of the mutual substrates 1, 1, 11, 11.
15 or the light receiving elements 5 and 15 and the light emitting elements 4 and 14 are opposed to each other and optically connected to each other, or the mutual substrates 1, 1, 11 and 11
The light emitting elements 4 and 14 and the light receiving elements 5 and 15 of
5,15 and the light-emitting elements 4,14 are waveguides of the waveguide substrate 2,12.
An OEIC substrate device is characterized in that it is optically opposed to each other via 6,16.

<Operation> Therefore, in one of the present invention, the polygonal OEIC substrate 1, 11
However, since it has the light emitting elements 4 and 14 for outputting an optical signal and the light receiving elements 5 and 15 to which an optical signal is input, it can be regarded as one independent unit or module.
Through these light emitting elements 4 and 14 and light receiving elements 5 and 15,
The OEIC substrates 1 and 11 can be easily connected to a plurality of other OEIC substrates 1 and 11, ..., One after another, so that various usage modes can be accommodated. In addition, since the optical wiring line can be easily expanded by simply arranging them adjacently in the entire device, it is possible to easily increase the signal processing speed.

Next, in another aspect of the present invention, the polygonal OEIC substrate is used.
In order to combine the waveguide substrates 2 and 12 having the waveguides 6 and 16 that connect the edges appropriately with the polygons 1 and 11 as well,
A wider range of usage modes can be accommodated.

<Embodiment> FIG. 1 shows an embodiment of the OEIC substrate device according to the present invention.

In the figure, 1 ... Is an OEIC substrate made of a regular hexagonal one chip, and six OEIC substrates are arranged on the outer periphery of a waveguide substrate 2 also made of a regular hexagonal one chip.

As the OEIC substrate 1, a GaAs, InP, GaAs / Si, InP / Si, or other base substrate is used, and a GaAs-based high-speed light is used on this base substrate.
Each element component area 3 such as IC and Si-based IC is provided, and semiconductor laser (LD), multiple quantum well laser (MQWLD), light emitting diode (LED), etc. are provided at the edges adjacent to other substrates 1 and 2. The light emitting element 4 and the light receiving element 5 such as a photodiode (PD) and an avalanche photodiode (APD) are provided in an appropriate combination.

As the waveguide substrate 2, a base substrate made of Si, SiO ₂ , LiNbO ₃ , glass or the like is used, and a glass embedding method, an optical fiber embedding method, a cod-in tube method, an electrolytic ion diffusion method, a thin film method, a soot is used on this substrate. A desired number of waveguides 6 ... Are formed by a deposition method or the like.

Then, in the combined state as described above, the light emitting element 4 of one adjacent OEIC substrate 1 is
It faces the light receiving element 5 of the IC substrate 1 directly or via the waveguide 6 of the waveguide substrate 2 and is optically connected.

Therefore, in the case of each OEIC substrate 1, ..., Not only in the case where the substrates are directly adjacent to each other, but also in a complicated connection with other substrates separated by the waveguide substrate 2.

Therefore, the signal processed by each element portion of one OEIC substrate 1 is transmitted through the optical wiring line of the light emitting element 4 and the light receiving element 5, or the light emitting element 4 and the waveguide 6 of the waveguide substrate 2 and the light receiving element 5. Others at the speed of light through the optical wiring line of
It is transmitted to the OEIC substrate 1. The signal thus transmitted is subjected to desired processing in each element portion of the OEIC substrate 1, and is further transmitted to another OEIC substrate 1 in the same manner as above. By repeating these, the signal processing is completed.

In the present embodiment, the combination of the six OEIC substrates 1 ... And the one waveguide substrate 2 was used.
There is no particular limitation, and it is possible to take an arbitrary combination mode by appropriately increasing the number as shown in FIG. 2, for example.

FIG. 3 shows another embodiment of the OEIC substrate device according to the present invention.

In the figure, 11 ... Are OEIC substrates each consisting of a regular square one chip, and three waveguide substrates 12 each consisting of a regular square one chip are arranged in a checkered pattern.

The OEIC substrate 11 uses a base substrate such as GaAs, InP, GaAs / Si, InP / Si, etc., and on the base substrate, each element component area 13 such as a GaAs high-speed optical IC or Si IC is provided. , A semiconductor laser (LD), a multiple quantum well laser (MQWLD), a light emitting element 14 such as a light emitting diode (LED), and a photodiode (PD), an avalanche photodiode (APD) on the edge adjacent to the waveguide substrate 12. ) Etc. are provided for each one, for example.

The waveguide substrate 12 is a base substrate made of Si, SiO ₂ , LiNbO ₃ , glass, etc., on which glass embedding method, optical fiber embedding method, cod-in-tube method, electrolytic ion diffusion method, thin film method A branch type waveguide 16 is formed by the soot deposition method or the like so as to connect the adjacent or opposing OEIC substrates 11, 11.

In the combined state as described above, the light emitting element 14 of one OEIC substrate 11 receives the light of the other three OEIC substrates 11 via the waveguides 16 of the three adjacent waveguide substrates 12. Opposed to the element 15 and optically connected. On the contrary, the light receiving element 15 of one OEIC substrate 11 faces the light emitting element 14 of the other three OEIC substrates 11 via the waveguides 16 of the adjacent three waveguide substrates 12. Then, it is optically connected.

Therefore, in the case of each OEIC substrate 11, ..., It is complicatedly connected to the other substrates with the waveguide substrate 12 interposed therebetween.

Therefore, the signals processed by each element portion of each OEIC substrate 11 ... Are exchanged at high speed through the light emitting element 14, the waveguide 16 of the waveguide substrate 12 and the optical wiring line of the light receiving element 5. .

In this embodiment, the three OEIC substrates 11 ... And the three waveguide substrates 12 ... Are combined in a checkered pattern, but the shape and the number of the combinations are not particularly limited, and for example, in the center part, It is possible to take various shapes such as installing six OEIC substrates 11 ... On the outer periphery of the waveguide substrate 12.

In each of the above embodiments, the OEIC substrates 1 and 11 and the waveguide substrate
Although it is a combination with 2, 12, the present invention is not limited to this combination, and may be configured with only the OEIC substrates 1, 11. Further, the shape of each substrate is not limited to the above-described hexagon, square, or the like, and it is possible to widely adopt other polygons.

<Effects of the Invention> As is clear from the above description, according to the OEIC substrate device of the present invention, the following effects can be obtained.

One OEIC substrate or this and the waveguide substrate can be regarded as one unit or module, and a plurality of these substrates can be combined by appropriately adjoining them to form a device, so that it can be used in a very wide range of usage. it can.

Further, since the connection between each OEIC substrate is performed by the optical wiring line and the ratio of the optical wiring line region can be easily expanded, high isolation between signals and high-speed signal processing can be achieved.

Further, if the OEIC substrate and the waveguide substrate are standardized in advance and some necessary patterns are prepared, mass productivity is excellent and great convenience in use can be achieved.

[Brief description of drawings]

FIG. 1 is a schematic plan view showing an embodiment of an OEIC substrate device according to the present invention, FIG. 2 is a schematic plan view showing another application example of the device of FIG. 1, and FIG. FIG. 9 is a schematic plan view showing another example of the OEIC substrate device. In the figure, 1,11 …… OEIC substrate, 2,12 …… Waveguide substrate, 3,13 …… Element component area, 4,14 …… Light emitting element, 5,15 …… Light receiving element, 6,16…
… Waveguides,

Claims (2)

(57) [Claims] 1. Light emitting elements 4,14 and light receiving elements 5,15 connected to element component areas 3,13 formed on the substrates 1,11 at appropriate edges of the polygonal optical integrated circuit boards 1,11. A plurality of these optical integrated circuit boards 1 and 11 are provided adjacent to each other in a planar manner so as to be adjacent to each other at the edge portions of the adjacent boards 1, 1, 11 and 11 to each other. 1, 11, 11 light emitting elements 4, 14 and light receiving elements
An optical integrated circuit board device characterized in that 5,5, or the light receiving elements 5,15 and the light emitting elements 4,14 are opposed to each other and are optically connected. 2. Light emitting elements 4 and 14 and light receiving elements 5 and 15 connected to element component regions 3 and 13 formed on the substrates 1 and 11 at appropriate edges of the polygonal optical integrated circuit substrates 1 and 11. Waveguides 6, 12 are also provided at appropriate intervals, and are similarly connected to the polygonal waveguide substrates 2, 12 by connecting their edges.
16 is provided, and a plurality of these optical integrated circuit boards 1 and 11 and waveguide boards 2 and 12 are installed adjacent to each other in a planar manner, and at the edge portions of the boards 1, 1, 11 and 11 adjacent to each other. , The light emitting elements 4 and 14 and the light receiving elements 5 and 15 of the mutual substrates 1, 1, 11 and 11 or the light receiving elements 5 and 15 and the light emitting elements 4 and 14 are opposed to each other and are optically connected, or Mutual substrate 1,1,11,11 light emitting element 4,
14 and the light receiving elements 5 and 15, or the light receiving elements 5 and 15 and the light emitting elements 4 and 14 are opposed to each other and optically connected via the waveguides 6 and 16 of the waveguide substrate 2 and 12. An optical integrated circuit board device characterized by the above.