JPS5939085A - Mounting of optical integrated circuit - Google Patents

Abstract

PURPOSE:To make connection and disconnection of input/output fiber arrays easier by a method wherein the other ends of incoming and emitting guides are located on almost the same plane constituting a connector surface for input/ output fiber arrays. CONSTITUTION:A guide block 7 comprising an input/output layer 2 arranged and fixed on an optical integrated circuit chip 1 in parallel with each other is made opposed to an optical detecting element 2 of the chip 1 through the intermediary of a reflector provided on one end of an incoming guide 9 while one end of an emitting guide 10 is opposing to a light emitting element 3 on the chip 1 side. The other ends of the guides 9, 10 located on almost the same plane constitute a connector surface for input/output fiber arrays 4', 5'. In such a constitution, the arrays 4', 5' may be connected and disconnected just like the case of normal electric circuit.

Description

DETAILED DESCRIPTION OF THE INVENTION +a) Technical Field of the Invention The present invention relates to an improvement in a mounting structure for efficiently and easily coupling an optical integrated circuit chip with a cuff fiber array.

fb) Technology Background The development of semiconductor lasers, photodiodes, and optical fibers with extremely low transmission loss has led to dramatic advances in so-called photoelectronics technology, which has the advantage of large transmission capacity and no electrostatic or electromagnetic effects from the outside world. Combined with this, optical communication technology has already entered practical use, and the demand for it is increasing year by year.

In response to this increasing demand, improvements and miniaturization of the optical components mentioned above,
Furthermore, the development of so-called optical integrated circuit chips has progressed in order to reduce the size and reliability of component devices, and structures in which input and output cuff fiber arrays are coupled to these chips are being put into practical use.

GaAs is currently used in the configuration of semiconductor lasers and photodiodes.
The most widely used type of semiconductor is
Therefore, light is generally emitted to the side end surface of the chip, while a light receiving diode, ie, a photodetecting element, is formed on the top surface of the chip and receives light from the top surface.

FIG. 1(A) schematically shows this situation in a perspective view, where ▪ indicates a chip, 2 indicates a photodetecting element, and 3 indicates a light emitting element. Of course, other transistors, diodes, etc. are formed on the chip 1, and resistive capacitors and interconnection wiring patterns are formed on the surface, similar to a general integrated circuit.

By simply integrating the input and output cuff fiber arrays with the photodetecting element 2 and the light emitting element 3, and supplying power from the outside, an optical integrated circuit that operates as, for example, a repeater for optical communication can be obtained.

(C) Prior Art and Problems Figure 1 (B) is a schematic side view showing an example of the conventional combination of the input and output cuff fiber array 4°5, the photodetector element 2, and the light emitting element 3, and the same horizontal fiber array 4 in the direction,
5, a reflective surface 6 is formed at the end of the input fiber array 4. For coupling, the input and output cuff fiber arrays 4.5 are separately aligned with the photodetector element 2 and the light emitting element 3, respectively, and fixed at optimal positions using appropriate means.

This separate alignment and combination with separate fiber arrays consumes significant man-hours and increases production costs.

(d1 OBJECT OF THE INVENTION It is an object of the present invention to provide a new type of optical integrated circuit mounting structure that eliminates the above-mentioned drawbacks.

te1 Structure of the Invention The above object is to arrange a light guide section consisting of two layers for input and output in parallel on the upper surface of an optical integrated circuit chip, and in this case, one end surface provided with a reflective surface of the guide for incidence is used as a light detection element of the chip. , one end surface of one exit guide faces the light emitting element on the side surface of the chip, and the other ends of both guides are substantially on the same plane and form a connector connection surface for a backlighting optical fiber array. This is accomplished through configuration.

(f1 Embodiment of the Invention The gist of the present invention will be specifically explained below using an embodiment of the present invention shown in FIG. 2.

FIG. 2(a) is a perspective view showing the light guide block used in the present invention, and FIG. FIG. 2 is a plan view and a sectional view taken along line A-A, respectively.

The light guide block consists of an entrance guide 9 having a reflective surface 8 at the other end and an exit guide 10 which are attached integrally with each other with a displacement of approximately the chip width. Both guides are provided with optical transmission lines 11 and '12 at intervals corresponding to the parallel pinches of the photodetecting elements 2 and the light emitting elements 3 of the chip 1, respectively.

As is well known, this light guide is made by forming a thin groove in a thin glass plate by plasma etching to fit the above-mentioned pinch, and then applying quartz glass, which will become an optical transmission path, to the narrow groove using the CVD method (chemical vapor deposition method).
It is manufactured by attaching it to the glass and then overlaying it with a thin glass plate to integrate it.

The chip 1 is fixed to a recessed portion of a heat sink 13 made of a copper material or the like with an adhesive, and around it is wired with a wiring pattern on a ceramic substrate 14, which is also fixed with an adhesive, using predetermined thin connecting wires.

On the other hand, in the light guide block 7, the tips of the input/output guides l"9 and 10 are spaced apart from the upper depth of the depth 1 by a distance 15 of about 50 microns, respectively, in alignment with the photodetection element 2 and the light emitting element 3 of the depth 1, respectively.
It is fixed onto the ceramic substrate 14 with an adhesive.

In this way, the photodetecting element 2 and the light emitting element 3 of the chip 1 are led out to the transmission paths 11° and 12 at the end faces of the entrance and exit guide blocks, and the output cuff fiber arrays 4' and 5° are formed with the same pinch spacing. An easy-to-insert connection is made through suitable connectors.

(As described in the detailed description of the invention, the optical integrated circuit structure according to the present invention exhibits a remarkable effect in that connection and disconnection with the input and output cuff fiber arrays can be performed in the same manner as in the case of an electric circuit.

[Brief explanation of drawings]

Figure 1 is a perspective view (a) of an example of an optical integrated circuit chip and a side view (b) of a conventional coupling configuration of input and output cuff fiber arrays.
FIG. 2 shows an embodiment of the present invention in a perspective view (A) of a light guide block used in the present invention, a plan view (B), and a side sectional view (C) of the configuration assembled with the chip. show. In the figure, 1 is a chip, 2 is a photodetecting element, 3 is a light emitting element, 4, 4°, 5, 5'' are fiber arrays, 6, 8 are reflective surfaces, 7 is a light guide block, 9 is an incident light guide, 10
11 is an output light guide, 11 is an input light transmission line, 12 is an output light transmission line, 13 is a heat sink, and 14 is a ceramic substrate.

Claims (1)

[Claims] Input/output angle 2 fixed in parallel on the optical integrated circuit chip surface
The light guide block made of a layer faces the photodetecting element of the chip via a reflective surface provided on one end surface of the entrance guide, and the one end surface of the exit guide faces the light emitting element on the side surface of the chip, Furthermore, the other ends of both guides are substantially on the same plane and constitute a connector connecting surface for a reverse receiving optical fiber array.