JP2538705Y2 - めっき処理装置 - Google Patents

めっき処理装置

Info

Publication number
JP2538705Y2
JP2538705Y2 JP33891U JP33891U JP2538705Y2 JP 2538705 Y2 JP2538705 Y2 JP 2538705Y2 JP 33891 U JP33891 U JP 33891U JP 33891 U JP33891 U JP 33891U JP 2538705 Y2 JP2538705 Y2 JP 2538705Y2
Authority
JP
Japan
Prior art keywords
tank
plating
anode electrode
semiconductor substrate
shaped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP33891U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0497856U (enExample
Inventor
智司 村田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP33891U priority Critical patent/JP2538705Y2/ja
Publication of JPH0497856U publication Critical patent/JPH0497856U/ja
Application granted granted Critical
Publication of JP2538705Y2 publication Critical patent/JP2538705Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
JP33891U 1991-01-10 1991-01-10 めっき処理装置 Expired - Lifetime JP2538705Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33891U JP2538705Y2 (ja) 1991-01-10 1991-01-10 めっき処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33891U JP2538705Y2 (ja) 1991-01-10 1991-01-10 めっき処理装置

Publications (2)

Publication Number Publication Date
JPH0497856U JPH0497856U (enExample) 1992-08-25
JP2538705Y2 true JP2538705Y2 (ja) 1997-06-18

Family

ID=31727012

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33891U Expired - Lifetime JP2538705Y2 (ja) 1991-01-10 1991-01-10 めっき処理装置

Country Status (1)

Country Link
JP (1) JP2538705Y2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002503766A (ja) * 1998-02-12 2002-02-05 エーシーエム リサーチ，インコーポレイティド メッキ設備及び方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001316887A (ja) * 2000-05-08 2001-11-16 Tokyo Electron Ltd メッキ処理装置
JP3606795B2 (ja) * 2000-09-18 2005-01-05 シャープ株式会社 噴流式バンプ形成装置
JP2014051697A (ja) * 2012-09-05 2014-03-20 Mitomo Semicon Engineering Kk カップ式めっき装置及びこれを用いるめっき方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002503766A (ja) * 1998-02-12 2002-02-05 エーシーエム リサーチ，インコーポレイティド メッキ設備及び方法
JP3523197B2 (ja) 1998-02-12 2004-04-26 エーシーエム リサーチ，インコーポレイティド メッキ設備及び方法

Also Published As

Publication number Publication date
JPH0497856U (enExample) 1992-08-25

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