JP2538692Y2 - 樹脂ディップ型電子部品 - Google Patents
樹脂ディップ型電子部品Info
- Publication number
- JP2538692Y2 JP2538692Y2 JP1990107907U JP10790790U JP2538692Y2 JP 2538692 Y2 JP2538692 Y2 JP 2538692Y2 JP 1990107907 U JP1990107907 U JP 1990107907U JP 10790790 U JP10790790 U JP 10790790U JP 2538692 Y2 JP2538692 Y2 JP 2538692Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- dip
- type electronic
- terminal
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 title claims description 39
- 229920005989 resin Polymers 0.000 title claims description 39
- 239000000758 substrate Substances 0.000 claims description 16
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000000465 moulding Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990107907U JP2538692Y2 (ja) | 1990-10-15 | 1990-10-15 | 樹脂ディップ型電子部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990107907U JP2538692Y2 (ja) | 1990-10-15 | 1990-10-15 | 樹脂ディップ型電子部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0465401U JPH0465401U (enrdf_load_stackoverflow) | 1992-06-08 |
| JP2538692Y2 true JP2538692Y2 (ja) | 1997-06-18 |
Family
ID=31854636
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990107907U Expired - Lifetime JP2538692Y2 (ja) | 1990-10-15 | 1990-10-15 | 樹脂ディップ型電子部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2538692Y2 (enrdf_load_stackoverflow) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02111005A (ja) * | 1988-10-20 | 1990-04-24 | Matsushita Electric Ind Co Ltd | チップ型電子部品 |
-
1990
- 1990-10-15 JP JP1990107907U patent/JP2538692Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0465401U (enrdf_load_stackoverflow) | 1992-06-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |