JP2536994Y2 - 半導体製造装置のボート搬送装置 - Google Patents
半導体製造装置のボート搬送装置Info
- Publication number
- JP2536994Y2 JP2536994Y2 JP1990126608U JP12660890U JP2536994Y2 JP 2536994 Y2 JP2536994 Y2 JP 2536994Y2 JP 1990126608 U JP1990126608 U JP 1990126608U JP 12660890 U JP12660890 U JP 12660890U JP 2536994 Y2 JP2536994 Y2 JP 2536994Y2
- Authority
- JP
- Japan
- Prior art keywords
- boat
- handler
- diameter portion
- measuring tube
- temperature measuring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title description 5
- 239000004065 semiconductor Substances 0.000 title description 5
- 239000002516 radical scavenger Substances 0.000 claims description 8
- 235000012431 wafers Nutrition 0.000 claims description 7
- 239000010453 quartz Substances 0.000 description 29
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 29
- 238000010438 heat treatment Methods 0.000 description 13
- 238000009529 body temperature measurement Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990126608U JP2536994Y2 (ja) | 1990-11-30 | 1990-11-30 | 半導体製造装置のボート搬送装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990126608U JP2536994Y2 (ja) | 1990-11-30 | 1990-11-30 | 半導体製造装置のボート搬送装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0485726U JPH0485726U (enrdf_load_html_response) | 1992-07-24 |
| JP2536994Y2 true JP2536994Y2 (ja) | 1997-05-28 |
Family
ID=31874153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990126608U Expired - Lifetime JP2536994Y2 (ja) | 1990-11-30 | 1990-11-30 | 半導体製造装置のボート搬送装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2536994Y2 (enrdf_load_html_response) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0783003B2 (ja) * | 1986-07-09 | 1995-09-06 | 国際電気株式会社 | ウエ−ハボ−トの搬送方法 |
-
1990
- 1990-11-30 JP JP1990126608U patent/JP2536994Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0485726U (enrdf_load_html_response) | 1992-07-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7423037B2 (ja) | 基材処理装置および方法 | |
| US5431700A (en) | Vertical multi-process bake/chill apparatus | |
| TW504735B (en) | Film forming method and film forming apparatus | |
| JP3888620B2 (ja) | 基板搬送装置における基板の受け渡し位置検知方法及びその教示装置 | |
| JP3246891B2 (ja) | 熱処理装置 | |
| US20100326351A1 (en) | Apparatus and method for heating substrate and coating and developing system | |
| JP2002261087A (ja) | 基板処理装置 | |
| JP2000252181A (ja) | 熱処理装置、処理装置及び熱処理方法 | |
| JPH11260718A (ja) | 現像処理方法および現像処理装置 | |
| KR101018574B1 (ko) | 열처리 장치, 열처리 방법 및 기록 매체 | |
| JPH0669314A (ja) | ウエハボート回転装置 | |
| JP2536994Y2 (ja) | 半導体製造装置のボート搬送装置 | |
| JPH03261161A (ja) | 縦型熱処理装置 | |
| US5234528A (en) | Vertical heat-treating apparatus | |
| JP3027019B2 (ja) | 熱処理装置 | |
| JP2891382B2 (ja) | 熱処理方法 | |
| KR102224987B1 (ko) | 가열 처리 장치 | |
| JP2010074185A (ja) | 加熱装置、塗布、現像装置及び加熱方法 | |
| JP2663301B2 (ja) | 熱処理装置 | |
| JPH0770495B2 (ja) | 熱処理装置 | |
| JP2004296484A (ja) | 基板処理装置 | |
| JP2639436B2 (ja) | 熱処理装置 | |
| JP2522981Y2 (ja) | ウェーハボートの位置検出装置 | |
| JP4021140B2 (ja) | 加熱処理装置 | |
| JP4167523B2 (ja) | 基板処理装置 |