JP2530547Y2 - プリント配線基板 - Google Patents
プリント配線基板Info
- Publication number
- JP2530547Y2 JP2530547Y2 JP1988142567U JP14256788U JP2530547Y2 JP 2530547 Y2 JP2530547 Y2 JP 2530547Y2 JP 1988142567 U JP1988142567 U JP 1988142567U JP 14256788 U JP14256788 U JP 14256788U JP 2530547 Y2 JP2530547 Y2 JP 2530547Y2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- wiring board
- printed wiring
- land portion
- wiring pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 description 41
- 238000005452 bending Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 11
- 238000005476 soldering Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988142567U JP2530547Y2 (ja) | 1988-10-31 | 1988-10-31 | プリント配線基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988142567U JP2530547Y2 (ja) | 1988-10-31 | 1988-10-31 | プリント配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0262771U JPH0262771U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1990-05-10 |
| JP2530547Y2 true JP2530547Y2 (ja) | 1997-03-26 |
Family
ID=31408638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988142567U Expired - Lifetime JP2530547Y2 (ja) | 1988-10-31 | 1988-10-31 | プリント配線基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2530547Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014086606A (ja) * | 2012-10-25 | 2014-05-12 | Taiyo Yuden Co Ltd | 積層セラミックコンデンサの実装構造 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62201972U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1986-06-14 | 1987-12-23 |
-
1988
- 1988-10-31 JP JP1988142567U patent/JP2530547Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0262771U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1990-05-10 |