JP2525554Y2 - 発光表示装置 - Google Patents
発光表示装置Info
- Publication number
- JP2525554Y2 JP2525554Y2 JP1990120299U JP12029990U JP2525554Y2 JP 2525554 Y2 JP2525554 Y2 JP 2525554Y2 JP 1990120299 U JP1990120299 U JP 1990120299U JP 12029990 U JP12029990 U JP 12029990U JP 2525554 Y2 JP2525554 Y2 JP 2525554Y2
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- light emitting
- light
- conductor
- emitting display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990120299U JP2525554Y2 (ja) | 1990-11-19 | 1990-11-19 | 発光表示装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990120299U JP2525554Y2 (ja) | 1990-11-19 | 1990-11-19 | 発光表示装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0477269U JPH0477269U (US08063081-20111122-C00044.png) | 1992-07-06 |
JP2525554Y2 true JP2525554Y2 (ja) | 1997-02-12 |
Family
ID=31868212
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990120299U Expired - Lifetime JP2525554Y2 (ja) | 1990-11-19 | 1990-11-19 | 発光表示装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2525554Y2 (US08063081-20111122-C00044.png) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3973082B2 (ja) * | 2002-01-31 | 2007-09-05 | シチズン電子株式会社 | 両面発光ledパッケージ |
JP4572312B2 (ja) * | 2004-02-23 | 2010-11-04 | スタンレー電気株式会社 | Led及びその製造方法 |
JP2008016593A (ja) * | 2006-07-05 | 2008-01-24 | Ngk Spark Plug Co Ltd | 発光素子搭載用配線基板 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5111340Y2 (US08063081-20111122-C00044.png) * | 1971-08-05 | 1976-03-26 | ||
JPS58159583U (ja) * | 1982-04-20 | 1983-10-24 | 三洋電機株式会社 | 発光ダイオ−ド表示器 |
JP2574388B2 (ja) * | 1988-05-10 | 1997-01-22 | 松下電器産業株式会社 | 発光ダイオードおよびその電極の形成方法 |
-
1990
- 1990-11-19 JP JP1990120299U patent/JP2525554Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0477269U (US08063081-20111122-C00044.png) | 1992-07-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A711 | Notification of change in applicant |
Effective date: 20051021 Free format text: JAPANESE INTERMEDIATE CODE: A711 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20051024 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20051021 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20070404 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070410 |
|
A762 | Written abandonment of application |
Free format text: JAPANESE INTERMEDIATE CODE: A762 Effective date: 20070514 |