JP2521018B2 - 半導体集積回路の製造方法 - Google Patents

半導体集積回路の製造方法

Info

Publication number
JP2521018B2
JP2521018B2 JP4355405A JP35540592A JP2521018B2 JP 2521018 B2 JP2521018 B2 JP 2521018B2 JP 4355405 A JP4355405 A JP 4355405A JP 35540592 A JP35540592 A JP 35540592A JP 2521018 B2 JP2521018 B2 JP 2521018B2
Authority
JP
Japan
Prior art keywords
metal
layer
polysilicon
integrated circuit
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP4355405A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0684906A (ja
Inventor
マノチャ アジット
エム．マーチャント サレシュ
シン ランバー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Corp filed Critical AT&T Corp
Publication of JPH0684906A publication Critical patent/JPH0684906A/ja
Application granted granted Critical
Publication of JP2521018B2 publication Critical patent/JP2521018B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
    • H01L21/76889—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances by forming silicides of refractory metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/019—Contacts of silicides

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
JP4355405A 1991-12-27 1992-12-21 半導体集積回路の製造方法 Expired - Fee Related JP2521018B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US814844 1991-12-27
US07/814,844 US5461005A (en) 1991-12-27 1991-12-27 Method of forming silicide in integrated circuit manufacture

Publications (2)

Publication Number Publication Date
JPH0684906A JPH0684906A (ja) 1994-03-25
JP2521018B2 true JP2521018B2 (ja) 1996-07-31

Family

ID=25216143

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4355405A Expired - Fee Related JP2521018B2 (ja) 1991-12-27 1992-12-21 半導体集積回路の製造方法

Country Status (4)

Country Link
US (1) US5461005A (enrdf_load_stackoverflow)
EP (1) EP0549199B1 (enrdf_load_stackoverflow)
JP (1) JP2521018B2 (enrdf_load_stackoverflow)
DE (1) DE69228525T2 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5543362A (en) * 1995-03-28 1996-08-06 Motorola, Inc. Process for fabricating refractory-metal silicide layers in a semiconductor device
US6902867B2 (en) 2002-10-02 2005-06-07 Lexmark International, Inc. Ink jet printheads and methods therefor

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4507853A (en) * 1982-08-23 1985-04-02 Texas Instruments Incorporated Metallization process for integrated circuits
JPS59154040A (ja) * 1983-02-22 1984-09-03 Toshiba Corp 半導体装置の製造方法
US4453306A (en) * 1983-05-27 1984-06-12 At&T Bell Laboratories Fabrication of FETs
US4581815A (en) * 1984-03-01 1986-04-15 Advanced Micro Devices, Inc. Integrated circuit structure having intermediate metal silicide layer and method of making same
US4720908A (en) * 1984-07-11 1988-01-26 Texas Instruments Incorporated Process for making contacts and interconnects for holes having vertical sidewalls
US4751197A (en) * 1984-07-18 1988-06-14 Texas Instruments Incorporated Make-link programming of semiconductor devices using laser enhanced thermal breakdown of insulator
US4635347A (en) * 1985-03-29 1987-01-13 Advanced Micro Devices, Inc. Method of fabricating titanium silicide gate electrodes and interconnections
US4666737A (en) * 1986-02-11 1987-05-19 Harris Corporation Via metallization using metal fillets
JP2681887B2 (ja) * 1987-03-06 1997-11-26 シ−メンス、アクチエンゲゼルシヤフト ３次元１トランジスタメモリセル構造とその製法
US4935376A (en) * 1989-10-12 1990-06-19 At&T Bell Laboratories Making silicide gate level runners
US5026666A (en) * 1989-12-28 1991-06-25 At&T Bell Laboratories Method of making integrated circuits having a planarized dielectric

Also Published As

Publication number Publication date
JPH0684906A (ja) 1994-03-25
DE69228525T2 (de) 1999-08-12
EP0549199A2 (en) 1993-06-30
US5461005A (en) 1995-10-24
DE69228525D1 (de) 1999-04-08
EP0549199B1 (en) 1999-03-03
EP0549199A3 (enrdf_load_stackoverflow) 1994-08-03

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees