JP2513268Y2 - 半導体用冷却器 - Google Patents

半導体用冷却器

Info

Publication number
JP2513268Y2
JP2513268Y2 JP1989115646U JP11564689U JP2513268Y2 JP 2513268 Y2 JP2513268 Y2 JP 2513268Y2 JP 1989115646 U JP1989115646 U JP 1989115646U JP 11564689 U JP11564689 U JP 11564689U JP 2513268 Y2 JP2513268 Y2 JP 2513268Y2
Authority
JP
Japan
Prior art keywords
heat sink
heat
convex edge
joined
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989115646U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0353851U (enExample
Inventor
弘貴 柴田
隆幸 安武
Original Assignee
昭和アルミニウム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 昭和アルミニウム株式会社 filed Critical 昭和アルミニウム株式会社
Priority to JP1989115646U priority Critical patent/JP2513268Y2/ja
Publication of JPH0353851U publication Critical patent/JPH0353851U/ja
Application granted granted Critical
Publication of JP2513268Y2 publication Critical patent/JP2513268Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP1989115646U 1989-09-29 1989-09-29 半導体用冷却器 Expired - Lifetime JP2513268Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989115646U JP2513268Y2 (ja) 1989-09-29 1989-09-29 半導体用冷却器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989115646U JP2513268Y2 (ja) 1989-09-29 1989-09-29 半導体用冷却器

Publications (2)

Publication Number Publication Date
JPH0353851U JPH0353851U (enExample) 1991-05-24
JP2513268Y2 true JP2513268Y2 (ja) 1996-10-02

Family

ID=31663967

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989115646U Expired - Lifetime JP2513268Y2 (ja) 1989-09-29 1989-09-29 半導体用冷却器

Country Status (1)

Country Link
JP (1) JP2513268Y2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6695101B2 (ja) * 2015-05-20 2020-05-20 三菱電機株式会社 エレベータの制御装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61151393U (enExample) * 1985-03-08 1986-09-18
JPH0310695Y2 (enExample) * 1985-08-21 1991-03-15

Also Published As

Publication number Publication date
JPH0353851U (enExample) 1991-05-24

Similar Documents

Publication Publication Date Title
US6883592B2 (en) Heatsink for electronic component
US20020029876A1 (en) Corrugated matrix heat sink for cooling electronic components
JPH0955457A (ja) ヒートシンクおよびその製造方法
US20020196607A1 (en) Heat sink for electronic components
US6629561B2 (en) Module for a heat exchanger having improved thermal characteristics
US20090255649A1 (en) Radiating fin
JPS6123349A (ja) 放熱器
JPH034041Y2 (enExample)
JPH07218174A (ja) 放熱フィン
JP2615730B2 (ja) プレート式熱交換器
JPS6223091Y2 (enExample)
JP2834708B2 (ja) ピンフィン型ヒートシンクの製造方法及び軸流ファン付ピンフィン型ヒートシンクの製造方法
JP2584791Y2 (ja) ヒートシンク構造
JP3220724B2 (ja) ヒートシンク
JP2002050723A (ja) 放熱器
JPH056851U (ja) ヒートシンク
JP2000031353A (ja) 放熱器
JPH0338839Y2 (enExample)
JPH08172150A (ja) 放熱器
JP3434552B2 (ja) ヒートシンク
JP2526355B2 (ja) 放熱フィンの製造方法
JP3172779B2 (ja) 放熱器
JP4616458B2 (ja) 半導体素子用放熱器
JP3160633B2 (ja) プレートフィン型放熱器の製造方法
JPH0878585A (ja) 放熱器

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term