JP2513151Y2 - ボンディング装置 - Google Patents

ボンディング装置

Info

Publication number
JP2513151Y2
JP2513151Y2 JP1989085647U JP8564789U JP2513151Y2 JP 2513151 Y2 JP2513151 Y2 JP 2513151Y2 JP 1989085647 U JP1989085647 U JP 1989085647U JP 8564789 U JP8564789 U JP 8564789U JP 2513151 Y2 JP2513151 Y2 JP 2513151Y2
Authority
JP
Japan
Prior art keywords
image
image processing
camera
pad
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1989085647U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0325237U (enrdf_load_stackoverflow
Inventor
公路 西巻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Corp
Original Assignee
Kaijo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Corp filed Critical Kaijo Corp
Priority to JP1989085647U priority Critical patent/JP2513151Y2/ja
Publication of JPH0325237U publication Critical patent/JPH0325237U/ja
Application granted granted Critical
Publication of JP2513151Y2 publication Critical patent/JP2513151Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Image Processing (AREA)
  • Wire Bonding (AREA)
JP1989085647U 1989-07-24 1989-07-24 ボンディング装置 Expired - Fee Related JP2513151Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989085647U JP2513151Y2 (ja) 1989-07-24 1989-07-24 ボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989085647U JP2513151Y2 (ja) 1989-07-24 1989-07-24 ボンディング装置

Publications (2)

Publication Number Publication Date
JPH0325237U JPH0325237U (enrdf_load_stackoverflow) 1991-03-15
JP2513151Y2 true JP2513151Y2 (ja) 1996-10-02

Family

ID=31634888

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989085647U Expired - Fee Related JP2513151Y2 (ja) 1989-07-24 1989-07-24 ボンディング装置

Country Status (1)

Country Link
JP (1) JP2513151Y2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002157582A (ja) * 2000-11-21 2002-05-31 Matsushita Electric Ind Co Ltd 半導体ウエハ上のｉｃ傾き補正方法、及びｉｃ傾き補正装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS575342A (en) * 1980-06-11 1982-01-12 Fujitsu Ltd Pattern center position recognition system

Also Published As

Publication number Publication date
JPH0325237U (enrdf_load_stackoverflow) 1991-03-15

Similar Documents

Publication Publication Date Title
KR880000554B1 (ko) 자동조립 장치
JP2002024804A (ja) 部品認識データ作成方法及び作成装置並びに電子部品実装装置及び記録媒体
EP1264334B1 (en) Method and apparatus for aligning a component on a substrate using digital feature separation
US7555831B2 (en) Method of validating component feeder exchanges
US6250534B1 (en) Wire bonding method
JP2513151Y2 (ja) ボンディング装置
JP3678895B2 (ja) 電子部品装着装置
JPH0613443A (ja) 半導体装置の製造装置
JPH08162503A (ja) 電子部品の位置合わせ方法及びその装置
JP3020191B2 (ja) ボンデイング座標のティーチング方法及びティーチング手段
US6141599A (en) Method for setting conveying data for a lead frame
JP2008139260A (ja) 画像表示装置、外観検査装置、クリーム半田印刷機、及び画像表示方法
JP2005175307A (ja) 部品認識方法、部品認識装置、表面実装機、部品試験装置および基板検査装置
JPS6240852B2 (enrdf_load_stackoverflow)
JP4271908B2 (ja) ダイピックアップ装置及びダイピックアップ方法
JP2008112931A (ja) 電子部品装着装置
JPH058678Y2 (enrdf_load_stackoverflow)
JP2022072250A (ja) 部品実装装置用撮像装置の傷画素処理方法および部品実装装置用撮像装置ならびに部品実装装置
JPS6286790A (ja) ガイドプレ−ト位置決め装置
JP2002185199A (ja) 電子部品実装装置におけるプログラムのマーク位置修正方法および装置
JPH09232363A (ja) 半導体チップの位置合せ方法およびボンディング装置
JPS61294508A (ja) 半導体ペレットの位置決め装置
JP4908375B2 (ja) 電子部品装着方法及び電子部品装着装置
JPS5923107B2 (ja) ワイヤボンダにおける位置検出方法
JPH05265027A (ja) 位置決め方法及びその装置

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees