JP2511330Y2 - 流体移送管 - Google Patents

流体移送管

Info

Publication number
JP2511330Y2
JP2511330Y2 JP2857090U JP2857090U JP2511330Y2 JP 2511330 Y2 JP2511330 Y2 JP 2511330Y2 JP 2857090 U JP2857090 U JP 2857090U JP 2857090 U JP2857090 U JP 2857090U JP 2511330 Y2 JP2511330 Y2 JP 2511330Y2
Authority
JP
Japan
Prior art keywords
tubular member
vacuum chamber
fluid transfer
transfer pipe
metal bellows
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2857090U
Other languages
English (en)
Japanese (ja)
Other versions
JPH03119696U (enrdf_load_stackoverflow
Inventor
哲哉 後藤
英夫 三田
由平 城下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aisin Corp
Original Assignee
Aisin Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aisin Seiki Co Ltd filed Critical Aisin Seiki Co Ltd
Priority to JP2857090U priority Critical patent/JP2511330Y2/ja
Publication of JPH03119696U publication Critical patent/JPH03119696U/ja
Application granted granted Critical
Publication of JP2511330Y2 publication Critical patent/JP2511330Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2853Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49572Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Joints Allowing Movement (AREA)
  • Pipeline Systems (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
JP2857090U 1990-03-21 1990-03-21 流体移送管 Expired - Lifetime JP2511330Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2857090U JP2511330Y2 (ja) 1990-03-21 1990-03-21 流体移送管

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2857090U JP2511330Y2 (ja) 1990-03-21 1990-03-21 流体移送管

Publications (2)

Publication Number Publication Date
JPH03119696U JPH03119696U (enrdf_load_stackoverflow) 1991-12-10
JP2511330Y2 true JP2511330Y2 (ja) 1996-09-25

Family

ID=12252282

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2857090U Expired - Lifetime JP2511330Y2 (ja) 1990-03-21 1990-03-21 流体移送管

Country Status (1)

Country Link
JP (1) JP2511330Y2 (enrdf_load_stackoverflow)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5948914B2 (ja) 2012-02-01 2016-07-06 セイコーエプソン株式会社 ロボット制御装置、ロボット制御方法、ロボット制御プログラムおよびロボットシステム

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5948914B2 (ja) 2012-02-01 2016-07-06 セイコーエプソン株式会社 ロボット制御装置、ロボット制御方法、ロボット制御プログラムおよびロボットシステム

Also Published As

Publication number Publication date
JPH03119696U (enrdf_load_stackoverflow) 1991-12-10

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