JP2511330Y2 - 流体移送管 - Google Patents
流体移送管Info
- Publication number
- JP2511330Y2 JP2511330Y2 JP2857090U JP2857090U JP2511330Y2 JP 2511330 Y2 JP2511330 Y2 JP 2511330Y2 JP 2857090 U JP2857090 U JP 2857090U JP 2857090 U JP2857090 U JP 2857090U JP 2511330 Y2 JP2511330 Y2 JP 2511330Y2
- Authority
- JP
- Japan
- Prior art keywords
- tubular member
- vacuum chamber
- fluid transfer
- transfer pipe
- metal bellows
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000012530 fluid Substances 0.000 title claims description 29
- 239000002184 metal Substances 0.000 claims description 29
- 230000002093 peripheral effect Effects 0.000 claims description 12
- 230000001105 regulatory effect Effects 0.000 claims description 5
- 239000007789 gas Substances 0.000 description 12
- 239000001307 helium Substances 0.000 description 12
- 229910052734 helium Inorganic materials 0.000 description 12
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 12
- 238000001816 cooling Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 238000005452 bending Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Joints Allowing Movement (AREA)
- Pipeline Systems (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2857090U JP2511330Y2 (ja) | 1990-03-21 | 1990-03-21 | 流体移送管 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2857090U JP2511330Y2 (ja) | 1990-03-21 | 1990-03-21 | 流体移送管 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03119696U JPH03119696U (enrdf_load_stackoverflow) | 1991-12-10 |
JP2511330Y2 true JP2511330Y2 (ja) | 1996-09-25 |
Family
ID=12252282
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2857090U Expired - Lifetime JP2511330Y2 (ja) | 1990-03-21 | 1990-03-21 | 流体移送管 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2511330Y2 (enrdf_load_stackoverflow) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5948914B2 (ja) | 2012-02-01 | 2016-07-06 | セイコーエプソン株式会社 | ロボット制御装置、ロボット制御方法、ロボット制御プログラムおよびロボットシステム |
-
1990
- 1990-03-21 JP JP2857090U patent/JP2511330Y2/ja not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5948914B2 (ja) | 2012-02-01 | 2016-07-06 | セイコーエプソン株式会社 | ロボット制御装置、ロボット制御方法、ロボット制御プログラムおよびロボットシステム |
Also Published As
Publication number | Publication date |
---|---|
JPH03119696U (enrdf_load_stackoverflow) | 1991-12-10 |
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