JP2509045Y2 - 放熱用板ばね - Google Patents

放熱用板ばね

Info

Publication number
JP2509045Y2
JP2509045Y2 JP1990087959U JP8795990U JP2509045Y2 JP 2509045 Y2 JP2509045 Y2 JP 2509045Y2 JP 1990087959 U JP1990087959 U JP 1990087959U JP 8795990 U JP8795990 U JP 8795990U JP 2509045 Y2 JP2509045 Y2 JP 2509045Y2
Authority
JP
Japan
Prior art keywords
leaf spring
flat portion
heat dissipation
spring
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1990087959U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0446556U (enExample
Inventor
淳一 中山
Original Assignee
富士通機電株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通機電株式会社 filed Critical 富士通機電株式会社
Priority to JP1990087959U priority Critical patent/JP2509045Y2/ja
Publication of JPH0446556U publication Critical patent/JPH0446556U/ja
Application granted granted Critical
Publication of JP2509045Y2 publication Critical patent/JP2509045Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1990087959U 1990-08-24 1990-08-24 放熱用板ばね Expired - Fee Related JP2509045Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990087959U JP2509045Y2 (ja) 1990-08-24 1990-08-24 放熱用板ばね

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990087959U JP2509045Y2 (ja) 1990-08-24 1990-08-24 放熱用板ばね

Publications (2)

Publication Number Publication Date
JPH0446556U JPH0446556U (enExample) 1992-04-21
JP2509045Y2 true JP2509045Y2 (ja) 1996-08-28

Family

ID=31820785

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990087959U Expired - Fee Related JP2509045Y2 (ja) 1990-08-24 1990-08-24 放熱用板ばね

Country Status (1)

Country Link
JP (1) JP2509045Y2 (enExample)

Also Published As

Publication number Publication date
JPH0446556U (enExample) 1992-04-21

Similar Documents

Publication Publication Date Title
JPH08114625A (ja) 高温測定用プローブカード
JPH03502150A (ja) 電気回路カード用の冷却体および該冷却体を電子装置に配列する方法
JPS6390159A (ja) 集積回路接続装置
JP2000208680A (ja) 電子素子パッケ―ジをヒ―トシンクに取り付ける器具
JP2766068B2 (ja) 電子装置におけるヒートシンクの取り外し方法
KR0155843B1 (ko) 반도체장치
JPH05326761A (ja) 熱伝導スペーサーの実装構造
JP2531463Y2 (ja) サーマルヘッド
JP2595957B2 (ja) Ｌｓｉケースの冷却構造
JPH0621286A (ja) 吸熱源
JP3786207B2 (ja) 半導体部品の放熱機構
JP2823186B2 (ja) 電子機器
JPH05315483A (ja) プリント配線板装着素子の放熱フィンへの固定方法
JP2025528598A (ja) Ｍ．２アセンブリとアセンブリホルダとを備えるデバイス及び対応する製造方法
JPH0846128A (ja) 半導体装置
JPH04105595U (ja) 放熱フインの取付構造
JPH10256444A (ja) 半導体部品のヒートシンク構造体
JPS5972739U (ja) 放熱フイン
JP2002246780A (ja) プリント基板へのヒートシンク取付方法
JPH0529153U (ja) 半導体の放熱構造
JPH06181395A (ja) 放熱形プリント配線板
JPH02172263A (ja) 集積回路の冷却構造
JPH0536295Y2 (enExample)
JP2510143B2 (ja) 放熱器
JP2508840B2 (ja) ヒ―トシンクの取付構造

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees