JP2505661Y2 - 接着剤塗布装置 - Google Patents
接着剤塗布装置Info
- Publication number
- JP2505661Y2 JP2505661Y2 JP5315990U JP5315990U JP2505661Y2 JP 2505661 Y2 JP2505661 Y2 JP 2505661Y2 JP 5315990 U JP5315990 U JP 5315990U JP 5315990 U JP5315990 U JP 5315990U JP 2505661 Y2 JP2505661 Y2 JP 2505661Y2
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- adhesive
- nozzle member
- holder
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5315990U JP2505661Y2 (ja) | 1990-05-22 | 1990-05-22 | 接着剤塗布装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5315990U JP2505661Y2 (ja) | 1990-05-22 | 1990-05-22 | 接着剤塗布装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0412639U JPH0412639U (uk) | 1992-01-31 |
JP2505661Y2 true JP2505661Y2 (ja) | 1996-07-31 |
Family
ID=31574109
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5315990U Expired - Fee Related JP2505661Y2 (ja) | 1990-05-22 | 1990-05-22 | 接着剤塗布装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2505661Y2 (uk) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0197729U (uk) * | 1987-12-21 | 1989-06-29 | ||
JP3004951U (ja) * | 1994-06-03 | 1994-12-06 | 株式会社山口工業 | 自動車の塗装面前処理装置 |
-
1990
- 1990-05-22 JP JP5315990U patent/JP2505661Y2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH0412639U (uk) | 1992-01-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5254362A (en) | Method and apparatus for deposition of solder paste on a printed wiring board | |
EP1134034B1 (en) | Method of forming paste | |
JP2505661Y2 (ja) | 接着剤塗布装置 | |
JPS5944907B2 (ja) | 液体塗布装置 | |
JPH01253295A (ja) | 配線基板上への接着剤塗布方法 | |
CN108747125A (zh) | 一种手机零件自动化焊接系统 | |
JPS625251Y2 (uk) | ||
JPH07212023A (ja) | 半田ボール供給方法及びその半田ボール供給方法に用いる半田ボール供給治具 | |
JP3044720B2 (ja) | ロケートピンによるワーク位置決め方法 | |
JPH10209632A (ja) | 部品実装システムにおけるディスペンサ | |
KR100197858B1 (ko) | 리드 프레임에 스크린 프린트 기법을 이용한 개선된 칩 부착방법 | |
JPH04210267A (ja) | 外部端子接続用導電性ペーストの塗着装置 | |
JPH0410085Y2 (uk) | ||
CN211726430U (zh) | 一种具有翻转晾晒机构的点胶机晾干机构 | |
KR20000023113A (ko) | 플럭스전사장치 및 플럭스전사방법 | |
JPH07245472A (ja) | 粘性流体塗布方法及びそれを使用した部品装着装置 | |
JPS58139457A (ja) | 噴流半田槽 | |
JPS60206464A (ja) | 高粘度液体供給方法およびその装置 | |
JPS6331734Y2 (uk) | ||
JPH0246071Y2 (uk) | ||
JPS63126668A (ja) | 半田ペ−スト塗布装置 | |
JP2536158B2 (ja) | 絶縁剤の塗布装置 | |
JPH0843837A (ja) | 液晶接着剤塗布装置 | |
JPS5987900A (ja) | 電子部品実装装置 | |
JP3282287B2 (ja) | フラックス転写装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |