JP2505196Y2 - 樹脂モ―ルド型半導体装置 - Google Patents

樹脂モ―ルド型半導体装置

Info

Publication number
JP2505196Y2
JP2505196Y2 JP1990087606U JP8760690U JP2505196Y2 JP 2505196 Y2 JP2505196 Y2 JP 2505196Y2 JP 1990087606 U JP1990087606 U JP 1990087606U JP 8760690 U JP8760690 U JP 8760690U JP 2505196 Y2 JP2505196 Y2 JP 2505196Y2
Authority
JP
Japan
Prior art keywords
resin
hole
semiconductor device
heat sink
semiconductor pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1990087606U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0446552U (sr
Inventor
和洋 井上
Original Assignee
関西日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 関西日本電気株式会社 filed Critical 関西日本電気株式会社
Priority to JP1990087606U priority Critical patent/JP2505196Y2/ja
Publication of JPH0446552U publication Critical patent/JPH0446552U/ja
Application granted granted Critical
Publication of JP2505196Y2 publication Critical patent/JP2505196Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1990087606U 1990-08-21 1990-08-21 樹脂モ―ルド型半導体装置 Expired - Fee Related JP2505196Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990087606U JP2505196Y2 (ja) 1990-08-21 1990-08-21 樹脂モ―ルド型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990087606U JP2505196Y2 (ja) 1990-08-21 1990-08-21 樹脂モ―ルド型半導体装置

Publications (2)

Publication Number Publication Date
JPH0446552U JPH0446552U (sr) 1992-04-21
JP2505196Y2 true JP2505196Y2 (ja) 1996-07-24

Family

ID=31820092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990087606U Expired - Fee Related JP2505196Y2 (ja) 1990-08-21 1990-08-21 樹脂モ―ルド型半導体装置

Country Status (1)

Country Link
JP (1) JP2505196Y2 (sr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10504817B2 (en) 2017-09-06 2019-12-10 Mitsubishi Electric Corporation Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10504817B2 (en) 2017-09-06 2019-12-10 Mitsubishi Electric Corporation Semiconductor device

Also Published As

Publication number Publication date
JPH0446552U (sr) 1992-04-21

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