JP2503898Y2 - サ―マルヘッド - Google Patents
サ―マルヘッドInfo
- Publication number
- JP2503898Y2 JP2503898Y2 JP7323488U JP7323488U JP2503898Y2 JP 2503898 Y2 JP2503898 Y2 JP 2503898Y2 JP 7323488 U JP7323488 U JP 7323488U JP 7323488 U JP7323488 U JP 7323488U JP 2503898 Y2 JP2503898 Y2 JP 2503898Y2
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- power supply
- integrated circuit
- control
- heating element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 107
- 238000010438 heat treatment Methods 0.000 claims description 36
- 239000000758 substrate Substances 0.000 claims description 33
- 239000000919 ceramic Substances 0.000 description 21
- 238000010586 diagram Methods 0.000 description 6
- 238000007639 printing Methods 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000020169 heat generation Effects 0.000 description 4
- 230000003014 reinforcing effect Effects 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000007651 thermal printing Methods 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7323488U JP2503898Y2 (ja) | 1988-05-31 | 1988-05-31 | サ―マルヘッド |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7323488U JP2503898Y2 (ja) | 1988-05-31 | 1988-05-31 | サ―マルヘッド |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01175830U JPH01175830U (enrdf_load_stackoverflow) | 1989-12-14 |
| JP2503898Y2 true JP2503898Y2 (ja) | 1996-07-03 |
Family
ID=31298381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7323488U Expired - Lifetime JP2503898Y2 (ja) | 1988-05-31 | 1988-05-31 | サ―マルヘッド |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2503898Y2 (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5375198B2 (ja) * | 2008-03-07 | 2013-12-25 | セイコーエプソン株式会社 | ヘッド基板およびサーマルヘッド基板 |
| JP5834441B2 (ja) * | 2011-03-25 | 2015-12-24 | セイコーエプソン株式会社 | サーマルヘッドおよびサーマルプリンター |
| JP2012228871A (ja) * | 2011-04-13 | 2012-11-22 | Rohm Co Ltd | サーマルヘッドおよびサーマルヘッドの製造方法 |
-
1988
- 1988-05-31 JP JP7323488U patent/JP2503898Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01175830U (enrdf_load_stackoverflow) | 1989-12-14 |
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