JP2503238Y2 - ワイヤ―ソ― - Google Patents
ワイヤ―ソ―Info
- Publication number
- JP2503238Y2 JP2503238Y2 JP40664490U JP40664490U JP2503238Y2 JP 2503238 Y2 JP2503238 Y2 JP 2503238Y2 JP 40664490 U JP40664490 U JP 40664490U JP 40664490 U JP40664490 U JP 40664490U JP 2503238 Y2 JP2503238 Y2 JP 2503238Y2
- Authority
- JP
- Japan
- Prior art keywords
- sleeve
- beads
- wire rope
- wire
- fixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011324 bead Substances 0.000 claims description 15
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 229910000831 Steel Inorganic materials 0.000 claims 1
- 239000010959 steel Substances 0.000 claims 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 229910020630 Co Ni Inorganic materials 0.000 description 3
- 229910002440 Co–Ni Inorganic materials 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP40664490U JP2503238Y2 (ja) | 1990-12-21 | 1990-12-21 | ワイヤ―ソ― |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP40664490U JP2503238Y2 (ja) | 1990-12-21 | 1990-12-21 | ワイヤ―ソ― |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0492723U JPH0492723U (enExample) | 1992-08-12 |
| JP2503238Y2 true JP2503238Y2 (ja) | 1996-06-26 |
Family
ID=31883809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP40664490U Expired - Lifetime JP2503238Y2 (ja) | 1990-12-21 | 1990-12-21 | ワイヤ―ソ― |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2503238Y2 (enExample) |
-
1990
- 1990-12-21 JP JP40664490U patent/JP2503238Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0492723U (enExample) | 1992-08-12 |
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