JP2502867Y2 - プリント板の絶縁層塗布装置 - Google Patents

プリント板の絶縁層塗布装置

Info

Publication number
JP2502867Y2
JP2502867Y2 JP1990010388U JP1038890U JP2502867Y2 JP 2502867 Y2 JP2502867 Y2 JP 2502867Y2 JP 1990010388 U JP1990010388 U JP 1990010388U JP 1038890 U JP1038890 U JP 1038890U JP 2502867 Y2 JP2502867 Y2 JP 2502867Y2
Authority
JP
Japan
Prior art keywords
printed board
liquid
weir
coating tank
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990010388U
Other languages
English (en)
Japanese (ja)
Other versions
JPH03101574U (enrdf_load_stackoverflow
Inventor
忠良 座間
好信 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP1990010388U priority Critical patent/JP2502867Y2/ja
Publication of JPH03101574U publication Critical patent/JPH03101574U/ja
Application granted granted Critical
Publication of JP2502867Y2 publication Critical patent/JP2502867Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Coating Apparatus (AREA)
JP1990010388U 1990-02-05 1990-02-05 プリント板の絶縁層塗布装置 Expired - Lifetime JP2502867Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990010388U JP2502867Y2 (ja) 1990-02-05 1990-02-05 プリント板の絶縁層塗布装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990010388U JP2502867Y2 (ja) 1990-02-05 1990-02-05 プリント板の絶縁層塗布装置

Publications (2)

Publication Number Publication Date
JPH03101574U JPH03101574U (enrdf_load_stackoverflow) 1991-10-23
JP2502867Y2 true JP2502867Y2 (ja) 1996-06-26

Family

ID=31513959

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990010388U Expired - Lifetime JP2502867Y2 (ja) 1990-02-05 1990-02-05 プリント板の絶縁層塗布装置

Country Status (1)

Country Link
JP (1) JP2502867Y2 (enrdf_load_stackoverflow)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS632139Y2 (enrdf_load_stackoverflow) * 1985-11-05 1988-01-20
JPS63205171A (ja) * 1987-02-20 1988-08-24 Ideya:Kk 樹脂コ−テイング装置
JPH02214194A (ja) * 1989-02-14 1990-08-27 Tokai Rika Co Ltd プリント基板の防湿層形成装置

Also Published As

Publication number Publication date
JPH03101574U (enrdf_load_stackoverflow) 1991-10-23

Similar Documents

Publication Publication Date Title
DE2755926A1 (de) Schaltungsplatine sowie verfahren zu ihrer herstellung
JP2502867Y2 (ja) プリント板の絶縁層塗布装置
JPH0644178U (ja) 回路基板
US5266113A (en) Dispenser for applying solder
KR20010053093A (ko) 인쇄 회로판 또는 유사한 기판의 피복 방법
US3434455A (en) Apparatus for tinning printed circuitry
JPH0636899B2 (ja) 電子部品端部のペースト塗布方法
JPS63316445A (ja) 混成集積回路の外装形成方法
JPH0514515Y2 (enrdf_load_stackoverflow)
JPH0710976U (ja) 基板のレジスト塗布構造
DE3931238C2 (enrdf_load_stackoverflow)
KR930002815B1 (ko) 리드 프레임의 제조방법
KR0175423B1 (ko) 플립 칩 랜드 인쇄 마스크
JPH025552Y2 (enrdf_load_stackoverflow)
JPS6214687Y2 (enrdf_load_stackoverflow)
JPH01290291A (ja) 印刷配線板の製造方法
JPH03295238A (ja) 基板の処理装置
JPS60126893A (ja) プリント基板の防水処理方法
JPH06177028A (ja) ホトレジスト塗布用回路基板支持具及び該支持具を用いたホトレジストの塗布方法
JPH1146069A (ja) 絶縁層形成装置
JPS6214686Y2 (enrdf_load_stackoverflow)
JPH0526765Y2 (enrdf_load_stackoverflow)
JPS59999B2 (ja) プリント板の半田付け方法
KR0138461Y1 (ko) 슬릿 홈을 이용한 디핑장치
JPS60135930A (ja) フイルム状感光材の構造