JP2026047085A5 - - Google Patents

Info

Publication number
JP2026047085A5
JP2026047085A5 JP2025073494A JP2025073494A JP2026047085A5 JP 2026047085 A5 JP2026047085 A5 JP 2026047085A5 JP 2025073494 A JP2025073494 A JP 2025073494A JP 2025073494 A JP2025073494 A JP 2025073494A JP 2026047085 A5 JP2026047085 A5 JP 2026047085A5
Authority
JP
Japan
Prior art keywords
layer
metal
insulating material
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025073494A
Other languages
English (en)
Japanese (ja)
Other versions
JP2026047085A (ja
Filing date
Publication date
Priority claimed from KR1020240117346A external-priority patent/KR20260031767A/ko
Application filed filed Critical
Publication of JP2026047085A publication Critical patent/JP2026047085A/ja
Publication of JP2026047085A5 publication Critical patent/JP2026047085A5/ja
Pending legal-status Critical Current

Links

JP2025073494A 2024-08-30 2025-04-25 プリント回路基板 Pending JP2026047085A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2024-0117346 2024-08-30
KR1020240117346A KR20260031767A (ko) 2024-08-30 2024-08-30 인쇄회로기판

Publications (2)

Publication Number Publication Date
JP2026047085A JP2026047085A (ja) 2026-03-13
JP2026047085A5 true JP2026047085A5 (https=) 2026-03-23

Family

ID=98899332

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025073494A Pending JP2026047085A (ja) 2024-08-30 2025-04-25 プリント回路基板

Country Status (4)

Country Link
US (1) US20260068048A1 (https=)
JP (1) JP2026047085A (https=)
KR (1) KR20260031767A (https=)
CN (1) CN121645672A (https=)

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