JP2025515434A5 - - Google Patents
Info
- Publication number
- JP2025515434A5 JP2025515434A5 JP2024560858A JP2024560858A JP2025515434A5 JP 2025515434 A5 JP2025515434 A5 JP 2025515434A5 JP 2024560858 A JP2024560858 A JP 2024560858A JP 2024560858 A JP2024560858 A JP 2024560858A JP 2025515434 A5 JP2025515434 A5 JP 2025515434A5
- Authority
- JP
- Japan
- Prior art keywords
- die
- protective layer
- wafer
- sidewall
- trench
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/661,029 | 2022-04-27 | ||
| US17/661,029 US20230352423A1 (en) | 2022-04-27 | 2022-04-27 | Die edge protection to eliminate die chipping |
| PCT/US2023/063196 WO2023212440A1 (en) | 2022-04-27 | 2023-02-24 | Die edge protection to eliminate die chipping |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2025515434A JP2025515434A (ja) | 2025-05-15 |
| JP2025515434A5 true JP2025515434A5 (cg-RX-API-DMAC7.html) | 2026-02-10 |
Family
ID=85706815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024560858A Pending JP2025515434A (ja) | 2022-04-27 | 2023-02-24 | ダイチッピングを解消するためのダイエッジ保護 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20230352423A1 (cg-RX-API-DMAC7.html) |
| EP (1) | EP4515592A1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP2025515434A (cg-RX-API-DMAC7.html) |
| KR (1) | KR20250005122A (cg-RX-API-DMAC7.html) |
| CN (1) | CN119173998A (cg-RX-API-DMAC7.html) |
| TW (1) | TW202410179A (cg-RX-API-DMAC7.html) |
| WO (1) | WO2023212440A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118843312A (zh) * | 2023-04-23 | 2024-10-25 | 长江存储科技有限责任公司 | 存储器及其制作方法、存储系统 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7338836B2 (en) * | 2003-11-05 | 2008-03-04 | California Institute Of Technology | Method for integrating pre-fabricated chip structures into functional electronic systems |
| US7566634B2 (en) * | 2004-09-24 | 2009-07-28 | Interuniversitair Microelektronica Centrum (Imec) | Method for chip singulation |
| US20080197474A1 (en) * | 2007-02-16 | 2008-08-21 | Advanced Chip Engineering Technology Inc. | Semiconductor device package with multi-chips and method of the same |
| US20080197478A1 (en) * | 2007-02-21 | 2008-08-21 | Wen-Kun Yang | Semiconductor device package with die receiving through-hole and connecting through-hole and method of the same |
| US7525185B2 (en) * | 2007-03-19 | 2009-04-28 | Advanced Chip Engineering Technology, Inc. | Semiconductor device package having multi-chips with side-by-side configuration and method of the same |
| US8183095B2 (en) * | 2010-03-12 | 2012-05-22 | Stats Chippac, Ltd. | Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation |
| US20120112336A1 (en) * | 2010-11-05 | 2012-05-10 | Guzek John S | Encapsulated die, microelectronic package containing same, and method of manufacturing said microelectronic package |
| US9508623B2 (en) * | 2014-06-08 | 2016-11-29 | UTAC Headquarters Pte. Ltd. | Semiconductor packages and methods of packaging semiconductor devices |
| US9711463B2 (en) * | 2015-01-14 | 2017-07-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Dicing method for power transistors |
| US9459500B2 (en) * | 2015-02-09 | 2016-10-04 | Omnivision Technologies, Inc. | Liquid crystal on silicon panels and associated methods |
| JP2016192509A (ja) * | 2015-03-31 | 2016-11-10 | Koa株式会社 | チップ抵抗器 |
| EP3332429B1 (en) * | 2015-08-03 | 2023-10-18 | Lumileds LLC | Semiconductor light emitting device with reflective side coating |
| US9892989B1 (en) * | 2016-12-08 | 2018-02-13 | Nxp B.V. | Wafer-level chip scale package with side protection |
| CN108695265A (zh) * | 2017-04-11 | 2018-10-23 | 财团法人工业技术研究院 | 芯片封装结构及其制造方法 |
| CN109300794B (zh) * | 2017-07-25 | 2021-02-02 | 中芯国际集成电路制造(上海)有限公司 | 封装结构及其形成方法 |
| US11361970B2 (en) * | 2017-08-17 | 2022-06-14 | Semiconductor Components Industries, Llc | Silicon-on-insulator die support structures and related methods |
| US10410978B2 (en) * | 2018-01-24 | 2019-09-10 | Sanken Electric Co., Ltd. | Semiconductor wafer and method for forming semiconductor |
| US11164848B2 (en) * | 2019-06-20 | 2021-11-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor structure and method manufacturing the same |
| US11289396B2 (en) * | 2019-09-29 | 2022-03-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Sensing component encapsulated by an encapsulation layer with a roughness surface having a hollow region |
| EP3823016A1 (en) * | 2019-11-12 | 2021-05-19 | Infineon Technologies AG | Semiconductor package with a semiconductor die |
| KR102218988B1 (ko) * | 2020-04-21 | 2021-02-23 | (주)라이타이저 | Led칩 전사용 감광성 전사 수지, 그 감광성 전사 수지를 이용한 led칩 전사 방법 및 이를 이용한 디스플레이 장치의 제조 방법 |
| US11393720B2 (en) * | 2020-06-15 | 2022-07-19 | Micron Technology, Inc. | Die corner protection by using polymer deposition technology |
| US11552074B2 (en) * | 2020-06-15 | 2023-01-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package structures and methods of fabricating the same |
| US11450581B2 (en) * | 2020-08-26 | 2022-09-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integrated circuit package and method |
| US12198998B2 (en) * | 2021-12-09 | 2025-01-14 | Nxp B.V. | Dielectric sidewall protection and sealing for semiconductor devices in a in wafer level packaging process |
| US12228776B2 (en) * | 2022-01-31 | 2025-02-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Package with integrated optical die and method forming same |
-
2022
- 2022-04-27 US US17/661,029 patent/US20230352423A1/en active Pending
-
2023
- 2023-02-23 TW TW112106771A patent/TW202410179A/zh unknown
- 2023-02-24 CN CN202380033594.3A patent/CN119173998A/zh active Pending
- 2023-02-24 WO PCT/US2023/063196 patent/WO2023212440A1/en not_active Ceased
- 2023-02-24 EP EP23712423.5A patent/EP4515592A1/en active Pending
- 2023-02-24 KR KR1020247034056A patent/KR20250005122A/ko active Pending
- 2023-02-24 JP JP2024560858A patent/JP2025515434A/ja active Pending
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