JP2025512614A - 選択的堆積のための高純度アルキン類 - Google Patents
選択的堆積のための高純度アルキン類 Download PDFInfo
- Publication number
- JP2025512614A JP2025512614A JP2024550557A JP2024550557A JP2025512614A JP 2025512614 A JP2025512614 A JP 2025512614A JP 2024550557 A JP2024550557 A JP 2024550557A JP 2024550557 A JP2024550557 A JP 2024550557A JP 2025512614 A JP2025512614 A JP 2025512614A
- Authority
- JP
- Japan
- Prior art keywords
- alkynes
- high purity
- plasma
- ppm
- purity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C11/00—Aliphatic unsaturated hydrocarbons
- C07C11/22—Aliphatic unsaturated hydrocarbons containing carbon-to-carbon triple bonds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4404—Coatings or surface treatment on the inside of the reaction chamber or on parts thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45527—Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations
- C23C16/45534—Use of auxiliary reactants other than used for contributing to the composition of the main film, e.g. catalysts, activators or scavengers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45553—Atomic layer deposition [ALD] characterized by the use of precursors specially adapted for ALD
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202263268553P | 2022-02-25 | 2022-02-25 | |
| US63/268,553 | 2022-02-25 | ||
| PCT/US2023/063089 WO2023164524A1 (en) | 2022-02-25 | 2023-02-23 | High-purity alkynes for selective deposition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2025512614A true JP2025512614A (ja) | 2025-04-18 |
| JP2025512614A5 JP2025512614A5 (https=) | 2025-12-02 |
Family
ID=85778822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024550557A Pending JP2025512614A (ja) | 2022-02-25 | 2023-02-23 | 選択的堆積のための高純度アルキン類 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US12503760B2 (https=) |
| EP (2) | EP4707426A3 (https=) |
| JP (1) | JP2025512614A (https=) |
| KR (2) | KR20250172900A (https=) |
| CN (1) | CN118742531A (https=) |
| IL (2) | IL314348B1 (https=) |
| TW (1) | TW202342800A (https=) |
| WO (1) | WO2023164524A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4707426A3 (en) | 2022-02-25 | 2026-05-06 | Merck Patent GmbH | High-purity alkynes for selective deposition |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200347493A1 (en) * | 2019-05-05 | 2020-11-05 | Applied Materials, Inc. | Reverse Selective Deposition |
| WO2021141876A1 (en) * | 2020-01-10 | 2021-07-15 | Applied Materials, Inc. | Catalyst enhanced seamless ruthenium gap fill |
| WO2021183728A1 (en) * | 2020-03-11 | 2021-09-16 | Applied Materials, Inc. | Gap fill methods using catalyzed deposition |
| WO2022108710A1 (en) * | 2020-10-27 | 2022-05-27 | Applied Materials, Inc. | Area-selective atomic layer deposition of passivation layers |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR642170A (fr) | 1926-10-14 | 1928-08-22 | Procédé de fabrication d'hydrocarbures à partir du carbure de calcium | |
| BE790434A (fr) * | 1971-10-21 | 1973-04-24 | Sherwin Williams Co | Procede de synthese d'alcynes par dehydrohalogenation |
| DD240198A1 (de) * | 1985-08-12 | 1986-10-22 | Akad Wissenschaften Ddr | Verfahren zur katalytischen cyclisierung von alkinen |
| US20040102647A1 (en) | 2000-08-28 | 2004-05-27 | Christian Everett | Acetaldehyde dehydration to produce ethyne |
| US8993055B2 (en) * | 2005-10-27 | 2015-03-31 | Asm International N.V. | Enhanced thin film deposition |
| CN101495672B (zh) * | 2006-11-02 | 2011-12-07 | 高级技术材料公司 | 对于金属薄膜的cvd/ald有用的锑及锗复合物 |
| US8642797B2 (en) * | 2010-02-25 | 2014-02-04 | Air Products And Chemicals, Inc. | Amidate precursors for depositing metal containing films |
| CN102701896B (zh) * | 2012-06-06 | 2014-06-25 | 西南石油大学 | 一种用于乙炔净化的复合溶剂及其净化方法 |
| US20160064275A1 (en) | 2014-08-27 | 2016-03-03 | Applied Materials, Inc. | Selective Deposition With Alcohol Selective Reduction And Protection |
| CN112301373A (zh) * | 2020-10-24 | 2021-02-02 | 西北工业大学 | 一种电催化选择性还原烯烃中炔烃杂质的方法 |
| CN113563164B (zh) * | 2021-09-02 | 2024-01-09 | 南华大学 | 一种炔酮类化合物的制备方法 |
| EP4707426A3 (en) | 2022-02-25 | 2026-05-06 | Merck Patent GmbH | High-purity alkynes for selective deposition |
-
2023
- 2023-02-23 EP EP26151639.7A patent/EP4707426A3/en active Pending
- 2023-02-23 CN CN202380023076.3A patent/CN118742531A/zh active Pending
- 2023-02-23 KR KR1020257039634A patent/KR20250172900A/ko active Pending
- 2023-02-23 WO PCT/US2023/063089 patent/WO2023164524A1/en not_active Ceased
- 2023-02-23 EP EP23714024.9A patent/EP4482816A1/en active Pending
- 2023-02-23 IL IL314348A patent/IL314348B1/en unknown
- 2023-02-23 KR KR1020247031220A patent/KR20240154023A/ko active Pending
- 2023-02-23 JP JP2024550557A patent/JP2025512614A/ja active Pending
- 2023-02-23 US US18/729,211 patent/US12503760B2/en active Active
- 2023-02-23 TW TW112106745A patent/TW202342800A/zh unknown
- 2023-02-23 IL IL326838A patent/IL326838A/en unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200347493A1 (en) * | 2019-05-05 | 2020-11-05 | Applied Materials, Inc. | Reverse Selective Deposition |
| WO2021141876A1 (en) * | 2020-01-10 | 2021-07-15 | Applied Materials, Inc. | Catalyst enhanced seamless ruthenium gap fill |
| WO2021183728A1 (en) * | 2020-03-11 | 2021-09-16 | Applied Materials, Inc. | Gap fill methods using catalyzed deposition |
| WO2022108710A1 (en) * | 2020-10-27 | 2022-05-27 | Applied Materials, Inc. | Area-selective atomic layer deposition of passivation layers |
Non-Patent Citations (2)
| Title |
|---|
| ZABA,TOMASZ ET AL., J. AM. CHEM. SOC., vol. 136, JPN6026014220, 2014, pages 11918 - 11921, ISSN: 0005840605 * |
| ZHANG, YI-QI ET AL., NATURE COMMUNICATIONS, vol. 3:1286, JPN6026014219, 2012, pages 1 - 8, ISSN: 0005840606 * |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202342800A (zh) | 2023-11-01 |
| IL314348B1 (en) | 2026-04-01 |
| KR20250172900A (ko) | 2025-12-09 |
| CN118742531A (zh) | 2024-10-01 |
| WO2023164524A1 (en) | 2023-08-31 |
| KR20240154023A (ko) | 2024-10-24 |
| EP4707426A3 (en) | 2026-05-06 |
| IL314348A (en) | 2024-09-01 |
| IL326838A (en) | 2026-04-01 |
| US20250115992A1 (en) | 2025-04-10 |
| EP4482816A1 (en) | 2025-01-01 |
| US12503760B2 (en) | 2025-12-23 |
| EP4707426A2 (en) | 2026-03-11 |
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