JP2025512239A5 - - Google Patents
Info
- Publication number
- JP2025512239A5 JP2025512239A5 JP2024550230A JP2024550230A JP2025512239A5 JP 2025512239 A5 JP2025512239 A5 JP 2025512239A5 JP 2024550230 A JP2024550230 A JP 2024550230A JP 2024550230 A JP2024550230 A JP 2024550230A JP 2025512239 A5 JP2025512239 A5 JP 2025512239A5
- Authority
- JP
- Japan
- Prior art keywords
- patent document
- publication
- application
- international
- prior
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202263331130P | 2022-04-14 | 2022-04-14 | |
| US63/331,130 | 2022-04-14 | ||
| PCT/US2023/015989 WO2023200565A1 (en) | 2022-04-14 | 2023-03-23 | Methods of determining a height, and a height profile, of a wire loop on a wire bonding machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2025512239A JP2025512239A (ja) | 2025-04-17 |
| JP2025512239A5 true JP2025512239A5 (enExample) | 2025-09-18 |
Family
ID=88308027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024550230A Pending JP2025512239A (ja) | 2022-04-14 | 2023-03-23 | ワイヤーボンディング装置上でワイヤーループの高さおよび高さプロファイルを決定する方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12538759B2 (enExample) |
| JP (1) | JP2025512239A (enExample) |
| KR (1) | KR20250002132A (enExample) |
| CN (1) | CN118786326A (enExample) |
| TW (1) | TW202407292A (enExample) |
| WO (1) | WO2023200565A1 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118989551B (zh) * | 2024-06-06 | 2025-04-29 | 深圳市中顺半导体照明有限公司 | 结合机器视觉调节led半导体器件的焊线线弧的方法及系统 |
| WO2026089858A1 (en) * | 2024-10-23 | 2026-04-30 | Kulicke And Soffa Industries, Inc. | Wire guides, wire bonding systems, and related methods |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01251731A (ja) * | 1988-03-31 | 1989-10-06 | Toshiba Corp | ボンディングワイヤ検査装置 |
| JP2851151B2 (ja) * | 1990-10-12 | 1999-01-27 | 株式会社東芝 | ワイヤボンディング検査装置 |
| JP3298753B2 (ja) * | 1994-10-14 | 2002-07-08 | 株式会社新川 | ワイヤ曲がり検査装置 |
| JP3370547B2 (ja) | 1997-03-17 | 2003-01-27 | 株式会社新川 | ボンディングワイヤ高さ検査装置 |
| KR200174667Y1 (ko) | 1997-03-25 | 2000-03-02 | 유무성 | 와이어 루프의 높이 측정 장치 |
| JPH1163932A (ja) * | 1997-08-25 | 1999-03-05 | Matsushita Electric Ind Co Ltd | ワイヤボンディングにおけるワイヤの高さ検査方法 |
| US6189765B1 (en) | 1998-04-14 | 2001-02-20 | Hyundai Electronics Industries Co., Ltd. | Apparatus and method for detecting double wire bonding |
| ATE344445T1 (de) * | 2002-02-01 | 2006-11-15 | F & K Delvotec Bondtech Gmbh | Testvorrichtung zur ausführung eines pulltests |
| US7145162B2 (en) * | 2003-10-31 | 2006-12-05 | Asm Assembly Automation Ltd. | Wire loop height measurement apparatus and method |
| US7481351B2 (en) * | 2003-12-23 | 2009-01-27 | Samsung Electronics Co., Ltd. | Wire bonding apparatus and method for clamping a wire |
| JP2006080139A (ja) * | 2004-09-07 | 2006-03-23 | Shinko Electric Ind Co Ltd | ワイヤボンディング装置 |
| US7188759B2 (en) | 2004-09-08 | 2007-03-13 | Kulicke And Soffa Industries, Inc. | Methods for forming conductive bumps and wire loops |
| WO2009002345A1 (en) * | 2007-06-28 | 2008-12-31 | Kulicke And Soffa Industries, Inc. | Method of determining a height profile of a wire loop on a wire bonding machine |
| JP4625858B2 (ja) * | 2008-09-10 | 2011-02-02 | 株式会社カイジョー | ワイヤボンディング方法、ワイヤボンディング装置及びワイヤボンディング制御プログラム |
| JP4787374B2 (ja) * | 2010-01-27 | 2011-10-05 | 株式会社新川 | 半導体装置の製造方法並びにワイヤボンディング装置 |
| JP6433810B2 (ja) * | 2015-02-23 | 2018-12-05 | キヤノンマシナリー株式会社 | ボンディングワイヤの検出方法及びボンディングワイヤの検出装置 |
| US11721571B2 (en) * | 2020-10-14 | 2023-08-08 | Emage Vision Pte. Ltd. | Loop height measurement of overlapping bond wires |
-
2023
- 2023-03-23 CN CN202380024265.2A patent/CN118786326A/zh active Pending
- 2023-03-23 JP JP2024550230A patent/JP2025512239A/ja active Pending
- 2023-03-23 US US18/125,152 patent/US12538759B2/en active Active
- 2023-03-23 KR KR1020247029174A patent/KR20250002132A/ko active Pending
- 2023-03-23 WO PCT/US2023/015989 patent/WO2023200565A1/en not_active Ceased
- 2023-03-30 TW TW112112362A patent/TW202407292A/zh unknown
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2022534782A5 (enExample) | ||
| JP2021511664A5 (enExample) | ||
| JP2022541589A5 (enExample) | ||
| JP2021524958A5 (enExample) | ||
| JP2014528601A5 (enExample) | ||
| JP2020530380A5 (enExample) | ||
| JP2022078315A5 (enExample) | ||
| JP2025502637A5 (enExample) | ||
| JP2021512766A5 (enExample) | ||
| JP2013506057A5 (enExample) | ||
| JP2023553310A5 (enExample) | ||
| JP2014513356A5 (enExample) | ||
| JP2009515988A5 (enExample) | ||
| TW201206590A (en) | Method for forming metal member having excellent shape freezing properties | |
| JP2023522021A5 (enExample) | ||
| JP2022513172A5 (enExample) | ||
| JP2003003212A5 (enExample) | ||
| JP2004536093A5 (ja) | Ｒ−及びｓ−シタロプラムの混合物を分離することによってラセミシタロプラム及びｓ−もしくはｒ−シタロプラムを製造する方法 | |
| JP2020505322A5 (enExample) | ||
| JP2009179634A5 (enExample) | ||
| JP2023521031A5 (enExample) | ||
| JP2025508976A5 (enExample) | ||
| JP2022518151A5 (enExample) | ||
| JP2023503428A5 (enExample) | ||
| JP2024505159A5 (enExample) |