JP2025512239A5 - - Google Patents
Info
- Publication number
- JP2025512239A5 JP2025512239A5 JP2024550230A JP2024550230A JP2025512239A5 JP 2025512239 A5 JP2025512239 A5 JP 2025512239A5 JP 2024550230 A JP2024550230 A JP 2024550230A JP 2024550230 A JP2024550230 A JP 2024550230A JP 2025512239 A5 JP2025512239 A5 JP 2025512239A5
- Authority
- JP
- Japan
- Prior art keywords
- patent document
- publication
- application
- international
- prior
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202263331130P | 2022-04-14 | 2022-04-14 | |
| US63/331,130 | 2022-04-14 | ||
| PCT/US2023/015989 WO2023200565A1 (en) | 2022-04-14 | 2023-03-23 | Methods of determining a height, and a height profile, of a wire loop on a wire bonding machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2025512239A JP2025512239A (ja) | 2025-04-17 |
| JP2025512239A5 true JP2025512239A5 (enExample) | 2025-09-18 |
Family
ID=88308027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024550230A Pending JP2025512239A (ja) | 2022-04-14 | 2023-03-23 | ワイヤーボンディング装置上でワイヤーループの高さおよび高さプロファイルを決定する方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12538759B2 (enExample) |
| JP (1) | JP2025512239A (enExample) |
| KR (1) | KR20250002132A (enExample) |
| CN (1) | CN118786326A (enExample) |
| TW (1) | TW202407292A (enExample) |
| WO (1) | WO2023200565A1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118287809B (zh) * | 2024-06-06 | 2024-07-26 | 深圳市中顺半导体照明有限公司 | Led半导体焊线生成指定线弧的动态调节方法及系统 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3370547B2 (ja) * | 1997-03-17 | 2003-01-27 | 株式会社新川 | ボンディングワイヤ高さ検査装置 |
| KR200174667Y1 (ko) * | 1997-03-25 | 2000-03-02 | 유무성 | 와이어 루프의 높이 측정 장치 |
| US6189765B1 (en) * | 1998-04-14 | 2001-02-20 | Hyundai Electronics Industries Co., Ltd. | Apparatus and method for detecting double wire bonding |
| ATE344445T1 (de) * | 2002-02-01 | 2006-11-15 | F & K Delvotec Bondtech Gmbh | Testvorrichtung zur ausführung eines pulltests |
| US7145162B2 (en) * | 2003-10-31 | 2006-12-05 | Asm Assembly Automation Ltd. | Wire loop height measurement apparatus and method |
| US7481351B2 (en) * | 2003-12-23 | 2009-01-27 | Samsung Electronics Co., Ltd. | Wire bonding apparatus and method for clamping a wire |
| US7188759B2 (en) | 2004-09-08 | 2007-03-13 | Kulicke And Soffa Industries, Inc. | Methods for forming conductive bumps and wire loops |
| WO2009002345A1 (en) * | 2007-06-28 | 2008-12-31 | Kulicke And Soffa Industries, Inc. | Method of determining a height profile of a wire loop on a wire bonding machine |
| JP4625858B2 (ja) * | 2008-09-10 | 2011-02-02 | 株式会社カイジョー | ワイヤボンディング方法、ワイヤボンディング装置及びワイヤボンディング制御プログラム |
| JP4787374B2 (ja) * | 2010-01-27 | 2011-10-05 | 株式会社新川 | 半導体装置の製造方法並びにワイヤボンディング装置 |
| TWI894380B (zh) * | 2020-10-14 | 2025-08-21 | 新加坡商億美視覺私人有限公司 | 疊合焊線之迴路高度測量裝置及方法 |
-
2023
- 2023-03-23 WO PCT/US2023/015989 patent/WO2023200565A1/en not_active Ceased
- 2023-03-23 CN CN202380024265.2A patent/CN118786326A/zh active Pending
- 2023-03-23 KR KR1020247029174A patent/KR20250002132A/ko active Pending
- 2023-03-23 US US18/125,152 patent/US12538759B2/en active Active
- 2023-03-23 JP JP2024550230A patent/JP2025512239A/ja active Pending
- 2023-03-30 TW TW112112362A patent/TW202407292A/zh unknown
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