JP2022534782A5 - - Google Patents
Info
- Publication number
- JP2022534782A5 JP2022534782A5 JP2021571646A JP2021571646A JP2022534782A5 JP 2022534782 A5 JP2022534782 A5 JP 2022534782A5 JP 2021571646 A JP2021571646 A JP 2021571646A JP 2021571646 A JP2021571646 A JP 2021571646A JP 2022534782 A5 JP2022534782 A5 JP 2022534782A5
- Authority
- JP
- Japan
- Prior art keywords
- patent document
- korean published
- document
- prior
- wire loop
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024146057A JP2024161600A (ja) | 2019-06-04 | 2024-08-28 | ボンディングワイヤーとワイヤーボンディング装置上のボンディング位置との間のボンディングを検出する方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962857027P | 2019-06-04 | 2019-06-04 | |
| US62/857,027 | 2019-06-04 | ||
| PCT/US2020/035818 WO2020247424A1 (en) | 2019-06-04 | 2020-06-03 | Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024146057A Division JP2024161600A (ja) | 2019-06-04 | 2024-08-28 | ボンディングワイヤーとワイヤーボンディング装置上のボンディング位置との間のボンディングを検出する方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022534782A JP2022534782A (ja) | 2022-08-03 |
| JP2022534782A5 true JP2022534782A5 (enExample) | 2023-05-29 |
| JP7579280B2 JP7579280B2 (ja) | 2024-11-07 |
Family
ID=73650765
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021571646A Active JP7579280B2 (ja) | 2019-06-04 | 2020-06-03 | ボンディングワイヤーとワイヤーボンディング装置上のボンディング位置との間のボンディングを検出する方法 |
| JP2024146057A Pending JP2024161600A (ja) | 2019-06-04 | 2024-08-28 | ボンディングワイヤーとワイヤーボンディング装置上のボンディング位置との間のボンディングを検出する方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024146057A Pending JP2024161600A (ja) | 2019-06-04 | 2024-08-28 | ボンディングワイヤーとワイヤーボンディング装置上のボンディング位置との間のボンディングを検出する方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US11581285B2 (enExample) |
| JP (2) | JP7579280B2 (enExample) |
| KR (1) | KR102788904B1 (enExample) |
| CN (1) | CN113939901B (enExample) |
| TW (2) | TWI880837B (enExample) |
| WO (1) | WO2020247424A1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7165449B2 (ja) * | 2020-08-04 | 2022-11-04 | ヤマハロボティクスホールディングス株式会社 | ワイヤ接合状態判定方法及びワイヤ接合状態判定装置 |
| CN117337485A (zh) * | 2021-05-20 | 2024-01-02 | 库利克和索夫工业公司 | 确定和/或校准楔焊机上的切割器高度的方法以及相关的楔焊机 |
| CN120548608A (zh) * | 2023-01-20 | 2025-08-26 | 库利克和索夫工业公司 | 焊线机操作中过程错误的自动恢复方法 |
| KR20260035274A (ko) * | 2023-07-11 | 2026-03-12 | 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 | 반도체 요소에서 크랙을 검출하는 방법, 및 관련 와이어 본딩 시스템 |
| KR20250015211A (ko) * | 2023-07-24 | 2025-02-03 | 주식회사 엘엑스세미콘 | SiC 반도체 소자의 정션 프로파일 관찰 방법 |
| WO2025264926A1 (en) * | 2024-06-21 | 2025-12-26 | Kulicke And Soffa Industries, Inc. | Methods of determining a bonding status between a portion of wire and a workpiece on a wire bonding system |
| CN121358308B (zh) * | 2025-12-18 | 2026-04-17 | 广东阿达半导体设备股份有限公司 | 一种焊线机的偏焊预防与自动纠准方法及系统 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4586642A (en) * | 1985-05-13 | 1986-05-06 | Kulicke And Soffa Industries Inc. | Wire bond monitoring system |
| US6189765B1 (en) * | 1998-04-14 | 2001-02-20 | Hyundai Electronics Industries Co., Ltd. | Apparatus and method for detecting double wire bonding |
| JP3567884B2 (ja) * | 2000-11-22 | 2004-09-22 | 松下電器産業株式会社 | 超音波ボンディング方法 |
| JP4434623B2 (ja) * | 2003-05-12 | 2010-03-17 | パナソニック株式会社 | ボンディング装置およびボンディング方法 |
| US7085699B2 (en) * | 2003-12-23 | 2006-08-01 | Texas Instruments Incorporated | Wire bonding simulation |
| JP4266369B2 (ja) * | 2005-02-24 | 2009-05-20 | 株式会社新川 | ワイヤボンディング方法 |
| US8302840B2 (en) * | 2007-05-16 | 2012-11-06 | Kulicke And Soffa Industries, Inc. | Closed loop wire bonding methods and bonding force calibration |
| WO2009002345A1 (en) | 2007-06-28 | 2008-12-31 | Kulicke And Soffa Industries, Inc. | Method of determining a height profile of a wire loop on a wire bonding machine |
| JP4397408B2 (ja) * | 2007-09-21 | 2010-01-13 | 株式会社新川 | 半導体装置及びワイヤボンディング方法 |
| JP4275724B1 (ja) * | 2008-07-16 | 2009-06-10 | 株式会社新川 | ボンディング良否判定方法およびボンディング良否判定装置ならびにボンディング装置 |
| KR20110129170A (ko) | 2010-05-25 | 2011-12-01 | 삼성전기주식회사 | 와이어 본딩 장치 및 방법 |
| US20120032354A1 (en) | 2010-08-06 | 2012-02-09 | National Semiconductor Corporation | Wirebonding method and device enabling high-speed reverse wedge bonding of wire bonds |
| CN202169438U (zh) * | 2011-06-03 | 2012-03-21 | 长春光华微电子设备工程中心有限公司 | 全自动超声波铝丝压焊机送丝装置 |
| US8919632B2 (en) | 2012-11-09 | 2014-12-30 | Asm Technology Singapore Pte. Ltd. | Method of detecting wire bonding failures |
| SG11201503764YA (en) * | 2012-11-16 | 2015-06-29 | Shinkawa Kk | Wire-bonding apparatus and method of wire bonding |
| TWI518814B (zh) | 2013-04-15 | 2016-01-21 | 新川股份有限公司 | 半導體裝置以及半導體裝置的製造方法 |
| KR102254026B1 (ko) | 2014-08-18 | 2021-05-20 | 삼성전자주식회사 | 반도체 패키지의 제조 방법 |
| JP6575161B2 (ja) * | 2015-06-16 | 2019-09-18 | 富士電機株式会社 | 良否判断装置、ワイヤボンダ装置及び良否判断方法 |
| US10121759B2 (en) * | 2015-11-04 | 2018-11-06 | Kulicke And Soffa Industries, Inc. | On-bonder automatic overhang die optimization tool for wire bonding and related methods |
| KR102365682B1 (ko) * | 2017-11-13 | 2022-02-21 | 삼성전자주식회사 | 반도체 패키지 |
| CN112400226B (zh) | 2018-06-29 | 2024-07-30 | 库利克和索夫工业公司 | 焊接线材与焊线机上的焊接位置之间的焊接的检测方法 |
-
2020
- 2020-06-02 US US16/890,823 patent/US11581285B2/en active Active
- 2020-06-03 CN CN202080041774.2A patent/CN113939901B/zh active Active
- 2020-06-03 KR KR1020227000056A patent/KR102788904B1/ko active Active
- 2020-06-03 TW TW113130680A patent/TWI880837B/zh active
- 2020-06-03 TW TW109118695A patent/TWI853032B/zh active
- 2020-06-03 JP JP2021571646A patent/JP7579280B2/ja active Active
- 2020-06-03 WO PCT/US2020/035818 patent/WO2020247424A1/en not_active Ceased
-
2023
- 2023-01-12 US US18/096,179 patent/US12255172B2/en active Active
-
2024
- 2024-08-28 JP JP2024146057A patent/JP2024161600A/ja active Pending
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