TW202407292A - 確定引線接合機上的引線迴路的高度和高度輪廓的方法 - Google Patents

確定引線接合機上的引線迴路的高度和高度輪廓的方法 Download PDF

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Publication number
TW202407292A
TW202407292A TW112112362A TW112112362A TW202407292A TW 202407292 A TW202407292 A TW 202407292A TW 112112362 A TW112112362 A TW 112112362A TW 112112362 A TW112112362 A TW 112112362A TW 202407292 A TW202407292 A TW 202407292A
Authority
TW
Taiwan
Prior art keywords
wire
loop
lead
lead loop
wire bonding
Prior art date
Application number
TW112112362A
Other languages
English (en)
Chinese (zh)
Inventor
巴西爾 米爾頓
巍 秦
志傑 王
弗拉基米爾 普理布拉
帕維爾 舒沙林
Original Assignee
美商庫利克和索夫工業公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商庫利克和索夫工業公司 filed Critical 美商庫利克和索夫工業公司
Publication of TW202407292A publication Critical patent/TW202407292A/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires

Landscapes

  • Wire Bonding (AREA)
TW112112362A 2022-04-14 2023-03-30 確定引線接合機上的引線迴路的高度和高度輪廓的方法 TW202407292A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202263331130P 2022-04-14 2022-04-14
US63/331,130 2022-04-14

Publications (1)

Publication Number Publication Date
TW202407292A true TW202407292A (zh) 2024-02-16

Family

ID=88308027

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112112362A TW202407292A (zh) 2022-04-14 2023-03-30 確定引線接合機上的引線迴路的高度和高度輪廓的方法

Country Status (6)

Country Link
US (1) US12538759B2 (enExample)
JP (1) JP2025512239A (enExample)
KR (1) KR20250002132A (enExample)
CN (1) CN118786326A (enExample)
TW (1) TW202407292A (enExample)
WO (1) WO2023200565A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118989551B (zh) * 2024-06-06 2025-04-29 深圳市中顺半导体照明有限公司 结合机器视觉调节led半导体器件的焊线线弧的方法及系统
WO2026089858A1 (en) * 2024-10-23 2026-04-30 Kulicke And Soffa Industries, Inc. Wire guides, wire bonding systems, and related methods

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01251731A (ja) * 1988-03-31 1989-10-06 Toshiba Corp ボンディングワイヤ検査装置
JP2851151B2 (ja) * 1990-10-12 1999-01-27 株式会社東芝 ワイヤボンディング検査装置
JP3298753B2 (ja) * 1994-10-14 2002-07-08 株式会社新川 ワイヤ曲がり検査装置
JP3370547B2 (ja) 1997-03-17 2003-01-27 株式会社新川 ボンディングワイヤ高さ検査装置
KR200174667Y1 (ko) 1997-03-25 2000-03-02 유무성 와이어 루프의 높이 측정 장치
JPH1163932A (ja) * 1997-08-25 1999-03-05 Matsushita Electric Ind Co Ltd ワイヤボンディングにおけるワイヤの高さ検査方法
US6189765B1 (en) 1998-04-14 2001-02-20 Hyundai Electronics Industries Co., Ltd. Apparatus and method for detecting double wire bonding
ATE344445T1 (de) * 2002-02-01 2006-11-15 F & K Delvotec Bondtech Gmbh Testvorrichtung zur ausführung eines pulltests
US7145162B2 (en) * 2003-10-31 2006-12-05 Asm Assembly Automation Ltd. Wire loop height measurement apparatus and method
US7481351B2 (en) * 2003-12-23 2009-01-27 Samsung Electronics Co., Ltd. Wire bonding apparatus and method for clamping a wire
JP2006080139A (ja) * 2004-09-07 2006-03-23 Shinko Electric Ind Co Ltd ワイヤボンディング装置
US7188759B2 (en) 2004-09-08 2007-03-13 Kulicke And Soffa Industries, Inc. Methods for forming conductive bumps and wire loops
WO2009002345A1 (en) * 2007-06-28 2008-12-31 Kulicke And Soffa Industries, Inc. Method of determining a height profile of a wire loop on a wire bonding machine
JP4625858B2 (ja) * 2008-09-10 2011-02-02 株式会社カイジョー ワイヤボンディング方法、ワイヤボンディング装置及びワイヤボンディング制御プログラム
JP4787374B2 (ja) * 2010-01-27 2011-10-05 株式会社新川 半導体装置の製造方法並びにワイヤボンディング装置
JP6433810B2 (ja) * 2015-02-23 2018-12-05 キヤノンマシナリー株式会社 ボンディングワイヤの検出方法及びボンディングワイヤの検出装置
US11721571B2 (en) * 2020-10-14 2023-08-08 Emage Vision Pte. Ltd. Loop height measurement of overlapping bond wires

Also Published As

Publication number Publication date
US12538759B2 (en) 2026-01-27
WO2023200565A1 (en) 2023-10-19
KR20250002132A (ko) 2025-01-07
CN118786326A (zh) 2024-10-15
US20230335532A1 (en) 2023-10-19
JP2025512239A (ja) 2025-04-17

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