JP2025511165A5 - - Google Patents
Info
- Publication number
- JP2025511165A5 JP2025511165A5 JP2024557989A JP2024557989A JP2025511165A5 JP 2025511165 A5 JP2025511165 A5 JP 2025511165A5 JP 2024557989 A JP2024557989 A JP 2024557989A JP 2024557989 A JP2024557989 A JP 2024557989A JP 2025511165 A5 JP2025511165 A5 JP 2025511165A5
- Authority
- JP
- Japan
- Prior art keywords
- press plate
- press
- workpiece
- heating device
- heatable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102022107462.5 | 2022-03-29 | ||
| DE102022107462.5A DE102022107462A1 (de) | 2022-03-29 | 2022-03-29 | Hochtemperatur-Fügeofen |
| PCT/DE2023/100238 WO2023186217A1 (de) | 2022-03-29 | 2023-03-28 | Hochtemperatur-fügeofen |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2025511165A JP2025511165A (ja) | 2025-04-15 |
| JP2025511165A5 true JP2025511165A5 (cg-RX-API-DMAC7.html) | 2025-04-23 |
Family
ID=85979688
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024557989A Pending JP2025511165A (ja) | 2022-03-29 | 2023-03-28 | 高温接合炉 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20260042166A1 (cg-RX-API-DMAC7.html) |
| EP (1) | EP4499341A1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP2025511165A (cg-RX-API-DMAC7.html) |
| KR (1) | KR20250002154A (cg-RX-API-DMAC7.html) |
| CN (1) | CN119212819A (cg-RX-API-DMAC7.html) |
| DE (2) | DE102022107462A1 (cg-RX-API-DMAC7.html) |
| WO (1) | WO2023186217A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117600638A (zh) * | 2023-11-21 | 2024-02-27 | 浙江晨华科技有限公司 | 一种扩散焊烧结系统 |
| CN117564430B (zh) * | 2024-01-15 | 2024-04-02 | 中国核动力研究设计院 | 曲面工件扩散焊接的加压组件、设备及焊接方法 |
| DE102024111649B3 (de) * | 2024-04-25 | 2025-09-25 | SMT Maschinen- und Vertriebs GmbH & Co Kommanditgesellschaft | Zylinderplatte einer Vorrichtung zum Verbinden eines Bauelements mit einem Substrat |
| CN119387795B (zh) * | 2024-11-08 | 2025-05-27 | 哈尔滨工业大学 | 一种基于恒流电场作用下实现锆及其合金低温扩散连接的方法 |
| CN120572201B (zh) * | 2025-07-29 | 2025-10-17 | 浙江金桥铜业科技有限公司 | 一种软铜箔的自动化焊接设备 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3754499A (en) | 1971-09-27 | 1973-08-28 | North American Rockwell | High temperature platens |
| JPS55128385A (en) * | 1979-03-27 | 1980-10-04 | Mitsubishi Heavy Ind Ltd | Split pressure system large member diffusion welding method and apparatus thereof |
| US4649249A (en) * | 1985-09-13 | 1987-03-10 | Rockwell International Corporation | Induction heating platen for hot metal working |
| DE102004027545A1 (de) | 2004-06-04 | 2005-12-29 | Meier Vakuumtechnik Gmbh | Vorrichtung für das heiße Laminieren und anschließende Abkühlen von Bauteilen |
| US20060273450A1 (en) | 2005-06-02 | 2006-12-07 | Intel Corporation | Solid-diffusion, die-to-heat spreader bonding methods, articles achieved thereby, and apparatus used therefor |
| US7948034B2 (en) | 2006-06-22 | 2011-05-24 | Suss Microtec Lithography, Gmbh | Apparatus and method for semiconductor bonding |
| DE102006058493B4 (de) * | 2006-12-12 | 2012-03-22 | Erich Thallner | Verfahren und Vorrichtung zum Bonden von Wafern |
| EP2106892A1 (de) * | 2008-04-04 | 2009-10-07 | komax Holding AG | Heizplatte für Werkstücke |
| DE102010031421B4 (de) | 2010-07-15 | 2013-04-18 | Ruhlamat Gmbh | Laminiervorrichtung und ein Verfahren zum Laminieren mehrlagiger Dokumente |
| JP5593299B2 (ja) | 2011-11-25 | 2014-09-17 | 東京エレクトロン株式会社 | 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体 |
| JP6353374B2 (ja) | 2015-01-16 | 2018-07-04 | 東京エレクトロン株式会社 | 接合装置、接合システムおよび接合方法 |
| CN113458578A (zh) | 2020-03-30 | 2021-10-01 | 超众科技股份有限公司 | 接合装置 |
| CN113458580A (zh) | 2020-03-30 | 2021-10-01 | 超众科技股份有限公司 | 接合装置 |
-
2022
- 2022-03-29 DE DE102022107462.5A patent/DE102022107462A1/de not_active Withdrawn
-
2023
- 2023-03-28 JP JP2024557989A patent/JP2025511165A/ja active Pending
- 2023-03-28 KR KR1020247031385A patent/KR20250002154A/ko active Pending
- 2023-03-28 EP EP23715744.1A patent/EP4499341A1/de active Pending
- 2023-03-28 CN CN202380031824.2A patent/CN119212819A/zh active Pending
- 2023-03-28 US US18/850,958 patent/US20260042166A1/en active Pending
- 2023-03-28 WO PCT/DE2023/100238 patent/WO2023186217A1/de not_active Ceased
- 2023-03-28 DE DE112023001625.9T patent/DE112023001625A5/de active Pending
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