DE102022107462A1 - Hochtemperatur-Fügeofen - Google Patents

Hochtemperatur-Fügeofen Download PDF

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Publication number
DE102022107462A1
DE102022107462A1 DE102022107462.5A DE102022107462A DE102022107462A1 DE 102022107462 A1 DE102022107462 A1 DE 102022107462A1 DE 102022107462 A DE102022107462 A DE 102022107462A DE 102022107462 A1 DE102022107462 A1 DE 102022107462A1
Authority
DE
Germany
Prior art keywords
press plate
workpiece
press
pressing
heating device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102022107462.5A
Other languages
German (de)
English (en)
Inventor
Udo Broich
Jörg Winhauer
Alexander Terwey
Peter Schlecht
Jürgen Naumann
Stefan Eich
Paul Janek
Felix Gemse
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pva Ind Vacuum Systems GmbH
Pva Industrial Vacuum Systems GmbH
Original Assignee
Pva Ind Vacuum Systems GmbH
Pva Industrial Vacuum Systems GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pva Ind Vacuum Systems GmbH, Pva Industrial Vacuum Systems GmbH filed Critical Pva Ind Vacuum Systems GmbH
Priority to DE102022107462.5A priority Critical patent/DE102022107462A1/de
Priority to US18/850,958 priority patent/US20260042166A1/en
Priority to DE112023001625.9T priority patent/DE112023001625A5/de
Priority to PCT/DE2023/100238 priority patent/WO2023186217A1/de
Priority to JP2024557989A priority patent/JP2025511165A/ja
Priority to CN202380031824.2A priority patent/CN119212819A/zh
Priority to KR1020247031385A priority patent/KR20250002154A/ko
Priority to EP23715744.1A priority patent/EP4499341A1/de
Publication of DE102022107462A1 publication Critical patent/DE102022107462A1/de
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/26—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
    • B29C65/24—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools characterised by the means for heating the tool
    • B29C65/26—Hot fluid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
    • B29C65/24—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools characterised by the means for heating the tool
    • B29C65/30—Electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/02—Dies; Inserts therefor; Mounting thereof; Moulds
    • B30B15/026—Mounting of dies, platens or press rams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/062—Press plates
    • B30B15/064—Press plates with heating or cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Press Drives And Press Lines (AREA)
DE102022107462.5A 2022-03-29 2022-03-29 Hochtemperatur-Fügeofen Withdrawn DE102022107462A1 (de)

Priority Applications (8)

Application Number Priority Date Filing Date Title
DE102022107462.5A DE102022107462A1 (de) 2022-03-29 2022-03-29 Hochtemperatur-Fügeofen
US18/850,958 US20260042166A1 (en) 2022-03-29 2023-03-28 High-temperature joining furnace
DE112023001625.9T DE112023001625A5 (de) 2022-03-29 2023-03-28 Hochtemperatur-fügeofen
PCT/DE2023/100238 WO2023186217A1 (de) 2022-03-29 2023-03-28 Hochtemperatur-fügeofen
JP2024557989A JP2025511165A (ja) 2022-03-29 2023-03-28 高温接合炉
CN202380031824.2A CN119212819A (zh) 2022-03-29 2023-03-28 高温接合炉
KR1020247031385A KR20250002154A (ko) 2022-03-29 2023-03-28 고온 접합로
EP23715744.1A EP4499341A1 (de) 2022-03-29 2023-03-28 Hochtemperatur-fügeofen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102022107462.5A DE102022107462A1 (de) 2022-03-29 2022-03-29 Hochtemperatur-Fügeofen

Publications (1)

Publication Number Publication Date
DE102022107462A1 true DE102022107462A1 (de) 2023-10-05

Family

ID=85979688

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102022107462.5A Withdrawn DE102022107462A1 (de) 2022-03-29 2022-03-29 Hochtemperatur-Fügeofen
DE112023001625.9T Pending DE112023001625A5 (de) 2022-03-29 2023-03-28 Hochtemperatur-fügeofen

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE112023001625.9T Pending DE112023001625A5 (de) 2022-03-29 2023-03-28 Hochtemperatur-fügeofen

Country Status (7)

Country Link
US (1) US20260042166A1 (cg-RX-API-DMAC7.html)
EP (1) EP4499341A1 (cg-RX-API-DMAC7.html)
JP (1) JP2025511165A (cg-RX-API-DMAC7.html)
KR (1) KR20250002154A (cg-RX-API-DMAC7.html)
CN (1) CN119212819A (cg-RX-API-DMAC7.html)
DE (2) DE102022107462A1 (cg-RX-API-DMAC7.html)
WO (1) WO2023186217A1 (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102024111649B3 (de) * 2024-04-25 2025-09-25 SMT Maschinen- und Vertriebs GmbH & Co Kommanditgesellschaft Zylinderplatte einer Vorrichtung zum Verbinden eines Bauelements mit einem Substrat

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117600638A (zh) * 2023-11-21 2024-02-27 浙江晨华科技有限公司 一种扩散焊烧结系统
CN117564430B (zh) * 2024-01-15 2024-04-02 中国核动力研究设计院 曲面工件扩散焊接的加压组件、设备及焊接方法
CN119387795B (zh) * 2024-11-08 2025-05-27 哈尔滨工业大学 一种基于恒流电场作用下实现锆及其合金低温扩散连接的方法
CN120572201B (zh) * 2025-07-29 2025-10-17 浙江金桥铜业科技有限公司 一种软铜箔的自动化焊接设备

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3754499A (en) 1971-09-27 1973-08-28 North American Rockwell High temperature platens
DE102004027545A1 (de) 2004-06-04 2005-12-29 Meier Vakuumtechnik Gmbh Vorrichtung für das heiße Laminieren und anschließende Abkühlen von Bauteilen
US20060273450A1 (en) 2005-06-02 2006-12-07 Intel Corporation Solid-diffusion, die-to-heat spreader bonding methods, articles achieved thereby, and apparatus used therefor
US20070296035A1 (en) 2006-06-22 2007-12-27 Suss Microtec Inc Apparatus and method for semiconductor bonding
DE102010031421A1 (de) 2010-07-15 2012-01-19 Ruhlamat Gmbh Laminiervorrichtung und ein Verfahren zum Laminieren mehrlagiger Dokumente
US20130133828A1 (en) 2011-11-25 2013-05-30 Tokyo Electron Limited Bonding apparatus, bonding system and bonding method
WO2016114328A1 (en) 2015-01-16 2016-07-21 Tokyo Electron Limited Joint apparatus, joint system, and joint method
CN113458578A (zh) 2020-03-30 2021-10-01 超众科技股份有限公司 接合装置
CN113458580A (zh) 2020-03-30 2021-10-01 超众科技股份有限公司 接合装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55128385A (en) * 1979-03-27 1980-10-04 Mitsubishi Heavy Ind Ltd Split pressure system large member diffusion welding method and apparatus thereof
US4649249A (en) * 1985-09-13 1987-03-10 Rockwell International Corporation Induction heating platen for hot metal working
DE102006058493B4 (de) * 2006-12-12 2012-03-22 Erich Thallner Verfahren und Vorrichtung zum Bonden von Wafern
EP2106892A1 (de) * 2008-04-04 2009-10-07 komax Holding AG Heizplatte für Werkstücke

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3754499A (en) 1971-09-27 1973-08-28 North American Rockwell High temperature platens
DE102004027545A1 (de) 2004-06-04 2005-12-29 Meier Vakuumtechnik Gmbh Vorrichtung für das heiße Laminieren und anschließende Abkühlen von Bauteilen
US20060273450A1 (en) 2005-06-02 2006-12-07 Intel Corporation Solid-diffusion, die-to-heat spreader bonding methods, articles achieved thereby, and apparatus used therefor
US20070296035A1 (en) 2006-06-22 2007-12-27 Suss Microtec Inc Apparatus and method for semiconductor bonding
DE102010031421A1 (de) 2010-07-15 2012-01-19 Ruhlamat Gmbh Laminiervorrichtung und ein Verfahren zum Laminieren mehrlagiger Dokumente
US20130133828A1 (en) 2011-11-25 2013-05-30 Tokyo Electron Limited Bonding apparatus, bonding system and bonding method
WO2016114328A1 (en) 2015-01-16 2016-07-21 Tokyo Electron Limited Joint apparatus, joint system, and joint method
CN113458578A (zh) 2020-03-30 2021-10-01 超众科技股份有限公司 接合装置
CN113458580A (zh) 2020-03-30 2021-10-01 超众科技股份有限公司 接合装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102024111649B3 (de) * 2024-04-25 2025-09-25 SMT Maschinen- und Vertriebs GmbH & Co Kommanditgesellschaft Zylinderplatte einer Vorrichtung zum Verbinden eines Bauelements mit einem Substrat

Also Published As

Publication number Publication date
KR20250002154A (ko) 2025-01-07
WO2023186217A1 (de) 2023-10-05
US20260042166A1 (en) 2026-02-12
DE112023001625A5 (de) 2025-03-27
EP4499341A1 (de) 2025-02-05
CN119212819A (zh) 2024-12-27
JP2025511165A (ja) 2025-04-15

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Legal Events

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R082 Change of representative

Representative=s name: RAUCH, UDO, DIPL.-PHYS. DR. PHIL. NAT., DE

R163 Identified publications notified
R118 Application deemed withdrawn due to claim for domestic priority