JP2025506609A5 - - Google Patents
Info
- Publication number
- JP2025506609A5 JP2025506609A5 JP2024540913A JP2024540913A JP2025506609A5 JP 2025506609 A5 JP2025506609 A5 JP 2025506609A5 JP 2024540913 A JP2024540913 A JP 2024540913A JP 2024540913 A JP2024540913 A JP 2024540913A JP 2025506609 A5 JP2025506609 A5 JP 2025506609A5
- Authority
- JP
- Japan
- Prior art keywords
- interface
- substrate
- heat conduction
- conductive member
- ground plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202263312881P | 2022-02-23 | 2022-02-23 | |
| US202263312882P | 2022-02-23 | 2022-02-23 | |
| US63/312,881 | 2022-02-23 | ||
| US63/312,882 | 2022-02-23 | ||
| PCT/US2023/013489 WO2023163932A1 (en) | 2022-02-23 | 2023-02-21 | Heat transfer from non-groundable electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2025506609A JP2025506609A (ja) | 2025-03-13 |
| JP2025506609A5 true JP2025506609A5 (https=) | 2026-02-13 |
Family
ID=87574495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024540913A Pending JP2025506609A (ja) | 2022-02-23 | 2023-02-21 | 接地不可な電子部品からの熱伝達 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US12520415B2 (https=) |
| JP (1) | JP2025506609A (https=) |
| KR (1) | KR20240152830A (https=) |
| WO (1) | WO2023163932A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12520415B2 (en) | 2022-02-23 | 2026-01-06 | Skyworks Solutions, Inc. | Method of transferring heat from ungrounded electronic components |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004214249A (ja) * | 2002-12-27 | 2004-07-29 | Renesas Technology Corp | 半導体モジュール |
| US6982480B2 (en) * | 2003-07-31 | 2006-01-03 | The Boeing Company | Near hermetic packaging of gallium arsenide semiconductor devices and manufacturing method therefor |
| US7253518B2 (en) | 2005-06-15 | 2007-08-07 | Endicott Interconnect Technologies, Inc. | Wirebond electronic package with enhanced chip pad design, method of making same, and information handling system utilizing same |
| US7554193B2 (en) | 2005-08-16 | 2009-06-30 | Renesas Technology Corp. | Semiconductor device |
| US7778039B2 (en) | 2006-05-08 | 2010-08-17 | Micron Technology, Inc. | Substrates, systems, and devices including structures for suppressing power and ground plane noise, and methods for suppressing power and ground plane noise |
| US9006889B2 (en) | 2011-11-11 | 2015-04-14 | Skyworks Solutions, Inc. | Flip chip packages with improved thermal performance |
| TWI543308B (zh) | 2014-04-16 | 2016-07-21 | 光頡科技股份有限公司 | Electronic packaging structure and its ceramic substrate |
| JP6420966B2 (ja) | 2014-04-30 | 2018-11-07 | 新光電気工業株式会社 | 配線基板及びその製造方法と電子部品装置 |
| US10149347B2 (en) | 2015-01-07 | 2018-12-04 | Skyworks Solutions, Inc. | Front-end integrated circuit for WLAN applications |
| FR3032556B1 (fr) | 2015-02-11 | 2017-03-17 | Commissariat Energie Atomique | Dispositif de transmission rf a reflecteur d'ondes electromagnetiques integre |
| US9472484B2 (en) | 2015-02-17 | 2016-10-18 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Semiconductor structure having thermal backside core |
| US9935677B2 (en) * | 2015-06-30 | 2018-04-03 | Skyworks Solutions, Inc. | Devices and methods related to high power diode switches with low DC power consumption |
| US11721677B2 (en) * | 2018-12-27 | 2023-08-08 | Intel Corporation | Microelectronic assemblies having an integrated capacitor |
| KR102948323B1 (ko) * | 2021-08-24 | 2026-04-03 | 현대모비스 주식회사 | 인쇄 회로 기판 및 그를 포함하는 차량 |
| US12520415B2 (en) | 2022-02-23 | 2026-01-06 | Skyworks Solutions, Inc. | Method of transferring heat from ungrounded electronic components |
-
2023
- 2023-02-21 US US18/111,950 patent/US12520415B2/en active Active
- 2023-02-21 WO PCT/US2023/013489 patent/WO2023163932A1/en not_active Ceased
- 2023-02-21 KR KR1020247024445A patent/KR20240152830A/ko active Pending
- 2023-02-21 JP JP2024540913A patent/JP2025506609A/ja active Pending
- 2023-02-21 US US18/171,734 patent/US12593394B2/en active Active
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