JP2024537695A - フィンガープリントに基づく半導体製造プロセス欠陥検出を使用する方法及びプロセス - Google Patents

フィンガープリントに基づく半導体製造プロセス欠陥検出を使用する方法及びプロセス Download PDF

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JP2024537695A
JP2024537695A JP2024518197A JP2024518197A JP2024537695A JP 2024537695 A JP2024537695 A JP 2024537695A JP 2024518197 A JP2024518197 A JP 2024518197A JP 2024518197 A JP2024518197 A JP 2024518197A JP 2024537695 A JP2024537695 A JP 2024537695A
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Prior art keywords
wafer
fingerprint
production
experimental design
measurements
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JP2024518197A
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Japanese (ja)
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JP2024537695A5 (enExample
Inventor
イップ，ネーサン
ウーリー，メーガン
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Tokyo Electron Ltd
Tokyo Electron US Holdings Inc
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Tokyo Electron Ltd
Tokyo Electron US Holdings Inc
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Publication of JP2024537695A publication Critical patent/JP2024537695A/ja
Publication of JP2024537695A5 publication Critical patent/JP2024537695A5/ja
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4184—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by fault tolerance, reliability of production system
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41805—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by assembly
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41885—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by modeling, simulation of the manufacturing system
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/31—Design entry, e.g. editors specifically adapted for circuit design
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/31—From computer integrated manufacturing till monitoring
    • G05B2219/31356—Automatic fault detection and isolation
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Geometry (AREA)
  • Evolutionary Computation (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2024518197A 2021-09-24 2022-09-23 フィンガープリントに基づく半導体製造プロセス欠陥検出を使用する方法及びプロセス Pending JP2024537695A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/484,204 2021-09-24
US17/484,204 US11868119B2 (en) 2021-09-24 2021-09-24 Method and process using fingerprint based semiconductor manufacturing process fault detection
PCT/US2022/044531 WO2023049341A1 (en) 2021-09-24 2022-09-23 Method and process using fingerprint based semiconductor manufacturing process fault detection

Publications (2)

Publication Number Publication Date
JP2024537695A true JP2024537695A (ja) 2024-10-16
JP2024537695A5 JP2024537695A5 (enExample) 2025-09-12

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JP2024518197A Pending JP2024537695A (ja) 2021-09-24 2022-09-23 フィンガープリントに基づく半導体製造プロセス欠陥検出を使用する方法及びプロセス

Country Status (6)

Country Link
US (1) US11868119B2 (enExample)
JP (1) JP2024537695A (enExample)
KR (1) KR20240072993A (enExample)
CN (1) CN117882171A (enExample)
TW (1) TW202331437A (enExample)
WO (1) WO2023049341A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118332364B (zh) * 2024-04-08 2026-06-12 北京科技大学 一种面向浮法玻璃产品质量的软测量模型检测方法及装置

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JP2005109437A (ja) * 2003-09-08 2005-04-21 Toshiba Corp 半導体装置の製造システムおよび半導体装置の製造方法
WO2014203961A1 (ja) * 2013-06-21 2014-12-24 Hoya株式会社 マスクブランク用基板、マスクブランク、転写用マスク及びこれらの製造方法並びに半導体デバイスの製造方法
JP2019508734A (ja) * 2016-02-22 2019-03-28 エーエスエムエル ネザーランズ ビー．ブイ． メトロロジデータへの寄与の分離
JP2020510195A (ja) * 2017-03-01 2020-04-02 ケーエルエー コーポレイション 光学散乱計測に基づくプロセスに対してロバストなオーバーレイ計測
WO2020092393A1 (en) * 2018-10-31 2020-05-07 Tokyo Electron Limited Systems and methods for manufacturing microelectronic devices
US20210256687A1 (en) * 2020-02-18 2021-08-19 Applied Materials Israel Ltd. Determination of defect location for examination of a specimen

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TW535207B (en) * 2002-05-08 2003-06-01 Powerchip Semiconductor Corp Method for automatically controlling defect-specification in manufacturing process of semiconductors
US6912437B2 (en) 2002-09-30 2005-06-28 Advanced Micro Devices, Inc. Method and apparatus for controlling a fabrication process based on a measured electrical characteristic
US6957154B2 (en) * 2003-02-03 2005-10-18 Qcept Technologies, Inc. Semiconductor wafer inspection system
US7085676B2 (en) 2003-06-27 2006-08-01 Tokyo Electron Limited Feed forward critical dimension control
JP2012237566A (ja) 2011-05-10 2012-12-06 Hitachi High-Technologies Corp 欠陥観察方法及びその装置
US10079183B2 (en) 2013-06-26 2018-09-18 Kla-Tenor Corporation Calculated electrical performance metrics for process monitoring and yield management
US9747520B2 (en) 2015-03-16 2017-08-29 Kla-Tencor Corporation Systems and methods for enhancing inspection sensitivity of an inspection tool
US9569834B2 (en) * 2015-06-22 2017-02-14 Kla-Tencor Corporation Automated image-based process monitoring and control
KR102441582B1 (ko) 2015-07-23 2022-09-07 삼성전자주식회사 Mpc 검증 방법 및 그 검증 방법을 포함한 마스크 제조방법
US10181185B2 (en) 2016-01-11 2019-01-15 Kla-Tencor Corp. Image based specimen process control
US10310490B2 (en) 2016-02-01 2019-06-04 Qoniac Gmbh Method and apparatus of evaluating a semiconductor manufacturing process
US10234401B2 (en) 2016-02-22 2019-03-19 Qoniac Gmbh Method of manufacturing semiconductor devices by using sampling plans
US10657638B2 (en) * 2017-04-28 2020-05-19 Mentor Graphics Corporation Wafer map pattern detection based on supervised machine learning
WO2018233966A1 (en) * 2017-06-22 2018-12-27 Asml Netherlands B.V. METHOD FOR DETERMINING THE CONTRIBUTION TO A DIGITAL IMPRINT
CN111316412A (zh) 2017-11-03 2020-06-19 东京毅力科创株式会社 功能性微电子装置的产出的提高
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TWI729334B (zh) * 2018-06-07 2021-06-01 荷蘭商Ａｓｍｌ荷蘭公司 用於判定器件之控制方案的方法、電腦程式和系統及用於判定多個器件處理之基板的方法
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JP2005109437A (ja) * 2003-09-08 2005-04-21 Toshiba Corp 半導体装置の製造システムおよび半導体装置の製造方法
WO2014203961A1 (ja) * 2013-06-21 2014-12-24 Hoya株式会社 マスクブランク用基板、マスクブランク、転写用マスク及びこれらの製造方法並びに半導体デバイスの製造方法
JP2019508734A (ja) * 2016-02-22 2019-03-28 エーエスエムエル ネザーランズ ビー．ブイ． メトロロジデータへの寄与の分離
JP2020510195A (ja) * 2017-03-01 2020-04-02 ケーエルエー コーポレイション 光学散乱計測に基づくプロセスに対してロバストなオーバーレイ計測
WO2020092393A1 (en) * 2018-10-31 2020-05-07 Tokyo Electron Limited Systems and methods for manufacturing microelectronic devices
US20210256687A1 (en) * 2020-02-18 2021-08-19 Applied Materials Israel Ltd. Determination of defect location for examination of a specimen

Also Published As

Publication number Publication date
US20230102438A1 (en) 2023-03-30
TW202331437A (zh) 2023-08-01
US11868119B2 (en) 2024-01-09
KR20240072993A (ko) 2024-05-24
WO2023049341A1 (en) 2023-03-30
CN117882171A (zh) 2024-04-12

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