JP2024537695A5 - - Google Patents

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Publication number
JP2024537695A5
JP2024537695A5 JP2024518197A JP2024518197A JP2024537695A5 JP 2024537695 A5 JP2024537695 A5 JP 2024537695A5 JP 2024518197 A JP2024518197 A JP 2024518197A JP 2024518197 A JP2024518197 A JP 2024518197A JP 2024537695 A5 JP2024537695 A5 JP 2024537695A5
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JP
Japan
Prior art keywords
design
semiconductor wafer
production
experiment
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024518197A
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English (en)
Japanese (ja)
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JP2024537695A (ja
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Publication date
Priority claimed from US17/484,204 external-priority patent/US11868119B2/en
Application filed filed Critical
Publication of JP2024537695A publication Critical patent/JP2024537695A/ja
Publication of JP2024537695A5 publication Critical patent/JP2024537695A5/ja
Pending legal-status Critical Current

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JP2024518197A 2021-09-24 2022-09-23 フィンガープリントに基づく半導体製造プロセス欠陥検出を使用する方法及びプロセス Pending JP2024537695A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/484,204 2021-09-24
US17/484,204 US11868119B2 (en) 2021-09-24 2021-09-24 Method and process using fingerprint based semiconductor manufacturing process fault detection
PCT/US2022/044531 WO2023049341A1 (en) 2021-09-24 2022-09-23 Method and process using fingerprint based semiconductor manufacturing process fault detection

Publications (2)

Publication Number Publication Date
JP2024537695A JP2024537695A (ja) 2024-10-16
JP2024537695A5 true JP2024537695A5 (enExample) 2025-09-12

Family

ID=85705981

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024518197A Pending JP2024537695A (ja) 2021-09-24 2022-09-23 フィンガープリントに基づく半導体製造プロセス欠陥検出を使用する方法及びプロセス

Country Status (6)

Country Link
US (1) US11868119B2 (enExample)
JP (1) JP2024537695A (enExample)
KR (1) KR20240072993A (enExample)
CN (1) CN117882171A (enExample)
TW (1) TW202331437A (enExample)
WO (1) WO2023049341A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118332364B (zh) * 2024-04-08 2026-06-12 北京科技大学 一种面向浮法玻璃产品质量的软测量模型检测方法及装置

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TW535207B (en) * 2002-05-08 2003-06-01 Powerchip Semiconductor Corp Method for automatically controlling defect-specification in manufacturing process of semiconductors
US6912437B2 (en) 2002-09-30 2005-06-28 Advanced Micro Devices, Inc. Method and apparatus for controlling a fabrication process based on a measured electrical characteristic
US6957154B2 (en) * 2003-02-03 2005-10-18 Qcept Technologies, Inc. Semiconductor wafer inspection system
US7085676B2 (en) 2003-06-27 2006-08-01 Tokyo Electron Limited Feed forward critical dimension control
JP4008899B2 (ja) * 2003-09-08 2007-11-14 株式会社東芝 半導体装置の製造システムおよび半導体装置の製造方法
JP2012237566A (ja) 2011-05-10 2012-12-06 Hitachi High-Technologies Corp 欠陥観察方法及びその装置
JP5690981B1 (ja) * 2013-06-21 2015-03-25 Hoya株式会社 マスクブランク用基板、マスクブランク、転写用マスク及びこれらの製造方法並びに半導体デバイスの製造方法
US10079183B2 (en) 2013-06-26 2018-09-18 Kla-Tenor Corporation Calculated electrical performance metrics for process monitoring and yield management
US9747520B2 (en) 2015-03-16 2017-08-29 Kla-Tencor Corporation Systems and methods for enhancing inspection sensitivity of an inspection tool
US9569834B2 (en) * 2015-06-22 2017-02-14 Kla-Tencor Corporation Automated image-based process monitoring and control
KR102441582B1 (ko) 2015-07-23 2022-09-07 삼성전자주식회사 Mpc 검증 방법 및 그 검증 방법을 포함한 마스크 제조방법
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CN108700823B (zh) * 2016-02-22 2020-11-27 Asml荷兰有限公司 对量测数据的贡献的分离
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US10580673B2 (en) * 2018-01-05 2020-03-03 Kla Corporation Semiconductor metrology and defect classification using electron microscopy
TWI729334B (zh) * 2018-06-07 2021-06-01 荷蘭商Ａｓｍｌ荷蘭公司 用於判定器件之控制方案的方法、電腦程式和系統及用於判定多個器件處理之基板的方法
US11056405B2 (en) * 2018-09-14 2021-07-06 Lam Research Corporation Methods and systems for controlling wafer fabrication process
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US11300948B2 (en) * 2019-06-27 2022-04-12 Nova Ltd Process control of semiconductor fabrication based on spectra quality metrics
US11423529B2 (en) * 2020-02-18 2022-08-23 Applied Materials Isreal Ltd. Determination of defect location for examination of a specimen
US11530913B2 (en) * 2020-09-24 2022-12-20 Kla Corporation Methods and systems for determining quality of semiconductor measurements
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