KR20240072993A - 핑거프린트 기반 반도체 제조 공정 결함 탐지를 사용하는 방법 및 공정 - Google Patents

핑거프린트 기반 반도체 제조 공정 결함 탐지를 사용하는 방법 및 공정 Download PDF

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Publication number
KR20240072993A
KR20240072993A KR1020247005734A KR20247005734A KR20240072993A KR 20240072993 A KR20240072993 A KR 20240072993A KR 1020247005734 A KR1020247005734 A KR 1020247005734A KR 20247005734 A KR20247005734 A KR 20247005734A KR 20240072993 A KR20240072993 A KR 20240072993A
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KR
South Korea
Prior art keywords
wafer
fingerprint
plan
measurements
semiconductor wafer
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Pending
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KR1020247005734A
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English (en)
Korean (ko)
Inventor
네이선 아이피
메간 울리
Original Assignee
도쿄엘렉트론가부시키가이샤
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Publication of KR20240072993A publication Critical patent/KR20240072993A/ko
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4184—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by fault tolerance, reliability of production system
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41805—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by assembly
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41885—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by modeling, simulation of the manufacturing system
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/31—Design entry, e.g. editors specifically adapted for circuit design
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/31—From computer integrated manufacturing till monitoring
    • G05B2219/31356—Automatic fault detection and isolation
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Geometry (AREA)
  • Evolutionary Computation (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1020247005734A 2021-09-24 2022-09-23 핑거프린트 기반 반도체 제조 공정 결함 탐지를 사용하는 방법 및 공정 Pending KR20240072993A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/484,204 2021-09-24
US17/484,204 US11868119B2 (en) 2021-09-24 2021-09-24 Method and process using fingerprint based semiconductor manufacturing process fault detection
PCT/US2022/044531 WO2023049341A1 (en) 2021-09-24 2022-09-23 Method and process using fingerprint based semiconductor manufacturing process fault detection

Publications (1)

Publication Number Publication Date
KR20240072993A true KR20240072993A (ko) 2024-05-24

Family

ID=85705981

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247005734A Pending KR20240072993A (ko) 2021-09-24 2022-09-23 핑거프린트 기반 반도체 제조 공정 결함 탐지를 사용하는 방법 및 공정

Country Status (6)

Country Link
US (1) US11868119B2 (enExample)
JP (1) JP2024537695A (enExample)
KR (1) KR20240072993A (enExample)
CN (1) CN117882171A (enExample)
TW (1) TW202331437A (enExample)
WO (1) WO2023049341A1 (enExample)

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* Cited by examiner, † Cited by third party
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CN118332364B (zh) * 2024-04-08 2026-06-12 北京科技大学 一种面向浮法玻璃产品质量的软测量模型检测方法及装置

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TW535207B (en) * 2002-05-08 2003-06-01 Powerchip Semiconductor Corp Method for automatically controlling defect-specification in manufacturing process of semiconductors
US6912437B2 (en) 2002-09-30 2005-06-28 Advanced Micro Devices, Inc. Method and apparatus for controlling a fabrication process based on a measured electrical characteristic
US6957154B2 (en) * 2003-02-03 2005-10-18 Qcept Technologies, Inc. Semiconductor wafer inspection system
US7085676B2 (en) 2003-06-27 2006-08-01 Tokyo Electron Limited Feed forward critical dimension control
JP4008899B2 (ja) * 2003-09-08 2007-11-14 株式会社東芝 半導体装置の製造システムおよび半導体装置の製造方法
JP2012237566A (ja) 2011-05-10 2012-12-06 Hitachi High-Technologies Corp 欠陥観察方法及びその装置
JP5690981B1 (ja) * 2013-06-21 2015-03-25 Hoya株式会社 マスクブランク用基板、マスクブランク、転写用マスク及びこれらの製造方法並びに半導体デバイスの製造方法
US10079183B2 (en) 2013-06-26 2018-09-18 Kla-Tenor Corporation Calculated electrical performance metrics for process monitoring and yield management
US9747520B2 (en) 2015-03-16 2017-08-29 Kla-Tencor Corporation Systems and methods for enhancing inspection sensitivity of an inspection tool
US9569834B2 (en) * 2015-06-22 2017-02-14 Kla-Tencor Corporation Automated image-based process monitoring and control
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US10234401B2 (en) 2016-02-22 2019-03-19 Qoniac Gmbh Method of manufacturing semiconductor devices by using sampling plans
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WO2018233966A1 (en) * 2017-06-22 2018-12-27 Asml Netherlands B.V. METHOD FOR DETERMINING THE CONTRIBUTION TO A DIGITAL IMPRINT
CN111316412A (zh) 2017-11-03 2020-06-19 东京毅力科创株式会社 功能性微电子装置的产出的提高
US10580673B2 (en) * 2018-01-05 2020-03-03 Kla Corporation Semiconductor metrology and defect classification using electron microscopy
TWI729334B (zh) * 2018-06-07 2021-06-01 荷蘭商Ａｓｍｌ荷蘭公司 用於判定器件之控制方案的方法、電腦程式和系統及用於判定多個器件處理之基板的方法
US11056405B2 (en) * 2018-09-14 2021-07-06 Lam Research Corporation Methods and systems for controlling wafer fabrication process
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US11300948B2 (en) * 2019-06-27 2022-04-12 Nova Ltd Process control of semiconductor fabrication based on spectra quality metrics
US11423529B2 (en) * 2020-02-18 2022-08-23 Applied Materials Isreal Ltd. Determination of defect location for examination of a specimen
US11530913B2 (en) * 2020-09-24 2022-12-20 Kla Corporation Methods and systems for determining quality of semiconductor measurements
US12360510B2 (en) * 2021-04-20 2025-07-15 Lam Research Corporation Large spot spectral sensing to control spatial setpoints

Also Published As

Publication number Publication date
US20230102438A1 (en) 2023-03-30
TW202331437A (zh) 2023-08-01
US11868119B2 (en) 2024-01-09
WO2023049341A1 (en) 2023-03-30
CN117882171A (zh) 2024-04-12
JP2024537695A (ja) 2024-10-16

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Patent event date: 20240220

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Patent event date: 20250415

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