JP2024526883A5 - - Google Patents

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Publication number
JP2024526883A5
JP2024526883A5 JP2024503551A JP2024503551A JP2024526883A5 JP 2024526883 A5 JP2024526883 A5 JP 2024526883A5 JP 2024503551 A JP2024503551 A JP 2024503551A JP 2024503551 A JP2024503551 A JP 2024503551A JP 2024526883 A5 JP2024526883 A5 JP 2024526883A5
Authority
JP
Japan
Prior art keywords
substituted
film
unsubstituted
group
composition according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024503551A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024526883A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2022/037829 external-priority patent/WO2023014509A2/en
Publication of JP2024526883A publication Critical patent/JP2024526883A/ja
Publication of JP2024526883A5 publication Critical patent/JP2024526883A5/ja
Pending legal-status Critical Current

Links

JP2024503551A 2021-07-21 2022-07-21 ３ｄ ｔｓｖパッケージ用の高温特性に優れた非導電性フィルム用の樹脂組成物 Pending JP2024526883A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163224366P 2021-07-21 2021-07-21
US63/224,366 2021-07-21
PCT/US2022/037829 WO2023014509A2 (en) 2021-07-21 2022-07-21 Resin composition for non-conductive film with excellent high temperature properties for 3d tsv packages

Publications (2)

Publication Number Publication Date
JP2024526883A JP2024526883A (ja) 2024-07-19
JP2024526883A5 true JP2024526883A5 (cg-RX-API-DMAC7.html) 2025-07-29

Family

ID=85156441

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024503551A Pending JP2024526883A (ja) 2021-07-21 2022-07-21 ３ｄ ｔｓｖパッケージ用の高温特性に優れた非導電性フィルム用の樹脂組成物

Country Status (6)

Country Link
US (1) US20240209166A1 (cg-RX-API-DMAC7.html)
JP (1) JP2024526883A (cg-RX-API-DMAC7.html)
KR (1) KR20240037994A (cg-RX-API-DMAC7.html)
CN (1) CN118019790A (cg-RX-API-DMAC7.html)
TW (1) TW202323359A (cg-RX-API-DMAC7.html)
WO (1) WO2023014509A2 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240154289A (ko) * 2023-04-18 2024-10-25 주식회사 엘지화학 비전도성 필름, 반도체 장치 및 이의 제조 방법

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008138124A (ja) * 2006-12-04 2008-06-19 Shin Etsu Chem Co Ltd 接着剤組成物及び接着性フィルム
WO2008130894A1 (en) * 2007-04-16 2008-10-30 Designer Molecules, Inc. Low temperature curing acrylate and maleimide based formulations and methods for use thereof
JP5970875B2 (ja) * 2012-03-09 2016-08-17 三菱化学株式会社 三次元集積回路用の層間充填材組成物、塗布液及び三次元集積回路の製造方法
JP6660156B2 (ja) * 2015-11-13 2020-03-04 日東電工株式会社 積層体および合同体・半導体装置の製造方法
JP6005312B1 (ja) * 2016-02-10 2016-10-12 古河電気工業株式会社 導電性接着フィルムおよびこれを用いたダイシング・ダイボンディングフィルム

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