JP2024524583A - SiCp型及び低抵抗の結晶、ブール、ウェハー、及びデバイス、並びにそれらを製造する方法 - Google Patents

SiCp型及び低抵抗の結晶、ブール、ウェハー、及びデバイス、並びにそれらを製造する方法 Download PDF

Info

Publication number
JP2024524583A
JP2024524583A JP2024500466A JP2024500466A JP2024524583A JP 2024524583 A JP2024524583 A JP 2024524583A JP 2024500466 A JP2024500466 A JP 2024500466A JP 2024500466 A JP2024500466 A JP 2024500466A JP 2024524583 A JP2024524583 A JP 2024524583A
Authority
JP
Japan
Prior art keywords
type
sic
wafer
less
resistivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024500466A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024524583A5 (enExample
Inventor
ダレン ハンセン,
ダグラス デュークス,
マーク ロボダ,
マーク ランド,
ホアン, カルロス ロホ,
ヴィクター トーレス,
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pallidus Inc
Original Assignee
Pallidus Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pallidus Inc filed Critical Pallidus Inc
Publication of JP2024524583A publication Critical patent/JP2024524583A/ja
Publication of JP2024524583A5 publication Critical patent/JP2024524583A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/90—Carbides
    • C01B32/914—Carbides of single elements
    • C01B32/956—Silicon carbide
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/90—Carbides
    • C01B32/914—Carbides of single elements
    • C01B32/956—Silicon carbide
    • C01B32/963—Preparation from compounds containing silicon
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/56—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides
    • C04B35/5603—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides with a well-defined oxygen content, e.g. oxycarbides
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/56—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides
    • C04B35/565—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides based on silicon carbide
    • C04B35/571—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides based on silicon carbide obtained from Si-containing polymer precursors or organosilicon monomers
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
    • C04B35/632—Organic additives
    • C04B35/6325—Organic additives based on organo-metallic compounds
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
    • C30B23/002—Controlling or regulating
    • C30B23/005—Controlling or regulating flux or flow of depositing species or vapour
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
    • C30B23/02—Epitaxial-layer growth
    • C30B23/06—Heating of the deposition chamber, the substrate or the materials to be evaporated
    • C30B23/066—Heating of the material to be evaporated
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10—Inorganic compounds or compositions
    • C30B29/36—Carbides
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/80—Compositional purity
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3217—Aluminum oxide or oxide forming salts thereof, e.g. bauxite, alpha-alumina
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3427—Silicates other than clay, e.g. water glass
    • C04B2235/3463—Alumino-silicates other than clay, e.g. mullite
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/40—Metallic constituents or additives not added as binding phase
    • C04B2235/408—Noble metals
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/48—Organic compounds becoming part of a ceramic after heat treatment, e.g. carbonising phenol resins
    • C04B2235/483—Si-containing organic compounds, e.g. silicone resins, (poly)silanes, (poly)siloxanes or (poly)silazanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Structural Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
JP2024500466A 2021-07-09 2022-07-09 SiCp型及び低抵抗の結晶、ブール、ウェハー、及びデバイス、並びにそれらを製造する方法 Pending JP2024524583A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US202163220132P 2021-07-09 2021-07-09
US63/220,132 2021-07-09
US202263337088P 2022-04-30 2022-04-30
US63/337,088 2022-04-30
PCT/US2022/036606 WO2023283474A1 (en) 2021-07-09 2022-07-09 Sic p-type, and low resistivity, crystals, boules, wafers and devices, and methods of making the same

Publications (2)

Publication Number Publication Date
JP2024524583A true JP2024524583A (ja) 2024-07-05
JP2024524583A5 JP2024524583A5 (enExample) 2025-06-09

Family

ID=84801002

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2024500466A Pending JP2024524583A (ja) 2021-07-09 2022-07-09 SiCp型及び低抵抗の結晶、ブール、ウェハー、及びデバイス、並びにそれらを製造する方法
JP2024500465A Pending JP2024525605A (ja) 2021-07-09 2022-07-09 SiCp型及び低抵抗の結晶、ブール、ウェハー、及びデバイス、並びにそれらを製造する方法
JP2024500462A Pending JP2024528580A (ja) 2021-07-09 2022-07-09 SiCp型及び低抵抗の結晶、ブール、ウェハー、及びデバイス、並びにそれらを製造する方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2024500465A Pending JP2024525605A (ja) 2021-07-09 2022-07-09 SiCp型及び低抵抗の結晶、ブール、ウェハー、及びデバイス、並びにそれらを製造する方法
JP2024500462A Pending JP2024528580A (ja) 2021-07-09 2022-07-09 SiCp型及び低抵抗の結晶、ブール、ウェハー、及びデバイス、並びにそれらを製造する方法

Country Status (6)

Country Link
US (3) US20230167583A1 (enExample)
EP (3) EP4367083A4 (enExample)
JP (3) JP2024524583A (enExample)
KR (3) KR20240064623A (enExample)
CA (3) CA3225056A1 (enExample)
WO (3) WO2023283474A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118086866B (zh) * 2024-02-27 2024-08-20 湖南德智新材料有限公司 一种制备碳化硅材料的方法及碳化硅材料

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016501809A (ja) * 2012-10-26 2016-01-21 ダウ コーニング コーポレーションDow Corning Corporation 平坦なSiC半導体基板
JP2017017329A (ja) * 2011-01-13 2017-01-19 株式会社半導体エネルギー研究所 記憶装置及び記憶装置の作製方法
JP2017065955A (ja) * 2015-09-29 2017-04-06 新日鐵住金株式会社 p型低抵抗率炭化珪素単結晶基板
JP2017523950A (ja) * 2014-07-29 2017-08-24 ダウ コーニング コーポレーションDow Corning Corporation 昇華による大径シリコンカーバイド結晶の製造方法及び関連する半導体sicウェハ
JP2017202957A (ja) * 2016-05-12 2017-11-16 トヨタ自動車株式会社 SiC単結晶及びその製造方法
JP2019189496A (ja) * 2018-04-26 2019-10-31 国立研究開発法人産業技術総合研究所 炭化珪素エピタキシャルウェハ及び炭化珪素半導体装置

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0645520B2 (ja) * 1986-09-25 1994-06-15 三洋電機株式会社 SiC単結晶の成長方法
RU2094547C1 (ru) * 1996-01-22 1997-10-27 Юрий Александрович Водаков Сублимационный способ выращивания монокристаллов карбида кремния и источник карбида кремния для осуществления способа
US6613143B1 (en) * 2001-07-06 2003-09-02 Technologies And Devices International, Inc. Method for fabricating bulk GaN single crystals
JP5068423B2 (ja) * 2004-10-13 2012-11-07 新日本製鐵株式会社 炭化珪素単結晶インゴット、炭化珪素単結晶ウェハ及びその製造方法
US7608524B2 (en) * 2005-04-19 2009-10-27 Ii-Vi Incorporated Method of and system for forming SiC crystals having spatially uniform doping impurities
JP4469396B2 (ja) * 2008-01-15 2010-05-26 新日本製鐵株式会社 炭化珪素単結晶インゴット、これから得られる基板及びエピタキシャルウェハ
WO2009148930A1 (en) * 2008-06-04 2009-12-10 Dow Corning Corporation Method of reducing memory effects in semiconductor epitaxy
JP2010095397A (ja) * 2008-10-15 2010-04-30 Nippon Steel Corp 炭化珪素単結晶及び炭化珪素単結晶ウェハ
US9464366B2 (en) * 2009-08-20 2016-10-11 The United States Of America, As Represented By The Secretary Of The Navy Reduction of basal plane dislocations in epitaxial SiC
JP5696630B2 (ja) * 2011-09-21 2015-04-08 住友電気工業株式会社 炭化珪素基板およびその製造方法
JPWO2013054580A1 (ja) * 2011-10-13 2015-03-30 住友電気工業株式会社 炭化珪素基板、炭化珪素半導体装置、炭化珪素基板の製造方法、および炭化珪素半導体装置の製造方法
US8912550B2 (en) * 2011-12-22 2014-12-16 Sumitomo Electric Industries, Ltd. Dislocations in SiC semiconductor substrate
US10322936B2 (en) * 2013-05-02 2019-06-18 Pallidus, Inc. High purity polysilocarb materials, applications and processes
DE102014217956B4 (de) * 2014-09-09 2018-05-09 Sicrystal Ag Herstellungsverfahren für einen Vanadium-dotierten SiC-Volumeneinkristall und Vanadium-dotiertes SiC-Substrat
US10753010B2 (en) * 2014-09-25 2020-08-25 Pallidus, Inc. Vapor deposition apparatus and techniques using high puritiy polymer derived silicon carbide
US10633400B2 (en) * 2015-02-28 2020-04-28 Melior Innovations, Inc. Nanocomposite silicon oxygen carbon materials and uses
JP2017065986A (ja) * 2015-09-30 2017-04-06 新日鐵住金株式会社 低抵抗率炭化珪素単結晶基板の製造方法
WO2017199792A1 (ja) * 2016-05-20 2017-11-23 三菱電機株式会社 炭化珪素エピタキシャル基板および炭化珪素半導体装置
US20180244513A1 (en) * 2017-02-28 2018-08-30 The Government Of The United States Of America, As Represented By The Secretary Of The Navy Silicon carbide structure, device, and method
DE112018001768B4 (de) * 2017-03-28 2024-12-12 Mitsubishi Electric Corporation Siliciumcarbid-substrat, verfahren zum herstellen eines siliciumcarbid-substrats und verfahren zum herstellen einer siliciumcarbid-halbleitervorrichtung
JP7352058B2 (ja) * 2017-11-01 2023-09-28 セントラル硝子株式会社 炭化ケイ素単結晶の製造方法
JP7085833B2 (ja) * 2017-12-25 2022-06-17 昭和電工株式会社 炭化珪素単結晶の製造方法
WO2020179796A1 (ja) * 2019-03-05 2020-09-10 学校法人関西学院 SiCエピタキシャル基板の製造方法及びその製造装置
US12054850B2 (en) * 2019-12-27 2024-08-06 Wolfspeed, Inc. Large diameter silicon carbide wafers

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017017329A (ja) * 2011-01-13 2017-01-19 株式会社半導体エネルギー研究所 記憶装置及び記憶装置の作製方法
JP2016501809A (ja) * 2012-10-26 2016-01-21 ダウ コーニング コーポレーションDow Corning Corporation 平坦なSiC半導体基板
JP2017523950A (ja) * 2014-07-29 2017-08-24 ダウ コーニング コーポレーションDow Corning Corporation 昇華による大径シリコンカーバイド結晶の製造方法及び関連する半導体sicウェハ
JP2017065955A (ja) * 2015-09-29 2017-04-06 新日鐵住金株式会社 p型低抵抗率炭化珪素単結晶基板
JP2017202957A (ja) * 2016-05-12 2017-11-16 トヨタ自動車株式会社 SiC単結晶及びその製造方法
JP2019189496A (ja) * 2018-04-26 2019-10-31 国立研究開発法人産業技術総合研究所 炭化珪素エピタキシャルウェハ及び炭化珪素半導体装置

Also Published As

Publication number Publication date
US20230167583A1 (en) 2023-06-01
JP2024528580A (ja) 2024-07-30
WO2023283472A1 (en) 2023-01-12
KR20240064624A (ko) 2024-05-13
EP4367083A4 (en) 2025-05-28
EP4367710A1 (en) 2024-05-15
KR20240064623A (ko) 2024-05-13
EP4367710A4 (en) 2025-04-23
KR20240053577A (ko) 2024-04-24
US20230167580A1 (en) 2023-06-01
US20230167582A1 (en) 2023-06-01
EP4367711A4 (en) 2025-06-04
EP4367711A1 (en) 2024-05-15
JP2024525605A (ja) 2024-07-12
WO2023283474A1 (en) 2023-01-12
WO2023283471A1 (en) 2023-01-12
CA3225056A1 (en) 2023-01-12
EP4367083A1 (en) 2024-05-15
CA3225061A1 (en) 2023-01-12
CA3225066A1 (en) 2023-01-12

Similar Documents

Publication Publication Date Title
JP7597388B2 (ja) SiCブールを成長させるための蒸着プロセスにおいて使用するための出発材料
US10753010B2 (en) Vapor deposition apparatus and techniques using high puritiy polymer derived silicon carbide
TWI858402B (zh) P型碳化矽與低電阻率碳化矽之晶體、晶棒、晶圓與元件及其製造方法
JP2024525605A (ja) SiCp型及び低抵抗の結晶、ブール、ウェハー、及びデバイス、並びにそれらを製造する方法
TWI906200B (zh) 碳化矽空間形體及形成胚晶之方法
EP4632116A1 (en) Layered seed, method of fabrication of a layered seed and method for growing a volume mono crystal with the layered seed
KR20250149570A (ko) 층상 기판, 층상 기판의 제조 방법 및 층상 기판을 이용하여 에피택셜 층을 성장시키는 방법

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250530

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20250530

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20260421

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20260508

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20260807