JP2024523114A5 - - Google Patents

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Publication number
JP2024523114A5
JP2024523114A5 JP2023570350A JP2023570350A JP2024523114A5 JP 2024523114 A5 JP2024523114 A5 JP 2024523114A5 JP 2023570350 A JP2023570350 A JP 2023570350A JP 2023570350 A JP2023570350 A JP 2023570350A JP 2024523114 A5 JP2024523114 A5 JP 2024523114A5
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JP
Japan
Prior art keywords
reassembled
gaps
complete
pieces
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023570350A
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English (en)
Japanese (ja)
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JP2024523114A (ja
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Publication date
Priority claimed from US17/341,810 external-priority patent/US11654634B2/en
Application filed filed Critical
Publication of JP2024523114A publication Critical patent/JP2024523114A/ja
Publication of JP2024523114A5 publication Critical patent/JP2024523114A5/ja
Pending legal-status Critical Current

Links

JP2023570350A 2021-06-08 2022-05-26 敵対的生成ネットワーク技術を用いた３次元プリント Pending JP2024523114A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/341,810 2021-06-08
US17/341,810 US11654634B2 (en) 2021-06-08 2021-06-08 Three-dimensional printing using generative adversarial network techniques
PCT/CN2022/095162 WO2022257772A1 (en) 2021-06-08 2022-05-26 Three-dimensional printing using generative adversarial network techniques

Publications (2)

Publication Number Publication Date
JP2024523114A JP2024523114A (ja) 2024-06-28
JP2024523114A5 true JP2024523114A5 (enExample) 2024-07-31

Family

ID=84284822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023570350A Pending JP2024523114A (ja) 2021-06-08 2022-05-26 敵対的生成ネットワーク技術を用いた３次元プリント

Country Status (4)

Country Link
US (1) US11654634B2 (enExample)
JP (1) JP2024523114A (enExample)
CN (1) CN117440883A (enExample)
WO (1) WO2022257772A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12501287B2 (en) * 2021-09-30 2025-12-16 At&T Intellectual Property I, L.P. Autonomous onsite remediation of adverse conditions for network infrastructure in a fifth generation (5G) network or other next generation wireless communication system
US20250319589A1 (en) * 2024-04-11 2025-10-16 Toyota Motor Engineering & Manufacturing North America, Inc. Underbody frame equipment and robotic confirmation equipment prior to prototype sheet metal parts

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JPH05225290A (ja) * 1992-02-12 1993-09-03 Nec Software Ltd ３次元パラメトリック機能による形状修正方式
JP2002032922A (ja) 2000-05-12 2002-01-31 Sony Corp 光ディスク及び光ディスク装置
US20140042657A1 (en) * 2012-08-08 2014-02-13 Makerbot Industries, Llc Printed circuit board with integrated temperature sensing
US10725451B2 (en) * 2013-10-21 2020-07-28 Made In Space, Inc. Terrestrial and space-based manufacturing systems
US9916398B2 (en) * 2013-12-10 2018-03-13 Dassault Systemes Laser scan re-engineering of 3D CAD models
US9857784B2 (en) 2014-11-12 2018-01-02 International Business Machines Corporation Method for repairing with 3D printing
JP6645681B2 (ja) * 2015-03-11 2020-02-14 キヤノン株式会社 ３ｄデータ管理装置
US10022915B2 (en) 2015-03-16 2018-07-17 International Business Machines Corporation Establishing surface parameters while printing a three-dimensional object from a digital model
US10118345B2 (en) 2015-06-17 2018-11-06 Xerox Corporation System and method for evaluation of a three-dimensional (3D) object during formation of the object
US10489816B1 (en) 2016-08-24 2019-11-26 Wells Fargo Bank, N.A. Offers to print three-dimensional objects
CA3010945A1 (en) * 2017-07-10 2019-01-10 3D Bridge Solutions Inc. Systems, devices and methods for protecting 3d rendered designs
CN107392873A (zh) 2017-07-28 2017-11-24 上海鋆创信息技术有限公司 物体虚拟修复方法、物体修复方法及物体虚拟展示系统
US10614557B2 (en) * 2017-10-16 2020-04-07 Adobe Inc. Digital image completion using deep learning
US10518480B2 (en) 2018-04-02 2019-12-31 Nanotronics Imaging, Inc. Systems, methods, and media for artificial intelligence feedback control in additive manufacturing
JP6863596B6 (ja) * 2018-04-24 2021-06-02 シンメトリー・ディメンションズ・インク データ処理装置及びデータ処理方法
CN109300128B (zh) * 2018-09-29 2022-08-26 聚时科技(上海)有限公司 基于卷积神经网隐含结构的迁移学习图像处理方法
US10719920B2 (en) * 2018-10-12 2020-07-21 Adobe Inc. Environment map generation and hole filling
TWI708041B (zh) 2018-10-17 2020-10-21 所羅門股份有限公司 檢測與標記瑕疵的方法
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CN112634145A (zh) 2020-11-27 2021-04-09 长春工业大学 基于三维深度卷积生成对抗网络的三维模型修复方法

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