JP2024523114A - 敵対的生成ネットワーク技術を用いた３次元プリント - Google Patents

敵対的生成ネットワーク技術を用いた３次元プリント Download PDF

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Publication number
JP2024523114A
JP2024523114A JP2023570350A JP2023570350A JP2024523114A JP 2024523114 A JP2024523114 A JP 2024523114A JP 2023570350 A JP2023570350 A JP 2023570350A JP 2023570350 A JP2023570350 A JP 2023570350A JP 2024523114 A JP2024523114 A JP 2024523114A
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reassembled
pieces
complete
gaps
complete object
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Japanese (ja)
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JP2024523114A5 (enExample
Inventor
デクロップ、クレメント
イー ベラー、チャールズ
エー シルヴァースタイン、ザカリー
アール フォックス、ジェレミー
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International Business Machines Corp
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International Business Machines Corp
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Publication of JP2024523114A5 publication Critical patent/JP2024523114A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30—Auxiliary operations or equipment
    • B29C64/386—Data acquisition or data processing for additive manufacturing
    • B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00—Data acquisition or data processing for additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30—Auxiliary operations or equipment
    • B29C64/386—Data acquisition or data processing for additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00—Data acquisition or data processing for additive manufacturing
    • B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/10—Geometric CAD
    • G06F30/17—Mechanical parametric or variational design
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/047—Probabilistic or stochastic networks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/0475—Generative networks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/049—Temporal neural networks, e.g. delay elements, oscillating neurons or pulsed inputs
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/094—Adversarial learning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/30—Process control
    • B22F10/38—Process control to achieve specific product aspects, e.g. surface smoothness, density, porosity or hollow structures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2113/00—Details relating to the application field
    • G06F2113/10—Additive manufacturing, e.g. three-dimensional [3D] printing
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/18—Manufacturability analysis or optimisation for manufacturability

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Evolutionary Computation (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Biomedical Technology (AREA)
  • General Health & Medical Sciences (AREA)
  • Software Systems (AREA)
  • Mathematical Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Artificial Intelligence (AREA)
  • Computing Systems (AREA)
  • Biophysics (AREA)
  • Computational Linguistics (AREA)
  • Data Mining & Analysis (AREA)
  • Geometry (AREA)
  • Molecular Biology (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Computational Mathematics (AREA)
  • Mathematical Analysis (AREA)
  • Mathematical Optimization (AREA)
  • Pure & Applied Mathematics (AREA)
  • Probability & Statistics with Applications (AREA)
  • Processing Or Creating Images (AREA)
  • Information Retrieval, Db Structures And Fs Structures Therefor (AREA)
JP2023570350A 2021-06-08 2022-05-26 敵対的生成ネットワーク技術を用いた３次元プリント Pending JP2024523114A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/341,810 2021-06-08
US17/341,810 US11654634B2 (en) 2021-06-08 2021-06-08 Three-dimensional printing using generative adversarial network techniques
PCT/CN2022/095162 WO2022257772A1 (en) 2021-06-08 2022-05-26 Three-dimensional printing using generative adversarial network techniques

Publications (2)

Publication Number Publication Date
JP2024523114A true JP2024523114A (ja) 2024-06-28
JP2024523114A5 JP2024523114A5 (enExample) 2024-07-31

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JP2023570350A Pending JP2024523114A (ja) 2021-06-08 2022-05-26 敵対的生成ネットワーク技術を用いた３次元プリント

Country Status (4)

Country Link
US (1) US11654634B2 (enExample)
JP (1) JP2024523114A (enExample)
CN (1) CN117440883A (enExample)
WO (1) WO2022257772A1 (enExample)

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US12501287B2 (en) * 2021-09-30 2025-12-16 At&T Intellectual Property I, L.P. Autonomous onsite remediation of adverse conditions for network infrastructure in a fifth generation (5G) network or other next generation wireless communication system
US20250319589A1 (en) * 2024-04-11 2025-10-16 Toyota Motor Engineering & Manufacturing North America, Inc. Underbody frame equipment and robotic confirmation equipment prior to prototype sheet metal parts

Citations (7)

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JPH05225290A (ja) * 1992-02-12 1993-09-03 Nec Software Ltd ３次元パラメトリック機能による形状修正方式
US20160129638A1 (en) * 2014-11-12 2016-05-12 International Business Machines Corporation Method for Repairing with 3D Printing
JP2016170488A (ja) * 2015-03-11 2016-09-23 キヤノン株式会社 ３ｄ物体のデータ構造及び３ｄデータ管理装置
CN109300128A (zh) * 2018-09-29 2019-02-01 聚时科技(上海)有限公司 基于卷积神经网隐含结构的迁移学习图像处理方法
US20190114748A1 (en) * 2017-10-16 2019-04-18 Adobe Systems Incorporated Digital Image Completion Using Deep Learning
JP2019191874A (ja) * 2018-04-24 2019-10-31 ディヴァース インコーポレイテッド データ処理装置及びデータ処理方法
US20200118253A1 (en) * 2018-10-12 2020-04-16 Adobe Inc. Environment map generation and hole filling

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US20140042657A1 (en) * 2012-08-08 2014-02-13 Makerbot Industries, Llc Printed circuit board with integrated temperature sensing
US10725451B2 (en) * 2013-10-21 2020-07-28 Made In Space, Inc. Terrestrial and space-based manufacturing systems
US9916398B2 (en) * 2013-12-10 2018-03-13 Dassault Systemes Laser scan re-engineering of 3D CAD models
US10022915B2 (en) 2015-03-16 2018-07-17 International Business Machines Corporation Establishing surface parameters while printing a three-dimensional object from a digital model
US10118345B2 (en) 2015-06-17 2018-11-06 Xerox Corporation System and method for evaluation of a three-dimensional (3D) object during formation of the object
US10489816B1 (en) 2016-08-24 2019-11-26 Wells Fargo Bank, N.A. Offers to print three-dimensional objects
CA3010945A1 (en) * 2017-07-10 2019-01-10 3D Bridge Solutions Inc. Systems, devices and methods for protecting 3d rendered designs
CN107392873A (zh) 2017-07-28 2017-11-24 上海鋆创信息技术有限公司 物体虚拟修复方法、物体修复方法及物体虚拟展示系统
US10518480B2 (en) 2018-04-02 2019-12-31 Nanotronics Imaging, Inc. Systems, methods, and media for artificial intelligence feedback control in additive manufacturing
TWI708041B (zh) 2018-10-17 2020-10-21 所羅門股份有限公司 檢測與標記瑕疵的方法
CN112074399A (zh) 2018-10-20 2020-12-11 惠普发展公司，有限责任合伙企业 选择3d打印的去粉末工艺
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JPH05225290A (ja) * 1992-02-12 1993-09-03 Nec Software Ltd ３次元パラメトリック機能による形状修正方式
US20160129638A1 (en) * 2014-11-12 2016-05-12 International Business Machines Corporation Method for Repairing with 3D Printing
JP2016170488A (ja) * 2015-03-11 2016-09-23 キヤノン株式会社 ３ｄ物体のデータ構造及び３ｄデータ管理装置
US20190114748A1 (en) * 2017-10-16 2019-04-18 Adobe Systems Incorporated Digital Image Completion Using Deep Learning
JP2019191874A (ja) * 2018-04-24 2019-10-31 ディヴァース インコーポレイテッド データ処理装置及びデータ処理方法
CN109300128A (zh) * 2018-09-29 2019-02-01 聚时科技(上海)有限公司 基于卷积神经网隐含结构的迁移学习图像处理方法
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CN117440883A (zh) 2024-01-23
US20220388246A1 (en) 2022-12-08
US11654634B2 (en) 2023-05-23
WO2022257772A1 (en) 2022-12-15

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