JP2024146277A - フィラー配列フィルム及びその製造方法並びに接続構造体及びその製造方法 - Google Patents

フィラー配列フィルム及びその製造方法並びに接続構造体及びその製造方法 Download PDF

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Publication number
JP2024146277A
JP2024146277A JP2023059074A JP2023059074A JP2024146277A JP 2024146277 A JP2024146277 A JP 2024146277A JP 2023059074 A JP2023059074 A JP 2023059074A JP 2023059074 A JP2023059074 A JP 2023059074A JP 2024146277 A JP2024146277 A JP 2024146277A
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JP
Japan
Prior art keywords
filler
film
resin layer
insulating resin
article
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023059074A
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English (en)
Japanese (ja)
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JP2024146277A5 (https=
Inventor
一夢 渡部
Kazumu Watanabe
大樹 野田
Daiki Noda
俊紀 白岩
Toshiki Shiraiwa
怜司 塚尾
Satoshi Tsukao
直樹 林
Naoki Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to JP2023059074A priority Critical patent/JP2024146277A/ja
Priority to TW113110095A priority patent/TW202506857A/zh
Priority to PCT/JP2024/010941 priority patent/WO2024203689A1/ja
Priority to KR1020257031399A priority patent/KR20250153822A/ko
Priority to CN202480020872.6A priority patent/CN120898330A/zh
Publication of JP2024146277A publication Critical patent/JP2024146277A/ja
Publication of JP2024146277A5 publication Critical patent/JP2024146277A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Insulated Conductors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Wire Bonding (AREA)
  • Led Device Packages (AREA)
  • Laminated Bodies (AREA)
JP2023059074A 2023-03-31 2023-03-31 フィラー配列フィルム及びその製造方法並びに接続構造体及びその製造方法 Pending JP2024146277A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2023059074A JP2024146277A (ja) 2023-03-31 2023-03-31 フィラー配列フィルム及びその製造方法並びに接続構造体及びその製造方法
TW113110095A TW202506857A (zh) 2023-03-31 2024-03-19 填料排列膜及其製造方法以及連接構造體及其製造方法
PCT/JP2024/010941 WO2024203689A1 (ja) 2023-03-31 2024-03-21 フィラー配列フィルム及びその製造方法並びに接続構造体及びその製造方法
KR1020257031399A KR20250153822A (ko) 2023-03-31 2024-03-21 필러 배열 필름 및 그 제조 방법 그리고 접속 구조체 및 그 제조 방법
CN202480020872.6A CN120898330A (zh) 2023-03-31 2024-03-21 填料排列膜及其制造方法以及连接结构体及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2023059074A JP2024146277A (ja) 2023-03-31 2023-03-31 フィラー配列フィルム及びその製造方法並びに接続構造体及びその製造方法

Publications (2)

Publication Number Publication Date
JP2024146277A true JP2024146277A (ja) 2024-10-15
JP2024146277A5 JP2024146277A5 (https=) 2026-04-01

Family

ID=92904876

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023059074A Pending JP2024146277A (ja) 2023-03-31 2023-03-31 フィラー配列フィルム及びその製造方法並びに接続構造体及びその製造方法

Country Status (5)

Country Link
JP (1) JP2024146277A (https=)
KR (1) KR20250153822A (https=)
CN (1) CN120898330A (https=)
TW (1) TW202506857A (https=)
WO (1) WO2024203689A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026074952A1 (ja) * 2024-10-02 2026-04-09 デクセリアルズ株式会社 フィラー含有フィルム及びその製造方法並びに接続構造体及びその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3994335B2 (ja) * 2002-10-04 2007-10-17 日立化成工業株式会社 接続部材の製造方法
KR101716945B1 (ko) * 2012-08-24 2017-03-15 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름 및 그의 제조 방법
JP6238655B2 (ja) * 2013-09-12 2017-11-29 デクセリアルズ株式会社 接続構造体、及び異方性導電接着剤
TWI862897B (zh) 2014-11-17 2024-11-21 日商迪睿合股份有限公司 異向性導電膜及連接構造體
JP6759578B2 (ja) * 2014-12-22 2020-09-23 デクセリアルズ株式会社 異方導電性フィルム及び接続構造体
JP2022151822A (ja) 2021-03-26 2022-10-07 デクセリアルズ株式会社 フィラー配列フィルム
JP7835589B2 (ja) * 2021-03-26 2026-03-25 デクセリアルズ株式会社 表示装置の製造方法

Also Published As

Publication number Publication date
WO2024203689A1 (ja) 2024-10-03
TW202506857A (zh) 2025-02-16
KR20250153822A (ko) 2025-10-27
CN120898330A (zh) 2025-11-04

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