KR20250153822A - 필러 배열 필름 및 그 제조 방법 그리고 접속 구조체 및 그 제조 방법 - Google Patents

필러 배열 필름 및 그 제조 방법 그리고 접속 구조체 및 그 제조 방법

Info

Publication number
KR20250153822A
KR20250153822A KR1020257031399A KR20257031399A KR20250153822A KR 20250153822 A KR20250153822 A KR 20250153822A KR 1020257031399 A KR1020257031399 A KR 1020257031399A KR 20257031399 A KR20257031399 A KR 20257031399A KR 20250153822 A KR20250153822 A KR 20250153822A
Authority
KR
South Korea
Prior art keywords
filler
array film
film
insulating resin
resin layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257031399A
Other languages
English (en)
Korean (ko)
Inventor
가즈무 와타나베
다이키 노다
도시키 시라이와
레이지 츠카오
나오키 하야시
Original Assignee
데쿠세리아루즈 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 데쿠세리아루즈 가부시키가이샤 filed Critical 데쿠세리아루즈 가부시키가이샤
Publication of KR20250153822A publication Critical patent/KR20250153822A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Insulated Conductors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Wire Bonding (AREA)
  • Led Device Packages (AREA)
  • Laminated Bodies (AREA)
KR1020257031399A 2023-03-31 2024-03-21 필러 배열 필름 및 그 제조 방법 그리고 접속 구조체 및 그 제조 방법 Pending KR20250153822A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023059074A JP2024146277A (ja) 2023-03-31 2023-03-31 フィラー配列フィルム及びその製造方法並びに接続構造体及びその製造方法
JPJP-P-2023-059074 2023-03-31
PCT/JP2024/010941 WO2024203689A1 (ja) 2023-03-31 2024-03-21 フィラー配列フィルム及びその製造方法並びに接続構造体及びその製造方法

Publications (1)

Publication Number Publication Date
KR20250153822A true KR20250153822A (ko) 2025-10-27

Family

ID=92904876

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257031399A Pending KR20250153822A (ko) 2023-03-31 2024-03-21 필러 배열 필름 및 그 제조 방법 그리고 접속 구조체 및 그 제조 방법

Country Status (5)

Country Link
JP (1) JP2024146277A (https=)
KR (1) KR20250153822A (https=)
CN (1) CN120898330A (https=)
TW (1) TW202506857A (https=)
WO (1) WO2024203689A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026074952A1 (ja) * 2024-10-02 2026-04-09 デクセリアルズ株式会社 フィラー含有フィルム及びその製造方法並びに接続構造体及びその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016103476A (ja) 2014-11-17 2016-06-02 デクセリアルズ株式会社 異方性導電フィルム
JP2022151822A (ja) 2021-03-26 2022-10-07 デクセリアルズ株式会社 フィラー配列フィルム

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3994335B2 (ja) * 2002-10-04 2007-10-17 日立化成工業株式会社 接続部材の製造方法
KR101716945B1 (ko) * 2012-08-24 2017-03-15 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름 및 그의 제조 방법
JP6238655B2 (ja) * 2013-09-12 2017-11-29 デクセリアルズ株式会社 接続構造体、及び異方性導電接着剤
JP6759578B2 (ja) * 2014-12-22 2020-09-23 デクセリアルズ株式会社 異方導電性フィルム及び接続構造体
JP7835589B2 (ja) * 2021-03-26 2026-03-25 デクセリアルズ株式会社 表示装置の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016103476A (ja) 2014-11-17 2016-06-02 デクセリアルズ株式会社 異方性導電フィルム
JP2022151822A (ja) 2021-03-26 2022-10-07 デクセリアルズ株式会社 フィラー配列フィルム

Also Published As

Publication number Publication date
WO2024203689A1 (ja) 2024-10-03
TW202506857A (zh) 2025-02-16
JP2024146277A (ja) 2024-10-15
CN120898330A (zh) 2025-11-04

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