JP2024067437A - Adhesive tape application device - Google Patents

Abstract

[Problem] To provide an adhesive tape application device capable of applying adhesive tape to a workpiece with greater accuracy. [Solution] The device comprises a holding table 13 that holds a held surface Wb of a workpiece W, a chamber 29 that houses the holding table 13 and sandwiches an application member P and is partitioned into a lower space H1 and an upper space H2, a heating mechanism 73 that heats the adhesive tape PT provided on the application member P from the non-adhesive side, and an application unit 9 that generates a differential pressure Gs between the lower space H1 and the upper space H2 while the adhesive tape PT is heated by the heating mechanism 73, and applies the adhesive tape PT to the workpiece W with the differential pressure Gs. [Selected Figure] Figure 5

Description

The present invention relates to an adhesive tape application device used to apply adhesive tape, for example protective tape, to a workpiece, for example a semiconductor wafer (hereinafter referred to as "wafer") or a substrate.

In the process of manufacturing various products from workpieces such as wafers or substrates, a process of applying adhesive tape to the workpiece may be carried out. Examples of adhesive tape applied to the workpiece include adhesive tape for protecting circuits (protective tape), adhesive tape for supporting the workpiece (dicing tape), and adhesive film for sealing devices.

Conventionally, the following device has been proposed for applying adhesive tape to a workpiece. That is, a holding table is stored inside a chamber consisting of a pair of upper and lower housings, and the workpiece is held horizontally on the holding table. Then, an adhesive sheet is sandwiched between the joints of the chamber, and the internal space of the chamber is divided by the horizontal adhesive tape to form two spaces, an upper space and a lower space. Then, the air pressure in one space is made lower than the air pressure in the other space to generate a pressure difference, and the adhesive tape is applied to the workpiece by this pressure difference. In such a conventional adhesive tape application device, a configuration has been proposed in which the adhesive tape is softened by heating it with a heater embedded inside the holding table (see Patent Document 1). The softening of the adhesive tape improves the adhesive tape's ability to embed into the unevenness of the workpiece, so the adhesive tape can be applied to the workpiece with high precision.

JP 2017-041469 A

However, the above-mentioned conventional device has the following problem. That is, the conventional device does not heat the adhesive tape efficiently. Therefore, there is a concern that the conventional device has a problem in that it is difficult to improve the accuracy of applying the adhesive tape to the workpiece.

The present invention was made in consideration of these circumstances, and its main objective is to provide an adhesive tape application device that can apply adhesive tape to a workpiece with greater precision.

As a result of the inventors' investigation into the above problem, the following findings were obtained. That is, when an adhesive tape is heated using a heater embedded in a holding table that holds a workpiece, the heat of the heater is conducted to the workpiece on the holding table, and then further conducted to the adhesive tape. In recent years, the variety of workpieces has increased, and glass substrates and resin substrates are often used as workpieces in addition to silicon wafers. Both glass and resin have lower thermal conductivity than silicone. Therefore, when adhesive tape is applied to a workpiece made of glass or resin, the efficiency of heating the adhesive tape is reduced due to the low thermal conductivity of the workpiece, and it is believed that the accuracy of application of the adhesive tape is reduced.

In order to achieve the above object, the present invention has the following configuration.
That is, an adhesive tape application device that applies an adhesive tape to a workpiece,
A holding table that holds a held surface of the workpiece;
a chamber having an upper housing and a lower housing, the chamber housing the holding table;
a chamber partitioning mechanism that divides an internal space of the chamber into an upper space and a lower space by sandwiching a sheet material between the upper housing and the lower housing;
A supply mechanism for supplying the sheet material;
a tape heating mechanism for heating the adhesive tape from a non-adhesive side;
a joining mechanism that, while the adhesive tape is heated by a tape heating mechanism, generates a pressure difference between the upper space and the lower space partitioned by the sheet material, and joins the adhesive tape to the workpiece by the pressure difference formed by the pressure difference;
The present invention is characterized by comprising:

(Actions and Effects) According to this configuration, the adhesive tape is heated to soften the adhesive, and then the adhesive tape is attached to the workpiece. In this case, when the workpiece is attached to the adhesive tape, the layer of adhesive becomes more easily deformed by heating. In other words, the adhesive of the adhesive tape deforms more precisely in accordance with the shape of the workpiece, which further improves the adhesion of the adhesive tape to the workpiece.

The tape heating mechanism also heats the adhesive tape from the non-adhesive side inside the chamber. In other words, the tape heating mechanism heats the adhesive tape without passing through the workpiece, which prevents a decrease in the heating efficiency of the adhesive tape due to the thickness or constituent material of the workpiece. As a result, the heating efficiency of the adhesive tape can be improved compared to the conventional configuration in which the adhesive tape is indirectly heated through the workpiece, thereby further improving the adhesion between the workpiece and the adhesive tape.

In the above-mentioned invention, it is preferable that the workpiece has a predetermined area of the held surface that has an uneven shape, the holding table has a main body that supports the workpiece, and a tilted holding prevention part that prevents the workpiece from being held in a tilted state, and the tilted holding prevention part prevents the main body from directly contacting the predetermined area of the workpiece.

(Actions and Effects) According to this configuration, the holding table is equipped with an inclined holding prevention section, and is configured to prevent a specific area of the held surface of the workpiece that has an uneven shape from coming into direct contact with the main body. Therefore, even if the held surface of the workpiece is uneven, it is possible to prevent the workpiece from being held in an inclined position relative to the holding table. As a result, it is possible to prevent a decrease in the parallelism between the workpiece and the adhesive tape, so that the workpiece can be attached to the adhesive tape with high precision.

In the above-mentioned invention, it is preferable that the tilted holding prevention portion is a recess formed in a portion of the main body that faces a predetermined area of the workpiece, and the holding table holds the workpiece by the main body contacting a portion of the workpiece other than the predetermined area.

(Function and Effect) According to this configuration, a recess is formed in the main body of the holding table. The main body contacts a portion of the workpiece other than the specified area, and the holding table holds the workpiece while avoiding the main body of the holding table from directly contacting the specified area. In other words, the unevenness formed in the specified area of the workpiece fits into the recess, and the main body of the holding table contacts the flat portion of the workpiece other than the specified area. In this case, the recess prevents the main body from contacting the uneven portion of the workpiece, so that the workpiece can be prevented from being held in an inclined position relative to the holding table, even if the workpiece has unevenness formed on the held surface. As a result, the parallelism between the workpiece and the adhesive tape can be prevented from decreasing, and the workpiece can be attached to the adhesive tape with high precision.

In the above-mentioned invention, it is preferable that the tilted holding prevention portion is a deformation portion that deforms according to the shape of the specified area, and that the deformation portion deforms according to the shape of the specified area to prevent the workpiece from being held in a tilted state.

(Actions and Effects) According to this configuration, the holding table is provided with a deformation portion as an inclined holding prevention portion that deforms according to the shape of a predetermined area of the workpiece where unevenness is formed. The holding table holds the workpiece while the deformation portion deforms according to the shape of the predetermined area. In this case, even if unevenness is formed on the held surface of the workpiece, the deformation portion deforms according to the uneven shape, so it is possible to prevent the workpiece from being held in an inclined position relative to the holding table. As a result, it is possible to prevent a decrease in the parallelism between the workpiece and the adhesive tape, so that the workpiece can be attached to the adhesive tape with high precision.

In the above-mentioned invention, it is preferable that the sheet material is held by a frame that surrounds the sheet material, and the chamber partitioning mechanism partitions the internal space of the chamber into an upper space and a lower space by sandwiching the sheet material held by the frame between the upper housing and the lower housing.

(Actions and Effects) With this configuration, the sheet material held by the frame is sandwiched between the upper housing and the lower housing to form a chamber, so the size of the chamber can be made smaller than the frame. This allows the device to be made more compact. Also, because the internal space of the chamber is divided into an upper space and a lower space by the sheet material, there is no need to provide a new mechanism for dividing the chamber into two spaces. This allows the device configuration to be simplified.

In the above-mentioned invention, it is preferable that the sheet material is the adhesive tape, the chamber partitioning mechanism divides the internal space of the chamber into an upper space and a lower space with the adhesive tape by sandwiching the adhesive tape between the upper housing and the lower housing, and the attachment mechanism generates a pressure difference between the upper space and the lower space partitioned by the adhesive tape, and attaches the adhesive tape to the workpiece with the differential pressure formed by the pressure difference.

(Actions and Effects) With this configuration, the adhesive tape held by the frame is sandwiched between the upper housing and the lower housing to form the chamber, so the size of the chamber can be made smaller than the frame. This allows the device to be made even more compact. Also, because the adhesive tape divides the internal space of the chamber into an upper space and a lower space with a sheet material, there is no need to provide a new mechanism for dividing the chamber into two spaces. This allows the device configuration to be simplified.

In the above-mentioned invention, it is preferable that the adhesive tape has a predetermined shape corresponding to the shape of the workpiece, the sheet material holds the adhesive tape, the chamber partitioning mechanism sandwiches the portion of the sheet material that does not hold the adhesive tape between the upper housing and the lower housing, thereby partitioning the internal space of the chamber into an upper space and a lower space with the sheet material, and the attachment mechanism generates a pressure difference between the upper space and the lower space partitioned by the adhesive tape, and attaches the adhesive tape held by the sheet material to the workpiece with the differential pressure formed by the pressure difference.

(Actions and Effects) According to this configuration, the adhesive tape has a predetermined shape corresponding to the shape of the workpiece, and the sheet material holds the adhesive tape. The portion of the sheet material that does not hold the adhesive tape is then sandwiched between the upper housing and the lower housing to divide the interior of the chamber into two spaces. In this case, the portion of the sheet material that does not hold the adhesive tape is sandwiched between the upper housing and the lower housing to form the chamber, so the size of the adhesive tape can be reduced. In addition, because the sheet material divides the interior space of the chamber into an upper space and a lower space, there is no need to provide a new mechanism for dividing the chamber into two spaces. This makes it possible to further simplify the configuration of the device.

In the above-mentioned invention, it is preferable that the workpiece is rectangular. According to this configuration, the adhesive tape is applied to a rectangular workpiece. In this case, by holding the workpiece using a holding table equipped with an inclined holding prevention part, the workpiece can be held horizontally more reliably and accurately, even if it is a rectangular workpiece.

According to the adhesive tape application device of the present invention, the adhesive tape is heated to soften the adhesive, and then the adhesive tape is applied to the workpiece. In this case, when the workpiece is applied to the adhesive tape, the layer of adhesive becomes more easily deformed by heating. In other words, the adhesive of the adhesive tape deforms more precisely in accordance with the shape of the workpiece, so the adhesion of the adhesive tape to the workpiece can be improved.

The tape heating mechanism also heats the adhesive tape from the non-adhesive side inside the chamber. In other words, the tape heating mechanism heats the adhesive tape without passing through the workpiece, which prevents a decrease in the heating efficiency of the adhesive tape due to the thickness or constituent material of the workpiece. As a result, the heating efficiency of the adhesive tape can be improved compared to the conventional configuration in which the adhesive tape is indirectly heated through the workpiece, thereby further improving the adhesion between the workpiece and the adhesive tape. Therefore, the adhesive tape can be attached to the workpiece with greater precision.

1A and 1B are diagrams illustrating a configuration of an attachment member according to a first embodiment of the present invention, in which (a) is a perspective view of the attachment member, and (b) is a vertical cross-sectional view of the attachment member; 1A and 1B are cross-sectional views showing a configuration of a workpiece according to Example 1. FIG. 1 is a plan view showing a configuration of an adhesive tape joining device according to a first embodiment; 1 is a front view showing a configuration of an adhesive tape joining device according to a first embodiment; FIG. 2 is a front view showing a configuration of the joining unit according to the first embodiment. FIG. 2 is a vertical cross-sectional view showing the configuration of a chamber according to the first embodiment. 4 is a flowchart showing the operation of the adhesive tape joining device according to the first embodiment. FIG. 4 is a diagram for explaining step S1 according to the first embodiment. FIG. 11 is a diagram for explaining step S2 according to the first embodiment. FIG. 11 is a diagram for explaining step S3 according to the first embodiment. FIG. 11 is a diagram for explaining step S3 according to the first embodiment. FIG. 11 is a diagram for explaining step S4 according to the first embodiment. FIG. 11 is a diagram for explaining step S5 according to the first embodiment. FIG. 11 is a diagram for explaining step S6 according to the first embodiment. FIG. 11 is a diagram for explaining step S7 according to the first embodiment. FIG. 11 is a diagram for explaining step S7 according to the first embodiment. FIG. 11 is a diagram for explaining step S7 according to the first embodiment. 10A is a cross-sectional view showing a configuration of a workpiece according to Example 2, (a) is a perspective view of the front side of the workpiece, (b) is a perspective view of the back side of the workpiece, and (c) is a vertical cross-sectional view of the workpiece. FIG. 11 is a front view showing a configuration of a joining unit according to a second embodiment. FIG. 11 is a diagram illustrating step S2 according to the second embodiment. FIG. 11 is a diagram for explaining step S6 according to the second embodiment. 1A is a diagram illustrating a state in which unevenness occurring at an irregularity location contacts a workpiece holding surface, and FIG. 1A is a diagram illustrating a state in which impurities such as dust get between a workpiece and a holding table, and FIG. 1B is a diagram illustrating a state in which the workpiece is held in an inclined state due to impurities such as dust. 11A and 11B are diagrams illustrating the effects of the configuration according to the second embodiment. 13A and 13B are diagrams illustrating the configuration of a holding table and a workpiece according to a third embodiment. FIG. 10 is a diagram showing a state before the deformable member is deformed in step S6 according to the second embodiment. In step S6 in the second embodiment, the deformable member is deformed according to the shape of the projections and recesses. 1A and 1B are diagrams illustrating a configuration of a workpiece according to a first modified example, in which (a) is a perspective view of the workpiece, and (b) is a vertical sectional view of the workpiece; FIG. 11 is a diagram illustrating step S4 according to a first modified example. FIG. 11 is a diagram illustrating step S5 according to the first modified example. FIG. 11 is a perspective view illustrating a configuration of an attachment member according to a second modified example. FIG. 11 is a front view showing a configuration of a joining unit according to a second modified example. FIG. 11 is a diagram illustrating step S4 according to a second modified example. FIG. 11 is a diagram illustrating step S4 according to a second modified example. FIG. 11 is a diagram illustrating step S5 according to a second modified example. FIG. 11 is a diagram illustrating step S6 according to a second modified example. FIG. 13 is a vertical cross-sectional view illustrating the configuration of a composite precursor according to a third modified example. 13A to 13C are diagrams illustrating a temporary attachment step for producing a composite precursor according to a third modified example. 13A to 13C are diagrams illustrating a temporary attachment step for producing a composite precursor according to a third modified example. FIG. 13 is a diagram illustrating step S2 according to the third modified example. 13A is a vertical cross-sectional view illustrating a state before a pressing force is applied, and FIG. FIG. 13 is a diagram illustrating step S4 according to the fourth modified example. FIG. 13 is a diagram illustrating step S5 according to the fourth modified example. FIG. 13 is a front view showing a configuration of a joining unit according to a fifth modified example. FIG. 13 is a vertical cross-sectional view illustrating the configuration of a workpiece according to a fifth modified example. FIG. 13 is a vertical cross-sectional view illustrating a configuration of a holding table according to a fifth modified example. FIG. 13 is a diagram illustrating step S6 according to the fifth modified example. FIG. 13 is a diagram illustrating step S6 according to the fifth modified example. FIG. 13 is a vertical cross-sectional view showing a configuration of a chamber according to a sixth modified example.

A first embodiment of the present invention will be described below with reference to the drawings. An adhesive tape application device 1 according to the first embodiment will be described by exemplifying a configuration in which an adhesive tape PT provided with an application member P is applied to a workpiece W. FIG. 1 is a diagram showing the configuration of the application member P, and FIG. 2 is a diagram showing the configuration of the workpiece W.

As shown in FIG. 1(a), the joining member P according to the first embodiment includes a ring frame f, an adhesive tape PT, and a conveying sheet T. The ring frame f is made of a rigid material, for example, metal or resin. The ring frame f has a size and shape that surrounds the adhesive tape PT, and supports the adhesive tape PT via the conveying sheet T.

The adhesive tape PT is pre-cut into a predetermined shape according to the shape of the workpiece W. In this embodiment, the adhesive tape PT is pre-cut into a rectangular shape. Here, a rectangular shape includes a rectangular shape with rounded corners as shown in FIG. 1(a) as well as a rectangular shape with sharp corners. In this embodiment, the size of the adhesive tape PT is set to be approximately the same as the workpiece W, and smaller than the inner diameter of the lower housing 29A described below.

The conveying sheet T is a sheet-like member that holds the adhesive tape PT, and is pre-cut into a predetermined shape that corresponds to the shape of the ring frame f. The size of the conveying sheet T is approximately the same as the size of the ring frame f, and the conveying sheet T is attached and held by the upper surface of the ring frame f. The adhesive tape PT is attached and held by the conveying sheet T at the center of the back surface of the conveying sheet T. That is, in the attachment member P, the adhesive tape PT and the ring frame f are integrated via the conveying sheet T.

As shown in FIG. 1(b), the conveying sheet T has a structure in which a non-adhesive base material Ta and an adhesive material Tb having adhesiveness are laminated. Examples of materials constituting the base material Ta include polyolefin and polyethylene. Examples of materials constituting the adhesive material Tb include acrylic ester copolymers. Note that an adhesive material or a sticky adhesive material may be used instead of the adhesive material Tb. In other words, the adhesive tape PT includes adhesive tape, sticky adhesive tape, and adhesive tape.

As shown in FIG. 1(b), the adhesive tape PT has a structure in which a non-adhesive base material Pa and an adhesive material Pb having adhesiveness are laminated. The base material Pa is attached to the adhesive material Tb of the conveying sheet T, so that the conveying sheet T holds the adhesive tape PT. Examples of materials constituting the base material Pa include polyolefin and polyethylene. Examples of materials constituting the adhesive material Sb include acrylic ester copolymers. In this embodiment, the shape of the adhesive tape PT is approximately rectangular, but this can be changed as appropriate depending on the shape of the workpiece W, etc. In other words, the adhesive tape PT may be changed as appropriate to any shape, such as a rectangle, a circle, a polygon, etc., for example. The shapes of the workpiece W and the adhesive tape PT may also be different.

As shown in Figures 2(a) and 2(b), the workpiece W has a flat base B and devices Da. The devices Da are mounted in parallel in a two-dimensional matrix in the center of the surface of the base B of the workpiece W. In other words, the devices Da create an uneven surface on the surface of the workpiece W.

Examples of device Da include LEDs, IC chips, and microlenses. Each of device Da is connected to base B via a semiconductor element, such as a TFT, or a bump (not shown). In this embodiment, a substantially rectangular glass substrate is used as work W. The shape of work W may be changed as appropriate to any shape, such as a rectangle, a circle, or a polygon. Examples of work W include an organic substrate, a circuit board, and a silicon wafer, in addition to a glass substrate.

In this embodiment, the adhesive tape PT is applied to the front side of the workpiece W while the back side of the workpiece W is held by the holding table 13. Therefore, in this embodiment, the front side of the workpiece W corresponds to the tape application surface Wa, and the back side of the workpiece W corresponds to the held surface Wb.

<Explanation of overall configuration>
Here, the overall configuration of the adhesive tape application device 1 according to the first embodiment will be described. Fig. 3 is a plan view showing the basic configuration of the adhesive tape application device 1 according to the first embodiment. The adhesive tape application device 1 according to the first embodiment applies the adhesive tape PT provided on the application member P to the front side of the workpiece W, thereby creating a workpiece complex WF in which the workpiece W and the ring frame f are integrated by the adhesive tape PT. In the following description, the longitudinal direction of the adhesive tape application device 1, which is rectangular in plan view, is referred to as the left-right direction (x-direction), and the horizontal direction (y-direction) perpendicular to the longitudinal direction is referred to as the front-rear direction.

A work transport mechanism 3 is provided on the right side of the adhesive tape application device 1. Two containers 5 containing workpieces W are placed in parallel on the lower right side of the adhesive tape application device 1. A complex recovery section 6 is provided on the left end of the adhesive tape application device 1, which recovers the workpiece complex WF formed by applying the adhesive tape PT to the workpiece W.

From the right at the rear side (upper side in FIG. 3) of the adhesive tape application device 1, an aligner 7, an application unit 9, and a frame supply unit 11 are arranged in that order. In the application unit 9, the adhesive tape PT is applied to the workpiece W.

As shown in Figures 3 and 4, the work transport mechanism 3 is equipped with a work transport device 16 supported on the right side of a guide rail 15 that is horizontally installed on the left and right sides at the rear of the adhesive tape application device 1 so that it can move back and forth between the left and right sides, and a frame transport device 17 supported on the left side of the guide rail 15 so that it can move between the left and right sides.

The workpiece transport device 16 is configured to transport the workpiece W taken out of either one of the containers 5 left and right and front and rear, and to be able to turn the position of the workpiece W upside down. The workpiece transport device 16 is equipped with a left and right movable table 18 and a front and rear movable table 19.

The left-right movable platform 18 is configured to be able to move back and forth in the left-right direction along the guide rail 15. The front-rear movable platform 19 is configured to be able to move back and forth in the front-rear direction along the guide rail 20 provided on the left-right movable platform 18.

Furthermore, a holding unit 21 that holds the workpiece W is installed at the bottom of the forward/rearward movable platform 19. The holding unit 21 is configured to be able to move back and forth in the up and down direction (z direction) along a lift rail 22 that extends vertically. The holding unit 21 can also rotate around an axis in the z direction by a rotation shaft (not shown).

A horseshoe-shaped holding arm 23 is mounted on the lower part of the holding unit 21. The holding surface of the holding arm 23 is provided with a number of slightly protruding suction pads, which are used to suction and hold the workpiece W. The holding arm 23 is also connected to a compressed air device via a flow path formed therein and a connecting flow path connected to the base end of the flow path.

By utilizing the movable structure described above, the wafer W held by suction can be moved back and forth, left and right, and rotated around the z-axis by the holding arm 23.

The frame transport device 17 includes a left-right movable platform 24, a front-back movable platform 25, a bending and extending link mechanism 26 connected to the bottom of the left-right movable platform 24, and a suction plate 27 attached to the bottom end of the bending and extending link mechanism 26. The suction plate 27 suctions and holds the adhesive tape PT or the workpiece W via the transport sheet T. Around the suction plate 27, a number of suction pads 28 are provided that suction and hold the ring frame f. Thus, the frame transport device 17 can suction and hold the joining member P or the workpiece complex WF equipped with the ring frame f, and transport it up and down and back and forth and left and right. The suction pad 28 can be adjusted to slide horizontally according to the size of the ring frame f.

As shown in FIG. 5, the joining unit 9 includes a holding table 13 and a chamber 29. The holding table 13 is housed in a lower housing 29A that constitutes the chamber 29, and is connected in communication with a vacuum device 31 that is provided externally. The operation of the vacuum device 31 is controlled by a control unit 33. In addition to controlling the vacuum device 31, the control unit 33 also controls the overall operation of each component in the adhesive tape joining device 1.

The holding table 13 is connected to one end of a rod 35 that passes through the lower housing 29A. The other end of the rod 35 is connected to an actuator 37 that includes a motor or the like. This allows the holding table 13 to move up and down inside the chamber 29.

The holding table 13 is equipped with a workpiece support portion 39. The workpiece support portion 39 has rigidity and supports the workpiece W. The workpiece support portion 39 has a flat upper surface, and the workpiece W is placed on the flat upper surface. That is, in the first embodiment, the upper surface of the workpiece support portion 39 of the holding table 13 corresponds to the workpiece holding surface 40. In other words, the holding table 13 holds the workpiece W by abutting against it at the workpiece holding surface 40. As an example, the workpiece support portion 39 is a metal chuck table having the same shape and size as the wafer W.

The chamber 29 is composed of a lower housing 29A and an upper housing 29B. The lower housing 29A is arranged so as to surround the holding table 13. The upper housing 29B is disposed above the lower housing 29A and is configured to be movable up and down by a lifting drive mechanism (not shown).

The lower housing 29A is provided with a frame holding portion 38 that surrounds the lower housing 29A. The frame holding portion 38 is configured so that when the ring frame f is placed on it, the upper surface of the ring frame f is flush with the cylindrical top portion of the lower housing 29A. In addition, it is preferable that the cylindrical top portion 42 of the lower housing 29A is subjected to a release treatment.

As shown in FIG. 6, the lower housing 29A is connected to a flow path 121 for reducing pressure, and the upper housing 29B is connected to a flow path 122 for reducing pressure. Both flow paths 121 and 122 are connected to the vacuum device 31 via the flow path 101 for reducing pressure. That is, the lower housing 29A is connected to the vacuum device 31 for reducing pressure via the flow paths 101 and 121. And the upper housing 29B is connected to the vacuum device 31 for reducing pressure via the flow paths 101 and 122.

In addition, flow path 101 is equipped with electromagnetic valve 103, and flow path 122 is equipped with electromagnetic valve 113. In addition, flow path 109 equipped with electromagnetic valves 105 and 107 for venting to the atmosphere is connected to both housings 29A and 29B.

Furthermore, the upper housing 29B is connected to a flow path 111 equipped with an electromagnetic valve 110 that adjusts the internal pressure, once reduced, by leakage. The electromagnetic valve 110 is provided with an aperture adjustment valve 112. The aperture adjustment valve 112 adjusts the amount of gas leaked through the flow path 111 by appropriately adjusting the aperture of the electromagnetic valve 110.

The opening and closing of the solenoid valves 103, 105, 107, 110, and 113, the operation of the vacuum device 31, and the adjustment of the aperture adjustment valve 112 are performed by the control unit 33. In other words, the vacuum device 31 is configured to be able to independently reduce and adjust the air pressure in the space on the lower housing 29A side and the space on the upper housing 29B side.

The joining unit 9 further has a heating mechanism 73 that heats the adhesive tape PT. As an example, the heating mechanism 73 is disposed inside the upper housing 29B, as shown in Figures 5 and 6. The heating mechanism 73 includes a cylinder 75, a heating member 77, and a heater 79. The cylinder 75 is connected to the upper part of the heating member 77, and the heating member 77 can be raised and lowered inside the chamber 29 by the operation of the cylinder 75.

The heating member 77 is a rigid plate-like member, and is disposed opposite the holding table 13. The underside of the heating member 77 is flat. When the conveying sheet T of the joining member P is sandwiched between the lower housing 29A and the upper housing 29B, the positioning is adjusted so that the underside of the heating member 77 faces the conveying sheet T and the adhesive tape PT. The heating member 77 is configured so that the underside of the heating member 77 comes into contact with the base material Ta of the conveying sheet T by descending. In FIG. 5, the heating member 77 has moved to the initial position. The initial position is a position corresponding to the vicinity of the ceiling of the upper housing 29B.

The heater 79 is disposed inside the heating member 77. When the heater 79 is activated while the heating member 77 is in contact with the base material Ta of the conveying sheet T, the adhesive tape PT held by the conveying sheet T is heated by the heater 79 from the base material Pa side (the non-adhesive side). The heating temperature by the heater 79 is adjusted so that the adhesive material Pb of the adhesive tape PT becomes soft. The heating temperature by the heater 79 is, for example, 30°C to 180°C.

As shown in FIG. 4, the composite recovery section 6 is equipped with a cassette 43 that loads and recovers the workpiece composite WF. This cassette 43 is equipped with a vertical rail 45 that is connected and fixed to the device frame 44, and a lifting platform 49 that is raised and lowered by a motor 47 along the vertical rail 45 using a screw feed. Therefore, the composite recovery section 6 is configured to place the workpiece composite WF on the lifting platform 49 and lower it at a pitch feed. The frame supply section 11 supplies the joining material P having a ring frame f, and as an example, stores a drawer-type cassette that stores a predetermined number of joining materials P in a stack.

<Basic operation overview>
Here, a description will be given of a basic operation of the adhesive tape applying apparatus 1 according to the embodiment 1. Fig. 7 is a flow chart illustrating a series of steps for applying the adhesive tape PT to the workpiece W using the adhesive tape applying apparatus 1.

Step S1 (supply of workpiece)
When a joining command is issued, the workpiece W is transported from the container 5 to the holding table 13. That is, the workpiece transport device 16 inserts the holding arm 23 between the workpieces W stored in multiple stages inside the container 5. The holding arm 23 suction-holds and carries out the workpiece W, and transports it to the aligner 7. The aligner 7 aligns the workpiece W based on the notch or the like while holding and rotating it. When the alignment is completed, the holding arm 23 holds the workpiece W again, carries it out of the aligner 7, and carries it into the joining unit 9. That is, as shown in FIG. 8, the holding unit 21 moves above the holding table 13 while holding the workpiece W.

Step S2 (holding the workpiece)
When the workpiece W is carried into the joining unit 9 by the holding unit 21, the process of holding the workpiece W on the holding table 13 is started. First, the control unit 33 raises the holding table 13 and moves the workpiece holding surface 40 to a position higher than the cylindrical top portion 42 of the lower housing 29A. Then, the holding arm 23 of the holding unit 21 is lowered.

As the holding arm 23 descends, the held surface Wb (the back surface of the base portion B) of the workpiece W comes into contact with the workpiece holding surface 40, and the workpiece W is supported by the workpiece support portion 39 of the holding table 13. When the workpiece W is placed on the workpiece holding surface 40 of the holding table 13, the holding arm 23 releases the suction hold of the workpiece W and rises as shown in FIG. 9. By holding the workpiece W on the holding table 13, the process of step S2 is completed.

Step S3 (supply of adhesive tape)
When the workpiece W is held by the holding table 13, the operation of supplying the joining material P provided with the adhesive tape PT to the joining unit 9 is started. That is, the frame transport device 17 sucks the joining material P from the frame supply section 11 and transports it to the joining unit 9, and moves above the lower housing 29A as shown in Fig. 10. The frame transport device 17 then descends and transfers the ring frame f of the joining material P to the frame holding section 38 as shown in Fig. 11.

When the frame conveying device 17 releases the suction of the ring frame f and rises, it aligns the joining material P. As an example of this alignment, it is performed by synchronously moving a number of support pins erected to surround the frame holding part 38 toward the center. By placing the ring frame f on the frame holding part 38, the conveying sheet T is held horizontally while abutting against the cylindrical top part 42 of the lower housing 29A. The adhesive tape PT held on the conveying sheet T is also held horizontally. Therefore, the parallelism of the adhesive tape PT and the workpiece W is maintained with high precision. By placing the ring frame f of the joining material P on the frame holding part 38, the process of supplying the joining material P to the joining unit 9 in step S3 is completed.

Step S4 (Formation of chamber)
When the joining material P is supplied to the joining unit 9, the chamber 29 is formed. That is, the control unit 33 lowers the holding table 13 and operates an elevation drive mechanism (not shown) to lower the upper housing 29B. As the upper housing 29B lowers, the portion of the conveying sheet T that abuts against the cylindrical top portion 42 of the lower housing 29A is sandwiched between the upper housing 29B and the lower housing 29A, as shown in FIG. 12, to form the chamber 29.

At this time, the conveying sheet T functions as a sealant, and the chamber 29 is divided into two spaces by the conveying sheet T. That is, the chamber 29 is divided into a lower space H1 on the lower housing 29A side and an upper space H2 on the upper housing 29B side, with the conveying sheet T in between. The workpiece W located in the lower housing 29A faces the adhesive tape PT held by the conveying sheet T closely, with a predetermined clearance between them.

Step S5 (Tape heating)
After the chamber 29 is formed, the process of heating the adhesive tape PT is started using the heating mechanism 73. That is, the control unit 33 operates the heater 79 while controlling the cylinder 75 to lower the heating member 77 from the initial position to the heating position as shown in Fig. 13. By moving the heating member 77 to the heating position, the lower surface of the heating member 77 comes into contact with the conveying sheet T. When the heating member 77 comes into contact with the conveying sheet T, the heater 79 embedded in the heating member 77 heats the adhesive tape PT held by the conveying sheet T from the non-adhesive side.

When the heater 79 heats the adhesive tape PT to a predetermined temperature, the adhesive Pb softens. That is, the softening of the adhesive Pb improves the embeddability of the adhesive Pb into the layer. When the adhesive tape PT has been heated for a predetermined time and the embeddability of the adhesive Pb has improved, the control unit 33 raises the heating member 77 from the heating position to the initial position. By heating the adhesive tape PT to improve the embeddability of the adhesive Pb, the process of step S5 is completed.

Step S6 (pasting process)
After the adhesive tape PT is heated to a predetermined temperature, the process of attaching the adhesive tape PT to the workpiece W is started. The control unit 33 slightly raises the holding table 13 to bring the workpiece W closer to the adhesive tape PT, and adjusts the air pressure in the chamber 29 to generate a pressure difference.

When adjusting the air pressure inside the chamber 29 to generate a pressure difference, the control unit 33 first closes the electromagnetic valves 105, 107, and 110 shown in FIG. 6, and opens the electromagnetic valves 103 and 113. The control unit 33 then operates the vacuum device 31 to reduce the air pressure inside the lower space H1 and the upper space H2 to a predetermined value. An example of the predetermined value is 10 Pa to 100 Pa.

When the air pressure in the lower space H1 and the upper space H2 is reduced to a predetermined value, the control unit 33 closes the electromagnetic valve 103 and stops the operation of the vacuum device 31. The control unit 33 then controls the electromagnetic valves 103, 105, 107, and 113 connected to the lower space H1 to remain closed, and adjusts the opening of the electromagnetic valve 110 connected to the upper space H2 to allow leakage, so that the air pressure in the upper space H2 is higher than the air pressure in the lower space H1. The control unit 33 appropriately controls the opening adjustment valve 112 to adjust the opening of the electromagnetic valve 110. This adjustment causes the air pressure in the upper space H2 to rise according to the opening of the electromagnetic valve 110.

When the air pressure in the upper space H2 becomes higher than the air pressure in the lower space H1, a pressure difference Gs occurs between the two spaces, as shown in FIG. 14. An example of the magnitude of the pressure difference is 5000 Pa or more and less than 0.1 MPa.

When the pressure difference Gs occurs, the conveying sheet T in the joining member P is pulled toward the lower housing 29A. The workpiece W and the adhesive tape PT then approach each other while remaining parallel, and the pressure difference Gs presses the adhesive tape PT against the workpiece W. The device Da protruding from the surface of the workpiece W is then embedded in the layer of adhesive material Pb of the adhesive tape PT by the pressure difference Gs.

In Example 1, the adhesive tape PT is heated to soften the adhesive material Pb, and then the adhesive tape PT is attached to the workpiece W. That is, when the tape application surface Wa of the workpiece W is pressed against the adhesive tape PT, the embeddability of the adhesive material Pb into the layer is improved by heating. Therefore, the device Da protruding from the surface of the workpiece W is embedded deeper into the layer of adhesive material Pb of the adhesive tape PT. That is, by softening the adhesive material Pb by heating, the adhesion between the adhesive tape PT and the workpiece W can be improved even if the tape application surface Wa has unevenness.

In this manner, while the adhesive tape PT is heated, the differential pressure Gs is applied for a certain period of time, so that the adhesive tape PT is attached to the tape application surface Wa of the workpiece W. By attaching the adhesive tape PT to the workpiece W, a workpiece complex WF is formed in which the attachment member P and the workpiece W are integrated, and the attachment process in step S6 is completed.

Step S7 (recovery of workpiece complex)
When the adhesive tape PT is attached to the workpiece W to form the workpiece complex WF, a process of recovering the workpiece complex WF is started. First, as shown in Fig. 15, the control unit 33 raises the holding table 13. At this time, the raised position of the holding table 13 is adjusted so that the conveying sheet T of the joining member P is in a horizontal state.

The control unit 33 raises the holding table 13 and fully opens the electromagnetic valves 103, 105, 107, 110, and 113 to open the upper space H2 and the lower space H1 to the atmosphere. When the upper space H2 and the lower space H1 are open to the atmosphere, the control unit 33 raises the upper housing 29B as shown in FIG. 16 to open the chamber 29.

After the chamber 29 is opened, as shown in FIG. 17, the suction pads 28 provided on the frame transport device 17 suction-hold the work complex WF and detach the work complex WF from the lower housing 29A. The frame transport device 17 that has suction-held the work complex WF transports it to the complex recovery section 6. The transported work complex WF is loaded and stored in the cassette 43. This completes one cycle of the operation of attaching the adhesive tape PT to the work W. Thereafter, the above process is repeated until the predetermined number of work complexes WF is reached.

<Effects of the Configuration of the First Embodiment>
According to the device of the first embodiment, it is possible to precisely attach the adhesive tape PT to the workpiece W. Here, the effects of the configuration of the first embodiment will be described in comparison with a conventional configuration.

In conventional joining devices, when joining an adhesive tape to a workpiece, the adhesive material of the adhesive tape is typically heated by embedding a heater in the holding table that holds the workpiece, and the adhesive tape is heated along with the workpiece. In other words, conventional joining devices indirectly heat the adhesive surface of the adhesive tape via the workpiece.

In such conventional joining devices, it is necessary to bring the holding table close to the adhesive tape before heating the adhesive tape. In other words, the adhesive material of the adhesive tape cannot be heated efficiently unless the workpiece placed on the holding table and the adhesive tape are in contact with each other or in close proximity. Also, in conventional configurations, the workpiece in contact with the holding table is heated first, and then the adhesive tape is heated. Therefore, the efficiency of heating the adhesive tape decreases, especially when the workpiece is thick.

Furthermore, in recent years, materials with low thermal conductivity, such as glass or resin, are often used as the constituent material of the workpiece. Therefore, when applying adhesive tape to such a workpiece, the heating efficiency of the adhesive tape further decreases with the conventional configuration. If the heating efficiency of the adhesive material of the adhesive tape decreases, the adhesive tape will be applied to the workpiece in a state where the adhesive material is not sufficiently softened, and the adhesion between the adhesive tape and the workpiece will decrease. In particular, if the tape application surface of the adhesive tape is uneven, the unevenness of the tape application surface will not be accurately embedded in the adhesive material of the adhesive tape, and the adhesion between the adhesive tape and the workpiece will further decrease.

In contrast to such a conventional configuration, the adhesive tape application device 1 according to the first embodiment is equipped with a heater 79 that heats the adhesive tape PT. When the adhesive tape PT is heated to a predetermined temperature by the heater 79, the adhesive material Pb softens and the embeddability of the adhesive material Pb in the layer is improved. This improves the adhesion between the workpiece W and the adhesive tape PT. In particular, if the tape application surface Wa of the workpiece W is uneven, the uneven parts of the workpiece W are embedded with precision into the softened adhesive material Pb, so that a decrease in the accuracy of application of the adhesive tape PT to the workpiece W can be avoided.

The heater 79 according to the first embodiment heats the adhesive tape PT from the non-adhesive side of the adhesive tape PT. In other words, the heater 79 heats the adhesive tape PT without passing through the workpiece W, which prevents a decrease in the heating efficiency of the adhesive tape PT due to the thickness or constituent material of the workpiece W. As a result, the heating efficiency and embeddability of the adhesive tape PT can be improved compared to the conventional technology, and the adhesion between the workpiece W and the adhesive tape PT can be further improved.

In addition, in Example 1, a heating member 77 equipped with a heater 79 is moved toward the adhesive tape PT, and the heating member 77 heats the adhesive tape PT from the non-adhesive side of the adhesive tape PT. In this case, the adhesive tape PT is heated in a state in which the heater 79 is moved from an initial position relatively far from the adhesive tape PT to a heating position in contact with or close to the adhesive tape PT, thereby further improving the heating efficiency of the adhesive tape PT. In addition, the heater 79 is moved toward the adhesive tape PT using a cylinder 75 or the like, so the heater 79 can be brought into contact with or close to the adhesive tape PT only when heating is required.

Next, a second embodiment of the present invention will be described. While the configuration of the adhesive tape application device 1 is basically the same in the first and second embodiments, the configuration of the holding table 13 is different. Furthermore, in the second embodiment, the configuration of the workpiece W to which the adhesive tape PT is applied is different. Therefore, the same components as those in the adhesive tape application device 1 of the first embodiment are given the same reference numerals, and the different components will be described in detail. In other words, instead of the holding table 13 provided in the adhesive tape application device 1 of the first embodiment, the adhesive tape application device 1 of the second embodiment is provided with a holding table 13A.

First, the configuration of the workpiece W according to Example 2 will be described. The workpiece W according to Example 2 includes a flat base B, and devices Da and Db. As shown in FIG. 18(a), device Da is mounted on the front surface of the workpiece W, similar to Example 1. As shown in FIG. 18(b), device Db is mounted on the back surface of the base B of the workpiece W. That is, while the back surface of the workpiece W according to Example 1 is flat, the back surface of the workpiece W according to Example 2 is uneven due to device Db.

Similar to device Da, device Db includes, for example, an LED, an IC chip, and a microlens. Each of device Db is connected to base portion B via a semiconductor element such as a TFT, a bump, or the like. The portion of the back surface of workpiece W that is uneven and non-flat due to device Db is called uneven region Bc.

In this embodiment 2, the adhesive tape PT is applied to the front side of the workpiece W while the back side of the workpiece W is held by the holding table 13A. That is, in this embodiment 2, as in the embodiment 1, the front side of the workpiece W corresponds to the tape application surface Wa, and the back side of the workpiece W corresponds to the held surface Wb. Also, as shown in FIG. 18(c), the height at which the device Db protrudes from the held surface Wb of the workpiece W is defined as F1. Examples of the height F1 include 1 mm to 10 mm for a connector, and 1 μm to 500 μm for an electronic device.

The holding table 13A according to the second embodiment includes a workpiece support portion 39A. The workpiece support portion 39A has rigidity and supports the workpiece W. The workpiece support portion 39A differs from the workpiece support portion 39 according to the first embodiment in that it includes a recess 41. The recess 41 is formed in a part of the workpiece support portion 39A. The portion of the workpiece support portion 39A where the recess 41 is not formed has a flat upper surface, and the workpiece W is placed on the flat upper surface. That is, in the first embodiment, the upper surface of the workpiece support portion 39A of the holding table 13 corresponds to the workpiece holding surface 40. In other words, the holding table 13 holds the workpiece W by contacting the workpiece W on the workpiece holding surface 40. As an example, the workpiece support portion 39A is a metal chuck table having a shape and size equal to or larger than the wafer W.

The area in which the recesses 41 are formed in the holding table 13A is determined so as to include the uneven area Bc in which the devices Db are arranged in a plan view on the held surface Wb of the workpiece W. The depth F2 of the recesses 41 is determined so as to be greater than the height F1 at which the devices Db protrude from the held surface Wb of the workpiece W. That is, in Example 2, when the holding table 13A holds the workpiece W, as shown in FIG. 9 and other figures, each of the devices Db arranged on the held surface Wb fits into the recesses 41 formed in the holding table 13A. The flat held surface Wb of the base portion B is then abutted against the flat workpiece holding surface 40.

<Description of Operation According to the Second Embodiment>
Here, the operation of the adhesive tape application apparatus 1 according to Example 2 will be described. The process of applying the adhesive tape PT to the workpiece W using the adhesive tape application apparatus 1 according to Example 2 is basically the same as that of Example 1, and is performed according to the flow chart shown in Fig. 7. However, the state in which the holding table 13A holds the workpiece W in step S2 is different. Here, the explanation of the commonalities between the process according to Example 1 and the process according to Example 2 will be simplified, and the differences will be described in detail.

Step S1 (supply of workpiece)
When an attachment command is issued, the workpieces W are transported from the container 5 to the holding table 13, as in the first embodiment. That is, the holding units 21 of the workpiece transport device 16 suction-hold and carry out the workpieces W stored in multiple layers inside the container 5, and move them above the holding table 13 via the aligner 7.

Step S2 (holding the workpiece)
In step S2 according to the second embodiment, when the workpiece W is carried into the joining unit 9 by the holding unit 21, a process of holding the workpiece W on the holding table 13A is started. First, the control unit 33 raises the holding table 13A and moves the workpiece holding surface 40 to a position higher than the cylindrical top portion 42 of the lower housing 29A. Then, the holding unit 21 aligns the position of the workpiece W in the horizontal direction so that the uneven area Bc formed on the workpiece W faces the recessed portion 41 formed on the holding table 13A, and lowers the holding arm 23.

When the holding arm 23 is lowered, the device Db protruding downward from the base portion B of the workpiece W is fitted into the recess 41. Then, when the base portion B (particularly the outer periphery) of the workpiece W abuts against the workpiece holding surface 40, the workpiece W is supported by the workpiece support portion 39A of the holding table 13A. Because the device Db is fitted into the recess 41, the workpiece holding surface 40 can be prevented from supporting the device Db. In other words, it is possible to prevent the workpiece W from becoming tilted due to the device Db being supported by the workpiece holding surface 40.

Here, the workpiece holding surface 40 of the holding table 13A, i.e., the portion where the recess 41 is not formed, is flat and extends horizontally. The base portion B of the workpiece W is also flat. Therefore, by holding the workpiece W on the holding table 13A via the base portion B and the workpiece holding surface 40, the tape application surface Wa of the workpiece W becomes horizontal with high precision. When the workpiece W is placed on the workpiece holding surface 40 of the holding table 13A, the holding arm 23 releases the suction holding of the workpiece W and rises as shown in FIG. 20. By holding the workpiece W on the holding table 13A, the process of step S2 is completed.

Step S3 (supply of adhesive tape)
When the workpiece W is held by the holding table 13, the joining material P is supplied to the joining unit 9 in the same manner as in the first embodiment. That is, the frame transport device 17 adsorbs the joining material P from the frame supply section 11 and transports it to the joining unit 9, and transfers the ring frame f of the joining material P to the frame holding section 38. When the frame transport device 17 releases the adsorption of the ring frame f and rises, it aligns the joining material P. When the ring frame f is placed on the frame holding section 38, the process of supplying the joining material P to the joining unit 9 is completed.

Step S4 (Formation of chamber)
When the joining material P is supplied to the joining unit 9, the chamber 29 is formed in the same manner as in the first embodiment. That is, the control unit 33 lowers the holding table 13 and the upper housing 29B. As the upper housing 29B lowers, the conveying sheet T is sandwiched between the upper housing 29B and the lower housing 29A, and the chamber 29 is formed.

Step S5 (Tape heating)
After the chamber 29 is formed, the process of heating the adhesive tape PT using the heating mechanism 73 is started in the same manner as in Example 1. That is, the control unit 33 operates the heater 79 while lowering the heating member 77 from the initial position to the heating position. By moving the heating member 77 to the heating position, the lower surface of the heating member 77 is brought into contact with the conveying sheet T. The heater 79 then heats the adhesive tape PT from the non-adhesive side. When the adhesive tape PT is heated to a predetermined temperature by the heater 79, the adhesive material Pb softens and the adhesive material Pb is more easily embedded in the layer.

Step S6 (pasting process)
After the adhesive tape PT is heated to a predetermined temperature, the process starts for bonding the adhesive tape PT to the workpiece W. As in the first embodiment, the control unit 33 slightly raises the holding table 13 as shown in Fig. 21 to bring the workpiece W closer to the adhesive tape PT, and adjusts the air pressure in the chamber 29 to generate a differential pressure Gs.

When the pressure difference Gs occurs, the conveying sheet T in the joining member P is pulled toward the lower housing 29A. At this time, the adhesive tape PT held by the conveying sheet T approaches the tape joining surface Wa of the workpiece W while remaining horizontal.

In Example 2, the uneven portion of the held surface Wb of the workpiece W, i.e., the device Db, fits into the recess 41, and the flat base portion B abuts against the workpiece holding surface 40. That is, the workpiece W is held in a horizontal state with high precision by the holding table 13A that has the recess 41.

As a result, the workpiece W and the adhesive tape PT approach each other while maintaining a highly accurate parallel state, and the adhesive tape PT is pressed against the workpiece W by the differential pressure Gs. The device Da protruding from the surface of the workpiece W is then embedded in the layer of adhesive material Pb of the adhesive tape PT by the differential pressure Gs. By applying the differential pressure Gs for a certain period of time in this manner, the adhesive tape PT is attached to the tape attachment surface Wa of the workpiece W, as shown in FIG. 21. By attaching the adhesive tape PT to the workpiece W, a workpiece complex WF is formed in which the attachment member P and the workpiece W are integrated, and the attachment process in step S6 is completed.

Step S7 (recovery of workpiece complex)
When the adhesive tape PT is affixed to the workpiece W to form the workpiece complex WF, a process of recovering the workpiece complex WF is started in the same manner as in Example 1. That is, the control unit 33 raises the holding table 13 and opens the upper space H2 and the lower space H1 to the atmosphere. When the upper space H2 and the lower space H1 are opened to the atmosphere, the control unit 33 raises the upper housing 29B to open the chamber 29. After the chamber 29 is opened, the frame transport device 17 is used to suction and hold the workpiece complex WF, and the workpiece complex WF is transported to the complex recovery unit 6. The transported workpiece complex WF is loaded and stored in a cassette 43.

<Effects of the configuration of the second embodiment>
According to the adhesive tape application device of Example 2, as in Example 1, the adhesive tape PT can be efficiently heated by the heating mechanism 73, so that the adhesion between the tape application surface Wa and the adhesive tape PT can be further improved. Furthermore, in the device of Example 2, the accuracy of application of the adhesive tape PT can be further improved by providing a configuration that prevents the workpiece W from being held on the holding table 13A in an inclined state. That is, by holding the workpiece W using the holding table 13A that has the recess 41, the adhesive tape PT can be accurately applied to the workpiece W. Here, the effect of the configuration of Example 2 will be described in comparison with the conventional configuration.

In conventional joining devices, the holding table HT has a rigid, generally flat work holding portion Va. The flat work holding portion Va abuts against the back surface of the work W to hold the work W. In such a conventional configuration, it is easy for the tilt of the work W to cause a decrease in the joining accuracy of the adhesive tape PT.

In a conventional device, an example of a situation in which the accuracy of application of the adhesive tape PT decreases due to the tilt of the workpiece W is when unevenness is formed on the held surface Wb of the workpiece W. That is, as shown in FIG. 22(a), when the held surface Wb, which has been made uneven by the device Db, is held by the flat workpiece holding part Va, the workpiece holding part Va supports the workpiece W in contact with the tip of the protruding device Db. As a result, the workpiece W is tilted as shown in FIG. 22(b), and the workpiece W is held on the holding table HT in an inclined state. In particular, when the uneven area Bc where the device Db is formed is located away from the center of the workpiece W, the workpiece holding part Va comes into contact with the tip of the protruding device Db, causing the balance of the workpiece W to be lost and the workpiece W to be tilted.

When the workpiece W is held on the holding table HT in an inclined state, the parallelism with the adhesive tape PT, which is held horizontally, decreases, and the adhesive tape PT cannot be evenly applied to the tape application surface Wa of the workpiece W. As a result, the accuracy of application of the adhesive tape PT to the workpiece W decreases. Conventionally, adhesive tape was applied to a workpiece whose held surface Wb (back surface) was flat, so even in a device equipped with a conventional holding table HT, it was difficult for the workpiece W to be held in an inclined state. Therefore, it was unlikely that the adhesive tape PT and the workpiece W would be applied in a state where their parallelism was reduced, and there was no concern about application errors caused by the inclination of the workpiece W.

However, in recent years, it has become common for the held surface Wb of the workpiece W to be uneven, making it difficult to reliably prevent tilting of the workpiece W with a conventional holding table HT. As a result, the inventors discovered a problem with conventional devices in that errors in applying the adhesive tape PT frequently occur, particularly when using a workpiece W with an uneven held surface Wb.

In addition, in recent years, there has been a trend for the workpiece W to become larger. After further investigation, the inventors discovered a new problem in that it is difficult to hold a large workpiece W with precision with the conventional holding table HT, in which the workpiece holding portion Va is entirely flat. That is, as shown in FIG. 23(a), dust R can get in between the workpiece W and the workpiece holding portion Va. When dust R gets in, it comes into contact with the held surface Wb of the workpiece W, and as shown in FIG. 23(b), the dust R acts as a fulcrum and the workpiece W tilts.

The larger the workpiece W, the more frequently impurities such as dust R get in between the workpiece W and the workpiece holding portion Va. In other words, when the workpiece W held by the conventional holding table HT becomes larger, the frequency with which the workpiece W tilts on the holding table HT increases. Therefore, the inventors found a problem with the conventional device in that, particularly when using a large workpiece W, errors in applying the adhesive tape PT occur frequently. Thus, when using a workpiece with an uneven held surface or a relatively large workpiece, which has come to be used in recent years, the workpiece tilts on the conventional holding table HT, and errors in applying the adhesive tape PT occur frequently.

In contrast to such a conventional holding table HT, the adhesive tape application device 1 according to Example 2 uses a holding table 13A to hold the workpiece W. The holding table 13A has a recess 41, which is configured to prevent the workpiece W from being held in an inclined state. In other words, even if an uneven area Bc exists on the held surface Wb of the workpiece W, the device Db that causes the unevenness fits into the recess 41, as shown in 24, etc.

As a result, the workpiece holding surface 40 of the holding table 13A holds the workpiece W by abutting against a flat portion of the workpiece W (for example, the outer periphery where no devices or circuits are present). As a result, even if the workpiece W has unevenness on the held surface Wb, the holding table 13A can hold the workpiece W in a highly accurate horizontal state. When the accuracy of the horizontality of the workpiece W is improved, the accuracy of the parallelism with the adhesive tape PT, which is also horizontal, is also improved. Therefore, the adhesive tape PT is attached to the workpiece W with improved parallelism between the adhesive tape PT and the workpiece W, and therefore the frequency of attachment errors caused by the tilt of the workpiece W can be greatly reduced.

The holding table 13A according to the second embodiment can also prevent the occurrence of joining errors caused by dust R. The holding table 13A with the recess 41 has a narrower area of the held surface Wb of the work W with which the work holding surface 40 abuts than the conventional one. That is, as shown in FIG. 24, dust R falls into the recess 41 more frequently, so that it is possible to more reliably prevent dust R from getting between the work holding surface 40 and the held surface Wb of the work W. As a result, the adhesive tape joining device 1 with the holding table 13A can avoid the work W being held in an inclined state due to dust R, so that it is possible to prevent joining errors caused by dust R. Therefore, the adhesive tape joining device 1 according to the second embodiment can maintain high joining accuracy of the adhesive tape PT even when using a new type of work W that has come into use in recent years.

Furthermore, when the workpiece W is rectangular, the corners of the outer periphery of the workpiece are farther from the center than the other parts. In other words, the distance from the center to the outer periphery of a rectangular workpiece is longer than that of a circular workpiece, so when the workpiece is rectangular, impurities such as dust are likely to get between the workpiece and the holding table, making it difficult to place it on the holding table in a horizontal position. In contrast, in the configuration of Example 2, the holding table 13A is provided with a recess 41 as a tilted holding prevention section, so that even a rectangular workpiece, which is easily held in a tilted position, can be reliably held in a horizontal position.

In this way, the adhesive tape application device of Example 2 has a configuration that prevents the workpiece W from tilting when it is held on the holding table 13A. By having a configuration that prevents the workpiece W from being held in such an inclined state, the workpiece W is held in a state in which it maintains its horizontality, so that the adhesive tape PT and the workpiece W can be bonded together while precisely maintaining their parallelism. This makes it possible to further improve the accuracy of applying the adhesive tape PT to the workpiece W.

In the second embodiment, as in the first embodiment, the heating mechanism 73 heats the adhesive tape PT from the non-adhesive side, so that the heating efficiency of the adhesive tape PT can be improved. That is, in the conventional configuration in which the heater 79 is embedded in the holding table 13A, the heat of the heater 79 needs to be indirectly conducted to the adhesive tape PT via the work support part 39A having the recess 41 and the work W. In this case, the heat of the heater 79 is not easily transmitted to the part of the work W facing the recess 41 (uneven area Bc). As a result, the heating efficiency is particularly reduced in the part of the adhesive tape PT facing the uneven area Bc. On the other hand, in the third embodiment, the adhesive tape PT is heated from the non-adhesive side, so that the work W and the deformed member 51 do not interfere with heating. Therefore, the adhesive tape PT can be attached to the work W while efficiently heating the adhesive tape PT and improving the embeddability of the adhesive tape PT.

Next, a third embodiment of the present invention will be described. In the second embodiment, the holding table 13A has a recess 41 in the work support portion 39, which prevents the work W from being held on the holding table 13 in an inclined state. In contrast, in the third embodiment, the holding table 13B has a deformation member 51, which prevents the work W from being held on the holding table 13B in an inclined state. Note that the same components as those in the adhesive tape application device 1 of the second embodiment are given the same reference numerals, and the holding table 13B, which is a different component, will be described in detail.

Figure 25 is a vertical cross-sectional view illustrating the configuration of the holding table 13B according to the third embodiment. The holding table 13B according to the third embodiment includes a work support portion 39 and a deformable member 51. The work support portion 39 is made of a rigid material, and the upper surface is generally flat.

The deformable member 51 is arranged to cover the upper surface of the work support portion 39, and the upper surface of the deformable member 51 is configured to abut against the held surface Wb of the work W. That is, in the third embodiment, the upper surface of the deformable member 51 functions as the work holding surface 40 that contacts the work W. The deformable member 51 is made of a material that deforms according to the shape of the held surface Wb of the work W. Examples of materials that make up the deformable member 51 include a sponge-like material such as urethane foam, and an elastic body such as rubber or elastomer.

Here, the configuration of the workpiece W used in Example 3 is shown in FIG. 25. In Example 3, similar to Example 2, the back side of the workpiece W is the held surface Wb that is held by the holding table 13B. In Example 3, circuits J1 to J6 are formed on the held surface Wb of the workpiece W. Each of the circuits J1 to J6 is composed of wiring or the like, and protrudes from the base B. In other words, the held surface Wb has a shape in which minute projections and recesses are formed by the circuits J1 to J6. Compared to the circuit J2, the height at which the circuit J1 protrudes from the base B is relatively high. The height at which the circuits J1 to J6 protrude from the held surface Wb of the workpiece W is, for example, about 1 μm to 500 μm.

That is, the circuits J1 to J6 protrude from the base B at a relatively low height compared to the device Db according to Example 2. That is, the holding table 13A equipped with the deformable member 51 according to Example 3 is more suitable for holding a workpiece W having unevenness (fine unevenness) with small height differences formed over a wide area on the held surface Wb than the holding table 13 equipped with the recess 41 according to Example 1.

In the third embodiment, the deformable member 51 is disposed over the entire upper surface of the work support portion 39, but the deformable member 51 may be disposed over only a portion of the upper surface of the work support portion 39. That is, when the work W is placed on the holding table 13B in step S2, the deformable member 51 needs to be disposed on the upper surface of the work support portion 39 so that the deformable member 51 abuts against each of the circuits J1 to J6. In other words, the position at which the deformable member 51 is disposed on the holding table 13B needs to be set according to the position of the area of the held surface Wb of the work W that is unevenly shaped by the circuits J1 to J6.

<Description of Operation According to the Third Embodiment>
Here, the operation of the adhesive tape application apparatus 1 according to Example 3 will be described. The process of applying the adhesive tape PT to the workpiece W using the adhesive tape application apparatus 1 according to Example 3 is basically the same as in Example 2. However, the state in which the holding table 13B holds the workpiece W differs from that in Example 2. Here, the explanation of the commonalities between the process according to Example 2 and the process according to Example 3 will be simplified, and only step S2, where there are differences, will be described.

In step S2 in Example 3, when the workpiece W is carried into the joining unit 9 by the holding unit 21, the control unit 33 raises the holding table 13B. The holding unit 21 aligns the position of the workpiece W in the horizontal direction so that the area on the workpiece W where the circuits J1 to J6 are formed faces the area on the holding table 13B where the deformable member 51 is formed. After the alignment is complete, the control unit 33 lowers the holding arm 23.

When the holding arm 23 descends, the circuits J1 to J6 protruding downward from the base B of the workpiece W come into contact with the upper surface (workpiece holding surface 40) of the deformable member 51 as shown in FIG. 26. Then, when the holding arm 23 descends further, the deformable member 51 deforms in accordance with the uneven shape of the held surface Wb as shown in FIG. 27, and the circuits J1 to J6 sink into the deformable member 51.

At this time, the deformable member 51 deforms according to the protruding height of the circuits J1 to J6. That is, the portion of the deformable member 51 facing the circuit J1, which protrudes relatively high from the held surface Wb of the base B, deforms so as to sink relatively deeply. On the other hand, the portion of the deformable member 51 facing the circuit J2, which protrudes relatively high from the base B, deforms so as to sink relatively shallowly. The deformation of the deformable member 51 prevents the workpiece W from becoming tilted.

In this way, in Example 3, the deformable member 51 deforms according to the shape of the held surface Wb (the difference in the protruding height of the circuits J1 to J6 that make up the unevenness). And because the deformable member 51 deforms according to the shape of the held surface Wb, the workpiece W is placed and held on the holding table 13A while maintaining a horizontal position with high precision, even if the held surface Wb has an uneven shape. In other words, the holding table 13B in Example 3 can hold the workpiece W, whose held surface Wb has an uneven shape, in a horizontal position without tilting it. After the workpiece W is held on the holding table 13B, the adhesive tape PT is attached to the workpiece W by carrying out steps S3 to S7 in the same manner as in Example 2.

The adhesive tape application device according to the third embodiment includes a holding table 13B on which a deformable member 51 is disposed on the workpiece holding surface 40. In step S2, in which the workpiece W is held on the holding table 13B, the deformable member 51 deforms according to the shape of the held surface Wb of the workpiece W. Therefore, even if the held surface Wb is uneven and non-flat, the workpiece W descends while the tape application surface Wa remains horizontal, and is placed and held on the holding table 13B.

By holding the workpiece W horizontally with high precision in step S2, in step S5, the adhesive tape PT is attached to the workpiece W with improved parallelism between the adhesive tape PT and the workpiece W. Therefore, as in Example 2, the adhesive tape attachment device of Example 2 can reliably avoid a decrease in attachment precision due to an incident such as the adhesive tape PT hitting the workpiece W on one side. Even if dust gets between the held surface Wb of the workpiece W and the deformable member 51, when the workpiece W is lowered and the deformable member 51 is pressed from above, the deformable member 51 deforms according to the shape of the dust. Therefore, tilting of the workpiece W due to the presence of dust can be avoided, and the holding table 13B can maintain the horizontality of the workpiece W with higher precision.

As described above, the adhesive tape application device according to Example 3, like Example 2, has a configuration that prevents the workpiece W from tilting when it is held by the holding table 13B. By having a configuration that prevents the workpiece W from being held in such an inclined state, the workpiece W is held in a state in which it maintains its horizontality, so that the adhesive tape PT and the workpiece W can be bonded together while maintaining their parallelism with high precision. This makes it possible to further improve the accuracy of applying the adhesive tape PT to the workpiece W.

In the third embodiment, as in the first embodiment, the heating mechanism 73 for heating the adhesive tape PT from the non-adhesive side is provided, so that the heating efficiency of the adhesive tape PT can be improved. That is, in the conventional configuration in which the heater 79 is embedded in the holding table 13B, the heat of the heater 79 needs to be indirectly conducted to the adhesive tape PT via the workpiece W and the deformation member 51. Therefore, not only the workpiece W but also the deformation member 51 provided on the holding table 13B hinders the heat conduction. In particular, when the deformation member 51 is made of an elastic body such as rubber, the thermal conductivity of the deformation member 51 is low, so that the heating efficiency of the adhesive tape PT is further reduced. On the other hand, in the third embodiment, the adhesive tape PT is heated from the non-adhesive side, so that the workpiece W and the deformation member 51 do not hinder the heating. Therefore, the adhesive tape PT can be attached to the workpiece W while efficiently heating the adhesive tape PT and improving the embeddability of the adhesive tape PT.
<Configuration of Modified Example>
It should be noted that the embodiments disclosed herein are illustrative and not restrictive in all respects. The scope of the present invention is indicated by the claims, not by the description of the above embodiments, and further includes all modifications (variations) within the meaning and scope of the claims. For example, the present invention can be modified as follows.

(1) In each embodiment, the joining member P includes a ring frame f, an adhesive tape PT, and a conveying sheet T, and the ring frame f indirectly supports the adhesive tape PT via the conveying sheet T, but this is not limiting. That is, as shown in Figures 28(a) and 28(b), the adhesive tape PT may be directly supported by the ring frame f.

That is, in the first modified example, the adhesive tape PT is pre-cut into a predetermined shape corresponding to the shape of the ring frame f, and is attached and held by the upper surface of the ring frame f. In other words, the conveying sheet T in the first modified example is replaced by the adhesive tape PT. And in the attachment member P of the first modified example, the adhesive tape PT and the ring frame f are integrated.

The configuration and operation of the adhesive tape application device 1 in the first modified example are basically the same as in Example 1, but the configuration of the chamber 29 formed in step S4 is different. Figure 29 shows the chamber 29 formed in step S4 in the first modified example. In the first modified example, the adhesive tape PT attached to the upper surface of the ring frame f is clamped between the upper housing 29B and the lower housing 29A to form the chamber 29. At this time, the adhesive tape PT functions as a sealing material, and the chamber 29 is divided into a lower space H1 and an upper space H2 by the adhesive tape PT. Note that the device Da in the work W is omitted from Figure 29 and other figures.

In the first modified example, step S5 is started after the chamber 29 is formed by sandwiching the adhesive tape PT, and a differential pressure Gs is generated inside the chamber 29 to attach the adhesive tape PT to the workpiece. That is, the control unit 33 performs control so that the air pressure in the upper space H2 is higher than the air pressure in the lower space H1. This control generates a differential pressure Gs between the lower space H1 and the upper space H2, as shown in FIG. 30, and the adhesive tape PT is pulled toward the lower housing 29A in the attachment member P and attached to the workpiece W. By attaching the adhesive tape PT to the workpiece W, a workpiece complex WF is formed in which the workpiece W and the attachment member P are integrated via the adhesive tape PT, and step S5 is completed. In this way, the adhesive tape attachment process according to the present invention can be performed even in a configuration in which the conveying sheet T is omitted.

(2) In each embodiment, the pasting member P is described as having a ring frame f, a conveying sheet T of a predetermined shape, and an adhesive tape PT of a predetermined shape, but the pasting member P is not limited to having a ring frame f. As an example, the pasting member P may be composed of a long conveying sheet T and an adhesive tape PT of a predetermined shape, as shown in FIG. 31.

In the second modified example in which the joining member P includes a long conveying sheet T, the adhesive tape joining device 1 includes a joining unit 9C. FIG. 32 is a diagram showing the configuration of the joining unit 9C when using a joining member P including a long conveying sheet T. The joining unit 9C includes a tape supply unit 53, a sheet joining mechanism 54, a tape cutting mechanism 55, and a tape recovery unit 57 in addition to the holding table 13 and the chamber 29. For convenience of explanation, the heating mechanism 73 is omitted from the drawings showing the second modified example such as FIG. 32. In addition, the tape cutting mechanism 55 is not limited to being arranged inside the chamber 29, but may be arranged outside the chamber 29. In addition, the tape cutting mechanism 55 is not limited to being arranged in the joining unit 9C, but may be arranged outside the joining unit 9C.

The tape supply unit 53 is equipped with a raw roll P1 on which a conveying sheet T is wound, on which adhesive tape PT is attached and held at a predetermined interval. The raw roll P1 is loaded on a supply bobbin (not shown) and pays out and supplies the conveying sheet T on which the adhesive tape PT is held. The supply bobbin is linked to an electromagnetic brake and applies an appropriate rotational resistance, preventing excessive tape from being paid out from the supply bobbin.

The sheet pasting mechanism 54 includes a movable table 63, a pasting roller 64, and a nip roller 65. The movable table 63 moves horizontally back and forth from left to right along a guide rail (not shown) that is installed in the left-right direction. The pasting roller 64 is supported by a bracket connected to the tip of a cylinder provided on the movable table 63. The nip roller 65 is provided on the tape recovery section 57 side, and includes a feed roller 67 driven by a motor, and a pinch roller 69 that is raised and lowered by a cylinder.

As an example, the tape cutting mechanism 55 is disposed inside the upper housing 29B, and after the adhesive tape PT is attached to the workpiece W, it cuts the conveying sheet T into a predetermined shape to separate the workpiece complex WF from the conveying sheet T. The tape cutting mechanism 55 includes a rotating shaft 59, a support arm 60, and a cutter 61.

The rotating shaft 59 is provided at the center of the upper surface of the upper housing 29B, and is rotatable around an axis in the z direction. The support arm 60 is attached to the side of the rotating shaft 59 and extends in the radial direction of the rotating shaft 59 (here, the horizontal direction). The cutter 61 is disposed at the tip of the support arm 60, and is attached so that the cutting edge faces downward. The cutter 61 is arranged so that it can move up and down. As the rotating shaft 59 rotates, the support arm 60 and the cutter 61 rotate around the z axis with the rotating shaft 59 as a fulcrum. The conveying sheet T is then cut out by the cutter 61 into, for example, a circular shape on the holding table 13.

The tape recovery section 57 is equipped with a recovery bobbin P2 that winds up the unnecessary transport sheet T (unnecessary sheet Tn) after the workpiece complex WF is separated. The recovery bobbin P2 is controlled to rotate forward and backward by a motor (not shown).

<Description of Operation According to the Second Modification>
The process of applying the adhesive tape PT to the workpiece W using the adhesive tape application device 1 according to the second modified example, which uses an application member P without a ring frame f, is basically the same as in Example 1, and is performed according to the flow chart shown in Fig. 7. However, details of the process of supplying the adhesive tape PT in step S3, the process of forming the chamber 29 in step S4, and the process of applying the adhesive tape PT to the workpiece W in step S5 differ from those in Example 1. Here, steps S3 to S5 of the series of operations according to the second modified example will be described.

Step S3 (supply of adhesive tape)
First, step S3 according to the second modified example will be described. In step S3 according to the second modified example, when the workpiece W is held horizontally with high accuracy by the holding table 13, the adhesive tape PT is supplied in the joining unit 9C. That is, a predetermined amount of the conveying sheet T is fed out together with the adhesive tape PT from the tape supply unit 53. The conveying sheet T, which is long overall, is guided above the holding table 13 along a predetermined conveying path. Then, the adhesive tape PT held on the conveying sheet T at a predetermined interval is also guided above the holding table 13 together with the conveying sheet T.

Step S4 (Formation of chamber)
Next, step S4 according to the second modified example will be described. When the adhesive tape PT is fed, the joining roller 64 descends as shown in Fig. 33. Then, as shown in Fig. 34, the joining roller 64 rolls over the conveying sheet T and joins the conveying sheet T to the cylindrical top portion 42 of the lower housing 29A.

When the conveying sheet T is attached to the cylindrical top 42 of the lower housing 29A, the attachment roller 64 is returned to its initial position and the upper housing 29B is lowered. As the upper housing 29B is lowered, the portion of the conveying sheet T attached to the cylindrical top 42 of the lower housing 29A is sandwiched between the upper housing 29B and the lower housing 29A, as in the first embodiment, to form the chamber 29 (see FIG. 12). At this time, the conveying sheet T functions as a sealant, and the chamber 29 is divided into a lower space H1 and an upper space H2 by the conveying sheet T.

Step S5 (Tape heating)
Next, step S5 according to the second modified example will be described. After the chamber 29 is formed, a process of heating the adhesive tape PT is started using the heating mechanism 73. That is, the control unit 33 operates the heater 79 and controls the cylinder 75 to lower the heating member 77 from the initial position to the heating position, as in the first embodiment (see FIG. 13, etc.). By moving the heating member 77 to the heating position, the lower surface of the heating member 77 is brought into contact with the conveying sheet T. When the heating member 77 comes into contact with the conveying sheet T, the heater 79 embedded in the heating member 77 heats the adhesive tape PT held by the conveying sheet T from the non-adhesive side.

When the heater 79 heats the adhesive tape PT to a predetermined temperature, the adhesive Pb softens. That is, the softening of the adhesive Pb improves the embeddability of the adhesive Pb into the layer. When the adhesive tape PT has been heated for a predetermined time and the embeddability of the adhesive Pb has improved, the control unit 33 raises the heating member 77 from the heating position to the initial position. By heating the adhesive tape PT to improve the embeddability of the adhesive Pb, the process of step S5 is completed.

Step S6 (pasting process)
Next, step S6 according to the second modified example will be described. After the adhesive tape PT is heated, the process of bonding the adhesive tape PT to the workpiece W is started. As in the first embodiment, the control unit 33 slightly raises the holding table 13 to bring the workpiece W closer to the adhesive tape PT, and adjusts the air pressure in the chamber 29 to generate a differential pressure Gs. Then, as in the first embodiment, the differential pressure Gs is applied for a certain period of time, whereby the adhesive tape PT is bonded to the tape application surface Wa of the workpiece W, and the workpiece complex WF is formed.

In the second modified example, unlike the first embodiment, after the workpiece complex WF is formed, a process of separating the workpiece complex WF from the long conveying sheet T using the tape cutting mechanism 55 is further carried out. As an example, when the tape cutting mechanism 55 is disposed inside the chamber 29, the process of separating the workpiece complex WF from the long conveying sheet T is carried out in step S6. That is, as shown in FIG. 35, inside the chamber 29, the tape cutting mechanism 55 descends from the initial position to the cutting position. It moves from the initial position shown by the dotted line to the cutting position shown by the solid line. Then, as the tape cutting mechanism 55 descends to the cutting position, the cutter 61 pierces the conveying sheet T at the outer portion of the adhesive tape PT.

When the cutter 61 is pierced into the conveying sheet T, the support arm 60 rotates around the vertical axis M. Accordingly, the cutter 61 rotates along a circular orbit surrounding the adhesive tape PT, and the conveying sheet T is cut along the circular orbit. When the conveying sheet T is cut by the cutter 61, the portion of the conveying sheet T that holds the adhesive tape PT is cut out, and the workpiece complex WF is separated from the long conveying sheet T. When the workpiece complex WF is formed and separated from the conveying sheet T, step S6 according to the second modified example is completed. Note that when the tape cutting mechanism 55 is disposed outside the chamber 29, as an example, after the workpiece complex WF is transported out of the chamber 29 in step S7, the workpiece complex WF is separated from the long conveying sheet T using the tape cutting mechanism 55 disposed outside the chamber 29.

Step S7 (recovery of workpiece complex)
When the adhesive tape PT is affixed to the workpiece W to form the workpiece complex WF, a process of recovering the workpiece complex WF is started. First, as in the first embodiment, the control unit 33 raises the holding table 13, and then fully opens the electromagnetic valves 103, 105, 107, 110, and 113 to open the upper space H2 and the lower space H1 to the atmosphere. When the upper space H2 and the lower space H1 are open to the atmosphere, the control unit 33 raises the upper housing 29B to open the chamber 29.

Here, in step S6 according to the second modified example, a process of collecting the unnecessary sheet Tn is further performed after the chamber 29 is opened. That is, as shown in FIG. 36, the nip roller 65 moves from the side of the tape collection section 57 to the side of the tape supply section 53 (from left to right in the figure), and rolls up and peels off the unnecessary sheet Tn that remains after being cut out and cut on the workpiece W from the conveying sheet T.

After the unnecessary sheets Tn are peeled off, the suction plate 27 provided on the frame transport device 17 suctions and holds the work complex WF, and detaches the work complex WF from the lower housing 29A. The frame transport device 17 that has suctioned and held the work complex WF transports the work complex WF to the complex recovery section 6. The transported work complex WF is loaded and stored in the cassette 43. This completes one cycle of operations for attaching the adhesive tape PT to the work W in the second modified example.

(3) In each embodiment, a process (temporary attachment process) of attaching the adhesive tape PT to the workpiece W outside the chamber 29 may be performed before step S6 in which the adhesive tape PT is attached to the workpiece W by the differential pressure Gs generated inside the chamber 29 in a reduced pressure state. The adhesive tape PT is attached to the workpiece W under atmospheric pressure, and the attachment member P and the workpiece W are integrated to form a composite precursor PF.

Figure 37 is a vertical cross-sectional view showing the structure of the composite precursor PF. In the temporary attachment process for creating the composite precursor PF, the adhesive tape PT contacts the workpiece W with a weaker pressing force than in the attachment process of step S5. Therefore, the adhesive tape PT and the tape attachment surface Wa of the workpiece W in the composite precursor PF are in a low adhesion state. The temporary attachment process is completed by placing the workpiece W on the support table ST as shown in Figure 38, and then contacting the workpiece W with the adhesive tape PT waiting above the support table ST under atmospheric pressure conditions as shown in Figure 39. This contact causes the upper surface of the device Da to adhere to the adhesive material Pb of the adhesive tape PT, and the adhesive tape PT and the workpiece W are integrated. The composite precursor PF is formed by this temporary attachment process. The temporary attachment process may be performed in the adhesive tape attachment device 1 or in other devices.

The process of applying the adhesive tape PT to the workpiece W using the adhesive tape application device 1 according to the third modified example is different from that of the first embodiment in that the process of step S3 is omitted. When the temporary application process is performed in the adhesive tape application device 1, the temporary application process is performed before step S1 to form the composite precursor PF. The composite precursor PF is stored in multiple stages in advance in the container 5 or the frame supply unit 11.

In step S1 of the third modified example, the composite precursor PF stored in the container 5 or the like is adsorbed and held by the work transport device 16 and carried out, aligned by the aligner 7, and then transported above the holding table 13. The composite precursor PF may be transported by the frame transport device 17.

In step S2 of the third modified example, the control unit 33 raises the holding table 13 so that the difference in height between the frame holding part 38 and the work holding surface 40 is equal to the difference in height between the lower surface of the ring frame f and the held surface Wb of the work W. Then, the holding unit 21 aligns the position of the work W in the horizontal direction so that the uneven area Bc formed on the work W faces the recessed portion 41 formed on the holding table 13, and lowers the holding arm 23.

When the holding arm 23 is lowered, the device Db protruding downward from the base portion B of the workpiece W is fitted into the recess 41. Then, when the base portion B of the workpiece W abuts against the workpiece holding surface 40, the workpiece W is supported by the workpiece support portion 39 of the holding table 13. As shown in FIG. 40, the process of step S2 according to the third modified example is completed by holding the workpiece W contained in the composite precursor PF on the holding table 13, and the process proceeds to step S4.

In step S4 of the third modified example, the control unit 33 lowers the upper housing 29B while maintaining the height of the holding table 13. As the upper housing 29B lowers, the portion of the conveying sheet T that is in contact with the cylindrical top portion 42 of the lower housing 29A is sandwiched between the upper housing 29B and the lower housing 29A, as shown in FIG. 12, to form the chamber 29.

In step S5 in the third modified example, the control unit 33 adjusts the air pressure in the chamber 29 to generate a differential pressure Gs in the same manner as in the first embodiment while maintaining the height of the holding table 13 (see FIG. 13). By generating the differential pressure Gs, the adhesive tape PT is strongly pressed against the tape application surface Wa of the workpiece W by the differential pressure Gs.

That is, before the start of step S5, as shown in FIG. 41(a), the device Da is attached to the adhesive surface of the adhesive tape PT, but when the pressure difference Gs occurs in step S5, as shown in FIG. 41(b), the pressure difference Gs causes the device Da to be embedded in the layer of adhesive material Pb of the adhesive tape PT. As a result, the pressure difference Gs causes the adhesive tape PT to adhere to the tape application surface Wa of the workpiece W.

In this way, by applying the differential pressure Gs for a certain period of time, the adhesive tape PT is attached to the tape application surface Wa of the workpiece W. By applying the adhesive tape PT to the workpiece W, a workpiece complex WF is formed in which the application member P and the workpiece W are integrated, and the application process in step S5 is completed.

In step S6 in the third modified example, the control unit 33 maintains the height of the holding table 13 while opening the upper space H2 and the lower space H1 to the atmosphere in the same manner as in Example 1. The upper housing 29B is then raised to open the chamber 29. After the chamber 29 is opened, the workpiece complex WF is adsorbed and held using the frame transport device 17 in the same manner as in Example 1, and the workpiece complex WF is transported to the complex recovery unit 6. This completes a cycle of operations for attaching the adhesive tape PT to the workpiece W in the third modified example.

(4) In step S5 in each embodiment, the configuration in which the adhesive tape PT is pressed by the differential pressure Gs generated inside the chamber 29 to be attached to the workpiece W has been exemplified, but the method of attaching the adhesive tape PT to the workpiece W is not limited to the configuration using the differential pressure Gs. As another example of a method of attaching the adhesive tape PT to the workpiece W, as shown in FIG. 42, there is a method of attaching the adhesive tape PT to the workpiece W using a pressure plate 71. The pressure plate 71 is disposed inside the upper housing 29B and is configured to be able to rise and fall inside the chamber 29. The lower surface of the pressure plate 71 has a diameter larger than the adhesive tape PT and the workpiece W and has a flat shape. Note that in the figures showing the fourth modified example such as FIG. 42, the heating mechanism 73 is omitted.

In the fourth modified example equipped with the pressure plate 71, steps S1 to S4 are carried out in the same manner as in the first embodiment to form the chamber 29. When step S5 in the fourth modified example starts, the control unit 33 reduces the pressure inside the chamber 29. That is, the control unit 33 closes the electromagnetic valves 105, 107, and 110, and opens the electromagnetic valves 103 and 113. The control unit 33 then operates the vacuum device 31 to reduce the air pressure in the lower space H1 and the upper space H2 to a predetermined value.

When the air pressure in the lower space H1 and the upper space H2 is reduced to a predetermined value, the control unit 33 closes the electromagnetic valve 103 and stops the operation of the vacuum device 31. Then, as shown in FIG. 43, the control unit 33 lowers the pressure plate 71 and presses the adhesive tape PT with the lower surface of the pressure plate 71. In other words, by pressing the adhesive tape PT with the pressure plate 71, a pressing force V1 is applied between the adhesive tape PT and the workpiece W.

The pressure plate 71 has a flat lower surface and is disposed so as to be positioned above the adhesive tape PT. Therefore, by lowering the pressure plate 71, a downward pressure force V1 acts evenly on the entire adhesive tape PT, and the adhesive tape PT can be attached to the workpiece W while maintaining a horizontal state with high precision. After step S5 is completed, step S6 is executed as in Example 1, completing a cycle of operations for attaching the adhesive tape PT to the workpiece W in the fourth modified example.

In the fourth modified example, the chamber 29 may be omitted. That is, the pressure plate 71 may press the adhesive tape PT under atmospheric pressure to adhere the adhesive tape PT to the workpiece W. However, by using the chamber 29 to adhere the adhesive tape PT to the workpiece W using the pressure plate 71 under reduced pressure, it is possible to avoid air being trapped between the adhesive tape PT and the workpiece W.

In the fourth modified example, the pressure plate 71 may also function as the heating member 77. That is, a heater 79 may be embedded inside the pressure plate 71, and in step S5, the pressure plate 71 with the built-in heater 79 may be brought into contact with or close to the adhesive tape PT to heat the adhesive tape PT from the non-adhesive side.

(5) In Example 2, an adhesive tape application device 1 is described that includes a holding table 13 that includes a recess 41 as a tilt prevention unit that prevents the workpiece W from being held in a tilted state, and in Example 3, an adhesive tape application device 1 is described that includes a holding table 13A that includes a deformable member 51 as a tilt prevention unit. However, the configurations of Examples 2 and 3 may be combined. Here, as a fifth modified example, a configuration that uses a holding table and workpiece that combines Examples 2 and 3 is described.

In the fifth modified example, the workpiece W has circuits J1 to J6 and a device Db on the held surface Wb, as shown in FIG. 45. That is, the workpiece W according to the fifth modified example has an area (uneven area Bc) where rough irregularities (irregularities with a relatively large difference in height) caused by the device Db are formed, and an area (uneven area Bd) where relatively fine irregularities (irregularities with a relatively small difference in height) caused by the circuits J1 to J6 are formed.

Figure 46 shows the configuration of a holding table 13C according to the fifth modified example. The holding table 13C according to the fifth modified example has a work support portion 39A in which a recess 41 is formed, and a deformable member 51. That is, the holding table 13C according to the fifth modified example has both a work support portion 39A having a configuration similar to that of Example 2, and a deformable member 51 having a configuration similar to that of Example 3. In the holding table 13C, the work holding portion 40 that abuts against the work W corresponds to the upper surface of the deformable member 51.

In the fifth modified example, the positions where the recess 41 and the deformable member 51 are formed are determined according to the positions of the uneven area Bc and the uneven area Bd on the workpiece W. That is, the area where the recess 41 is formed on the workpiece support part 39A is determined to be located opposite the area where the uneven area Bc is formed on the workpiece W. In addition, the area covered by the deformable member 51 on the workpiece support part 39A is determined to be located opposite the area where the uneven area Bd is formed on the workpiece W.

The depth H2 of the recess 41 can be set to a relatively large value, so that even if the unevenness has a relatively large protruding height, the unevenness can be fitted into the recess 41. Therefore, when dealing with unevenness with a relatively large height difference, such as the device Db, the recess 41 can more reliably prevent the work W from tilting due to the unevenness than the deformable member 51. The deformable member 51 has a limit to the height difference of the unevenness that can be adjusted by deformation, while the work support part 39A can indirectly support the work W via the deformable member 51. In other words, the arrangement of the deformable member 51 does not narrow the range in which the work W is supported by the work support part 39A. Therefore, when dealing with unevenness with a relatively small height difference, such as the circuits J1 to J6, the deformable member 51 can more stably support the work W while preventing the work W from tilting due to the unevenness than the recess 41. In other words, the recess 41 is suitable for dealing with the unevenness area Bc where coarse unevenness is formed, and the deformable member 51 is suitable for dealing with the unevenness area Bd where fine unevenness is formed.

The process of applying the adhesive tape PT to the workpiece W using the adhesive tape application device 1 according to the fifth modified example is basically the same as in Example 1, and is carried out according to the flowchart shown in FIG. 7. However, the process of holding the workpiece W using the holding table 13C in step S2 differs from that in Example 1. Here, the explanation of the commonalities between the process according to Example 1 and the process according to Example 3 will be simplified, and only step S2, where there are differences, will be explained.

In step S2 in the fifth modified example, when the workpiece W is carried into the joining unit 9 by the holding unit 21, the control unit 33 raises the holding table 13C. The holding unit 21 aligns the position of the workpiece W in the horizontal direction so that the uneven area Bd where the circuits J1 to J6 are formed on the workpiece W faces the area where the deformable member 51 is formed on the holding table 13B, and so that the uneven area Bc where the device Db is formed on the workpiece W faces the area where the recess 41 is formed on the holding table 13B. After the alignment is complete, the control unit 33 lowers the holding arm 23.

As the holding arm 23 descends, the device Db protruding downward from the base B of the work W in the uneven area Bc is fitted into the recess 41 as shown in FIG. 47. Additionally, the circuits J1 to J6 protruding downward from the base B of the work W in the uneven area Bd come into contact with the upper surface (work holding surface 40) of the deformable member 51. Then, as the holding arm 23 descends further, the deformable member 51 deforms in accordance with the uneven shape of the held surface Wb, and the circuits J1 to J6 sink into the deformable member 51 as shown in FIG. 48.

At this time, the deformable member 51 deforms according to the protruding height of the circuits J1 to J6. That is, the portion of the deformable member 51 facing the circuit J1, which protrudes relatively high from the held surface Wb of the base portion B, deforms so as to sink relatively deeply. On the other hand, the portion of the deformable member 51 facing the circuit J2, which protrudes relatively high from the base portion B, deforms so as to sink relatively shallowly. As a result, the base portion B of the work W, which is in a flat state, abuts against the work holding surface 40. The work holding surface 40 of the holding table 13 is flat and spreads in the horizontal direction. In addition, the base portion B of the work W is in a flat state. Therefore, by holding the work W by the holding table 13C via the base portion B and the work holding surface 40, the tape application surface Wa of the work W becomes horizontal with high precision.

In this way, in the fifth modified example, the deformation member 51 is deformed, so that the workpiece W can be prevented from being tilted due to the uneven shape of the uneven area Bd. In addition, since the device Db formed in the uneven area Bc is fitted into the recess 41, the workpiece holding surface 40 can be prevented from supporting the device Db. That is, the workpiece W can be prevented from being tilted due to the uneven shape of the uneven area Bc. In other words, the workpiece W can be prevented from being tilted by the device Db being supported by the workpiece holding surface 40. When the workpiece W is placed on the workpiece holding surface 40 of the holding table 13C, the holding arm 23 releases the suction holding of the workpiece W and rises. By holding the workpiece W on the holding table 13C, the process of step S2 according to the fifth modified example is completed. Thereafter, the processes of steps S3 to S7 are performed in the same manner as in the first embodiment, so that the adhesive tape PT is attached to the workpiece W.

(6) In each embodiment, the joining unit 9 includes a vacuum device 31, and the lower space H1 and the upper space H2 are depressurized by the vacuum device 31, and then the air pressure in the upper space H2 is brought closer to atmospheric pressure to generate the pressure difference Gs. However, the configuration for generating the pressure difference Gs is not limited to this. Here, an adhesive tape joining device 1 including a joining unit 9B as a sixth modified example will be described instead of the joining unit 9 included in the adhesive tape joining device 1 according to embodiment 1.

As shown in FIG. 49, the joining unit 9B according to the sixth modified example includes a pressure device 32 in addition to a vacuum device 31. That is, in the joining unit 9B, the holding table 13B is connected in communication with each of the vacuum device 31 and the pressure device 32 that are arranged outside the chamber 29.

In the joining unit 9B, the lower housing 29A is connected to a flow path 121 for reducing pressure, and the upper housing 29B is connected to a flow path 122 for reducing pressure. Both the flow paths 121 and 122 are connected to the vacuum device 31 via the flow path 101 for reducing pressure. That is, the lower housing 29A is connected to the vacuum device 31 for reducing pressure via the flow paths 101 and 121. And the upper housing 29B is connected to the vacuum device 31 for reducing pressure via the flow paths 101 and 122.

Furthermore, the lower housing 29A is connected to a pressurizing flow path 123, and the upper housing 29B is connected to a pressurizing flow path 124. Both the flow path 123 and the flow path 124 are connected to the pressurizing device 32 via the pressurizing flow path 102. That is, the lower housing 29A is connected to the pressurizing device 32 via the flow path 102 and the flow path 123. And the upper housing 29B is connected to the pressurizing device 32 via the flow path 102 and the flow path 124.

The process of applying the adhesive tape PT to the workpiece W using the adhesive tape application device 1 according to the sixth modified example is basically the same as in Example 1, and is performed according to the flowchart shown in FIG. 7. However, the process of generating a differential pressure Gs in step S6 differs from Example 1 and the like. Here, step S6, where there is a difference, will be described.

In step S6 of the sixth modified example, the control unit 33 slightly raises the holding table 13 to bring the workpiece W closer to the adhesive tape PT, and adjusts the air pressure in the chamber 29 in the joining unit 9B.

When adjusting the air pressure in the chamber 29 in the bonding unit 9B to generate a pressure difference, the control unit 33 first closes the electromagnetic valves 105, 107, and 110 shown in FIG. 25, and opens the electromagnetic valves 103 and 113. The control unit 33 then operates the vacuum device 31 to reduce the air pressure in the lower space H1 and the upper space H2 to a predetermined value. An example of the predetermined value is 10 Pa to 100 Pa.

When the air pressure in the lower space H1 and the upper space H2 is reduced to a predetermined value, the control unit 33 closes the electromagnetic valve 103 and stops the operation of the vacuum device 31. Then, the control unit 33 closes the electromagnetic valves 103, 105, 107, and 113 connected to the lower space H1, and leaks the electromagnetic valve 110 connected to the upper space H2, so that the air pressure in the upper space H2 becomes higher than the air pressure in the lower space H1, thereby raising the air pressure in the upper space H2 to atmospheric pressure (1 atmosphere).

After increasing the air pressure in the upper space H2 to 1 atmosphere, the control unit 33 further closes the electromagnetic valves 103, 105, 107, 110, and 113 shown in FIG. 25, and opens the electromagnetic valves 104 and 124. The control unit 33 then operates the pressurizing device 32 to supply gas to the upper space H2, pressurizing the upper space H2 to a specific value PN. An example of the specific value PN is 0.3 MPa to 0.6 MPa. As a result of the pressurizing operation by the pressurizing device 32, the air pressure in the upper space H2 becomes higher than atmospheric pressure.

By pressurizing the upper space H2 to atmospheric pressure or higher while the lower space H1 is depressurized, a pressure difference Gs of 1 atmosphere or more is generated between the two spaces (see FIG. 13). One example of the magnitude of the pressure difference is 0.3 MPa or more and less than 0.7 MPa. In the bonding unit 9B, the pressure difference Gs can be increased to 1 atmosphere or more by using the pressure device 32.

If a pressure difference Gs of 1 atmosphere or more is to be generated, the lower space H1 may be appropriately pressurized without being limited to a configuration in which the lower space H1 is adjusted to a pressure lower than atmospheric pressure. In other words, the electromagnetic valve 124 may be opened and the opening degree of the electromagnetic valve 114 may be appropriately adjusted to supply gas to the lower space H1 by the pressurizing device 32.

When the pressure difference Gs occurs, the conveying sheet T in the joining member P is pulled toward the lower housing 29A. At this time, the adhesive tape PT held by the conveying sheet T approaches the tape joining surface Wa of the work W while remaining horizontal. The work W is held horizontally with high precision by the holding table 13, which has a recess 41.

As a result, the workpiece W and the adhesive tape PT approach each other while maintaining a highly accurate parallel state, and the adhesive tape PT is pressed against the workpiece W by the differential pressure Gs. The device Da protruding from the surface of the workpiece W is then embedded in the layer of adhesive material Pb of the adhesive tape PT by the differential pressure Gs. By applying the differential pressure Gs for a certain period of time in this manner, the adhesive tape PT is attached to the tape attachment surface Wa of the workpiece W. By attaching the adhesive tape PT to the workpiece W, a workpiece complex WF is formed in which the attachment member P and the workpiece W are integrated, and the attachment process in step S6 is completed.

In this way, in the sixth modified example, the joining unit 9B equipped with the pressure device 32 can supply gas to at least the upper space H2 to make the air pressure greater than 1 atmosphere. In the joining unit 9 equipped only with the vacuum device 31, the air pressure in the upper space H2 cannot be made greater than 1 atmosphere, so the magnitude of the differential pressure Gs is limited to 1 atmosphere or less. On the other hand, the joining unit 9B can make the differential pressure Gs between the upper space H2 and the lower space H1 greater than 1 atmosphere. By using the pressure device 32 to make the differential pressure Gs greater than 1 atmosphere, the pressing force applied from the adhesive tape PT to the wafer W in step S6 can be made greater. Therefore, the adhesion between the adhesive tape PT and the workpiece W can be improved in the process of joining the adhesive tape PT.

(7) In step S5 of each embodiment, a configuration in which the heating member 77 is brought into contact with the conveying sheet T (the adhesive tape PT in the first modified example) to heat the adhesive tape PT has been shown as an example, i.e., the adhesive tape PT is heated while the heating member 77 is in contact with the conveying sheet T or the like, but this is not limited thereto. That is, in step S5, the adhesive tape PT may be heated while the heating member 77 is brought close to the conveying sheet T or the like. In other words, the adhesive tape PT may be heated while the heating member 77 is not in contact with the conveying sheet T or the like but is sufficiently close to it.

LIST OF SYMBOLS 1 ... adhesive tape application device 3 ... workpiece transport mechanism 5 ... container 6 ... composite material recovery section 7 ... aligner 9 ... application unit 11 ... frame supply section 13 ... holding table 16 ... workpiece transport device 17 ... frame transport device 21 ... holding unit 23 ... holding arm 27 ... suction plate 28 ... suction pad 29 ... chamber 29A ... lower housing 29B ... upper housing 31 ... vacuum device 32 ... pressure device 33 ... control section 39 ... workpiece support section 40 ... workpiece holding surface 41 ... recess 51 ... deformation member 53 ... tape supply section 54 ... sheet application mechanism 55 ... tape cutting mechanism 57 ... tape recovery section 64 ... application roller 71 ... pressure plate 73 ... heating mechanism 77 ... proximity member 79 ... heater W ... workpiece Wa ... Tape-applied surface Wb ... Applied surface Da ... Device Db ... Device f ... Ring frame P ... Applied member T ... Transport sheet PT ... Adhesive tape WF ... Workpiece complex Tn ... Unnecessary sheet

Claims (8)

An adhesive tape application device for applying an adhesive tape to a workpiece, comprising:
A holding table that holds a held surface of the workpiece;
a chamber having an upper housing and a lower housing, the chamber housing the holding table;
a chamber partitioning mechanism for partitioning an internal space of the chamber into an upper space and a lower space by sandwiching a sheet material between the upper housing and the lower housing;
A supply mechanism for supplying the sheet material;
a tape heating mechanism for heating the adhesive tape from a non-adhesive side;
a joining mechanism that generates a pressure difference between the upper space and the lower space partitioned by the sheet material while the adhesive tape is heated by the tape heating mechanism, and joins the adhesive tape to the workpiece by the pressure difference formed by the pressure difference;
An adhesive tape joining device comprising: 2. The adhesive tape joining apparatus according to claim 1,
The workpiece has a predetermined area of the held surface having an uneven shape,
The holding table is
A main body portion that supports the workpiece;
A tilted holding prevention part is provided to prevent the workpiece from being held in a tilted state,
The tilt retention prevention portion is
An adhesive tape applying device, characterized in that the main body portion is prevented from directly contacting the predetermined area of the workpiece. 3. The adhesive tape joining apparatus according to claim 2,
The tilt retention prevention portion is
a recess formed in a portion of the main body facing a predetermined region of the workpiece,
the holding table holds the workpiece by the main body coming into contact with a portion of the workpiece other than the predetermined area. 3. The adhesive tape joining apparatus according to claim 2,
The adhesive tape application device, characterized in that the tilted holding prevention portion is a deformation portion that deforms according to the shape of the specified area, and the deformation portion deforms according to the shape of the specified area to prevent the workpiece from being held in an tilted state. 3. The adhesive tape joining apparatus according to claim 1,
The sheet material is held by a frame that surrounds the sheet material,
The chamber partitioning mechanism partitions the internal space of the chamber into an upper space and a lower space by sandwiching the sheet material held by the frame between the upper housing and the lower housing. 3. The adhesive tape joining apparatus according to claim 1,
the sheet material is the adhesive tape,
the chamber dividing mechanism divides the internal space of the chamber into an upper space and a lower space by sandwiching the adhesive tape between the upper housing and the lower housing,
The adhesive tape application device is characterized in that the application mechanism generates a pressure difference between the upper space and the lower space partitioned by the adhesive tape, and applies the adhesive tape to the workpiece using the differential pressure formed by the pressure difference. 3. The adhesive tape joining apparatus according to claim 1,
the adhesive tape has a predetermined shape corresponding to a shape of the workpiece, and the sheet material holds the adhesive tape;
the chamber dividing mechanism divides the internal space of the chamber into an upper space and a lower space by sandwiching a portion of the sheet material that does not hold the adhesive tape between the upper housing and the lower housing,
The adhesive tape application device is characterized in that the application mechanism generates a pressure difference between the upper space and the lower space partitioned by the adhesive tape, and applies the adhesive tape held on the sheet material to the workpiece using the differential pressure formed by the pressure difference. 3. The adhesive tape joining apparatus according to claim 1,
The adhesive tape applying device according to claim 1, wherein the workpiece is rectangular.

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