JP2024061227A5 - - Google Patents

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Publication number
JP2024061227A5
JP2024061227A5 JP2022169033A JP2022169033A JP2024061227A5 JP 2024061227 A5 JP2024061227 A5 JP 2024061227A5 JP 2022169033 A JP2022169033 A JP 2022169033A JP 2022169033 A JP2022169033 A JP 2022169033A JP 2024061227 A5 JP2024061227 A5 JP 2024061227A5
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JP
Japan
Prior art keywords
temperature
wafer
pressure
estimated
vicinity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022169033A
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English (en)
Japanese (ja)
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JP2024061227A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2022169033A priority Critical patent/JP2024061227A/ja
Priority claimed from JP2022169033A external-priority patent/JP2024061227A/ja
Priority to KR1020230131680A priority patent/KR20240056414A/ko
Priority to CN202311310939.3A priority patent/CN117917757A/zh
Priority to US18/484,626 priority patent/US12463069B2/en
Priority to TW112139148A priority patent/TW202433204A/zh
Publication of JP2024061227A publication Critical patent/JP2024061227A/ja
Publication of JP2024061227A5 publication Critical patent/JP2024061227A5/ja
Pending legal-status Critical Current

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JP2022169033A 2022-10-21 2022-10-21 ウエハ温度制御装置、ウエハ温度制御方法及びウエハ温度制御プログラム Pending JP2024061227A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2022169033A JP2024061227A (ja) 2022-10-21 2022-10-21 ウエハ温度制御装置、ウエハ温度制御方法及びウエハ温度制御プログラム
KR1020230131680A KR20240056414A (ko) 2022-10-21 2023-10-04 웨이퍼 온도 제어 장치, 웨이퍼 온도 제어 방법 및 웨이퍼 온도 제어 프로그램
CN202311310939.3A CN117917757A (zh) 2022-10-21 2023-10-10 晶片温度控制装置、晶片温度控制方法和存储介质
US18/484,626 US12463069B2 (en) 2022-10-21 2023-10-11 Wafer temperature control device, wafer temperature control method, and wafer temperature control program
TW112139148A TW202433204A (zh) 2022-10-21 2023-10-13 晶片溫度控制裝置、晶片溫度控制方法和儲存媒體

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022169033A JP2024061227A (ja) 2022-10-21 2022-10-21 ウエハ温度制御装置、ウエハ温度制御方法及びウエハ温度制御プログラム

Publications (2)

Publication Number Publication Date
JP2024061227A JP2024061227A (ja) 2024-05-07
JP2024061227A5 true JP2024061227A5 (enExample) 2025-01-28

Family

ID=90729820

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022169033A Pending JP2024061227A (ja) 2022-10-21 2022-10-21 ウエハ温度制御装置、ウエハ温度制御方法及びウエハ温度制御プログラム

Country Status (5)

Country Link
US (1) US12463069B2 (enExample)
JP (1) JP2024061227A (enExample)
KR (1) KR20240056414A (enExample)
CN (1) CN117917757A (enExample)
TW (1) TW202433204A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1066620S1 (en) * 2021-02-12 2025-03-11 Applied Materials, Inc. Patterned heater pedestal with groove extensions
JP2022125685A (ja) * 2021-02-17 2022-08-29 株式会社Kelk 半導体ウエハの温度制御装置及び半導体ウエハの温度制御方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6140612A (en) 1995-06-07 2000-10-31 Lam Research Corporation Controlling the temperature of a wafer by varying the pressure of gas between the underside of the wafer and the chuck
JP2000277237A (ja) * 1999-03-24 2000-10-06 Komatsu Ltd 基板温度制御プレート及びそれを備える基板温度制御装置
US6353210B1 (en) * 2000-04-11 2002-03-05 Applied Materials Inc. Correction of wafer temperature drift in a plasma reactor based upon continuous wafer temperature measurements using and in-situ wafer temperature optical probe
JP7454504B2 (ja) * 2018-04-12 2024-03-22 ラム リサーチ コーポレーション 基板処理中の基板温度の決定および制御
JP7266481B2 (ja) 2019-07-19 2023-04-28 東京エレクトロン株式会社 温度制御装置、温度制御方法、および検査装置

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