JP2024028177A5 - - Google Patents
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- Publication number
- JP2024028177A5 JP2024028177A5 JP2023130268A JP2023130268A JP2024028177A5 JP 2024028177 A5 JP2024028177 A5 JP 2024028177A5 JP 2023130268 A JP2023130268 A JP 2023130268A JP 2023130268 A JP2023130268 A JP 2023130268A JP 2024028177 A5 JP2024028177 A5 JP 2024028177A5
- Authority
- JP
- Japan
- Prior art keywords
- cell
- cold plate
- width
- length
- power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 12
- 229910002804 graphite Inorganic materials 0.000 claims 12
- 239000010439 graphite Substances 0.000 claims 12
- 239000000463 material Substances 0.000 claims 8
- 239000012530 fluid Substances 0.000 claims 6
- 239000002184 metal Substances 0.000 claims 6
- 229910052751 metal Inorganic materials 0.000 claims 6
- 239000002131 composite material Substances 0.000 claims 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 239000003989 dielectric material Substances 0.000 claims 2
- 239000012777 electrically insulating material Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 239000003990 capacitor Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/820,956 | 2022-08-19 | ||
| US17/820,956 US12165954B2 (en) | 2022-08-19 | 2022-08-19 | Cold plates incorporating S-cells |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2024028177A JP2024028177A (ja) | 2024-03-01 |
| JP2024028177A5 true JP2024028177A5 (enExample) | 2024-11-22 |
| JP7638337B2 JP7638337B2 (ja) | 2025-03-03 |
Family
ID=89907222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023130268A Active JP7638337B2 (ja) | 2022-08-19 | 2023-08-09 | Ｓセルを組み込んだコールドプレート |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US12165954B2 (enExample) |
| JP (1) | JP7638337B2 (enExample) |
| CN (1) | CN117596827B (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12096596B2 (en) * | 2022-10-18 | 2024-09-17 | Toyota Motor Engineering & Manufacturing North America, Inc. | Power electronics device assemblies including dual graphite layers and cold plates incorporating the same |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52135678A (en) * | 1976-05-10 | 1977-11-12 | Toshiba Corp | Semiconductor device and its productions |
| FR2654387B1 (fr) * | 1989-11-16 | 1992-04-10 | Lorraine Carbone | Materiau multicouche comprenant du graphite souple renforce mecaniquement, electriquement et thermiquement par un metal et procede de fabrication. |
| US6075701A (en) * | 1999-05-14 | 2000-06-13 | Hughes Electronics Corporation | Electronic structure having an embedded pyrolytic graphite heat sink material |
| US6903931B2 (en) | 2002-06-13 | 2005-06-07 | Raytheon Company | Cold plate assembly |
| JP5025328B2 (ja) * | 2007-05-16 | 2012-09-12 | 株式会社東芝 | 熱伝導体 |
| JP5316602B2 (ja) * | 2010-12-16 | 2013-10-16 | 株式会社日本自動車部品総合研究所 | 熱拡散部材の接合構造、発熱体の冷却構造、及び熱拡散部材の接合方法 |
| US8804339B2 (en) * | 2011-02-28 | 2014-08-12 | Toyota Motor Engineering & Manufacturing North America, Inc. | Power electronics assemblies, insulated metal substrate assemblies, and vehicles incorporating the same |
| CN104754913B (zh) * | 2013-12-27 | 2018-06-05 | 华为技术有限公司 | 导热复合材料片及其制作方法 |
| CN105636411B (zh) * | 2015-12-30 | 2018-02-16 | 中国电子科技集团公司第二十六研究所 | 液冷用金属流道制作方法及液冷金属流道冷板 |
| JP6750379B2 (ja) * | 2016-08-04 | 2020-09-02 | 日産自動車株式会社 | 冷却装置 |
| US10736236B2 (en) | 2018-01-16 | 2020-08-04 | Ge Aviation Systems, Llc | Power electronic conversion system |
| US10594230B2 (en) * | 2018-03-23 | 2020-03-17 | Sf Motors, Inc. | Inverter module having multiple half-bridge modules for a power converter of an electric vehicle |
| CN110430723A (zh) * | 2019-07-20 | 2019-11-08 | 中国船舶重工集团公司第七二四研究所 | 一种基于低维热扩散材料的固态冷板 |
| TWI743557B (zh) | 2019-09-05 | 2021-10-21 | 朋程科技股份有限公司 | 功率元件封裝結構 |
| US11527456B2 (en) * | 2019-10-31 | 2022-12-13 | Ut-Battelle, Llc | Power module with organic layers |
| US12133357B2 (en) | 2020-06-08 | 2024-10-29 | Intel Corporation | Cold plate architecture for liquid cooling of devices |
| CN113675519A (zh) * | 2021-07-11 | 2021-11-19 | 吉林大学 | 一种耦合石墨烯与热泵的动力电池组加热及冷却装置 |
| CN113873854A (zh) * | 2021-10-18 | 2021-12-31 | 西安微电子技术研究所 | 一种石墨烯复合散热冷板及制备方法及6u插板模块 |
| US11889666B2 (en) * | 2021-11-03 | 2024-01-30 | Toyota Motor Engineering & Manufacturing North America, Inc. | Power device assemblies having embedded PCBs and methods of fabricating the same |
| US11997838B2 (en) * | 2022-02-01 | 2024-05-28 | Toyota Motor Engineering & Manufacturing North America, Inc. | Power device assemblies and methods of fabricating the same |
| US12300653B2 (en) * | 2022-03-22 | 2025-05-13 | Toyota Motor Engineering & Manufacturing North America, Inc. | Electronics assemblies with power electronic devices and three-dimensionally printed circuit boards having reduced joule heating |
-
2022
- 2022-08-19 US US17/820,956 patent/US12165954B2/en active Active
-
2023
- 2023-08-09 JP JP2023130268A patent/JP7638337B2/ja active Active
- 2023-08-18 CN CN202311047674.2A patent/CN117596827B/zh active Active
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