CN117596827B - 包含s-单元的冷板 - Google Patents

包含s-单元的冷板

Info

Publication number
CN117596827B
CN117596827B CN202311047674.2A CN202311047674A CN117596827B CN 117596827 B CN117596827 B CN 117596827B CN 202311047674 A CN202311047674 A CN 202311047674A CN 117596827 B CN117596827 B CN 117596827B
Authority
CN
China
Prior art keywords
cold plate
power electronics
cell
graphite
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202311047674.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN117596827A (zh
Inventor
周锋
请川纮嗣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Engineering and Manufacturing North America Inc
Original Assignee
Toyota Motor Engineering and Manufacturing North America Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Motor Engineering and Manufacturing North America Inc filed Critical Toyota Motor Engineering and Manufacturing North America Inc
Publication of CN117596827A publication Critical patent/CN117596827A/zh
Application granted granted Critical
Publication of CN117596827B publication Critical patent/CN117596827B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Inverter Devices (AREA)
CN202311047674.2A 2022-08-19 2023-08-18 包含s-单元的冷板 Active CN117596827B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/820,956 2022-08-19
US17/820,956 US12165954B2 (en) 2022-08-19 2022-08-19 Cold plates incorporating S-cells

Publications (2)

Publication Number Publication Date
CN117596827A CN117596827A (zh) 2024-02-23
CN117596827B true CN117596827B (zh) 2025-11-11

Family

ID=89907222

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311047674.2A Active CN117596827B (zh) 2022-08-19 2023-08-18 包含s-单元的冷板

Country Status (3)

Country Link
US (1) US12165954B2 (enExample)
JP (1) JP7638337B2 (enExample)
CN (1) CN117596827B (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12096596B2 (en) * 2022-10-18 2024-09-17 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics device assemblies including dual graphite layers and cold plates incorporating the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110430723A (zh) * 2019-07-20 2019-11-08 中国船舶重工集团公司第七二四研究所 一种基于低维热扩散材料的固态冷板
CN113873854A (zh) * 2021-10-18 2021-12-31 西安微电子技术研究所 一种石墨烯复合散热冷板及制备方法及6u插板模块

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Publication number Priority date Publication date Assignee Title
JPS52135678A (en) * 1976-05-10 1977-11-12 Toshiba Corp Semiconductor device and its productions
FR2654387B1 (fr) * 1989-11-16 1992-04-10 Lorraine Carbone Materiau multicouche comprenant du graphite souple renforce mecaniquement, electriquement et thermiquement par un metal et procede de fabrication.
US6075701A (en) * 1999-05-14 2000-06-13 Hughes Electronics Corporation Electronic structure having an embedded pyrolytic graphite heat sink material
US6903931B2 (en) 2002-06-13 2005-06-07 Raytheon Company Cold plate assembly
JP5025328B2 (ja) * 2007-05-16 2012-09-12 株式会社東芝 熱伝導体
JP5316602B2 (ja) * 2010-12-16 2013-10-16 株式会社日本自動車部品総合研究所 熱拡散部材の接合構造、発熱体の冷却構造、及び熱拡散部材の接合方法
US8804339B2 (en) * 2011-02-28 2014-08-12 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics assemblies, insulated metal substrate assemblies, and vehicles incorporating the same
CN104754913B (zh) * 2013-12-27 2018-06-05 华为技术有限公司 导热复合材料片及其制作方法
CN105636411B (zh) * 2015-12-30 2018-02-16 中国电子科技集团公司第二十六研究所 液冷用金属流道制作方法及液冷金属流道冷板
JP6750379B2 (ja) * 2016-08-04 2020-09-02 日産自動車株式会社 冷却装置
US10736236B2 (en) 2018-01-16 2020-08-04 Ge Aviation Systems, Llc Power electronic conversion system
US10594230B2 (en) * 2018-03-23 2020-03-17 Sf Motors, Inc. Inverter module having multiple half-bridge modules for a power converter of an electric vehicle
TWI743557B (zh) 2019-09-05 2021-10-21 朋程科技股份有限公司 功率元件封裝結構
US11527456B2 (en) * 2019-10-31 2022-12-13 Ut-Battelle, Llc Power module with organic layers
US12133357B2 (en) 2020-06-08 2024-10-29 Intel Corporation Cold plate architecture for liquid cooling of devices
CN113675519A (zh) * 2021-07-11 2021-11-19 吉林大学 一种耦合石墨烯与热泵的动力电池组加热及冷却装置
US11889666B2 (en) * 2021-11-03 2024-01-30 Toyota Motor Engineering & Manufacturing North America, Inc. Power device assemblies having embedded PCBs and methods of fabricating the same
US11997838B2 (en) * 2022-02-01 2024-05-28 Toyota Motor Engineering & Manufacturing North America, Inc. Power device assemblies and methods of fabricating the same
US12300653B2 (en) * 2022-03-22 2025-05-13 Toyota Motor Engineering & Manufacturing North America, Inc. Electronics assemblies with power electronic devices and three-dimensionally printed circuit boards having reduced joule heating

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110430723A (zh) * 2019-07-20 2019-11-08 中国船舶重工集团公司第七二四研究所 一种基于低维热扩散材料的固态冷板
CN113873854A (zh) * 2021-10-18 2021-12-31 西安微电子技术研究所 一种石墨烯复合散热冷板及制备方法及6u插板模块

Also Published As

Publication number Publication date
JP2024028177A (ja) 2024-03-01
CN117596827A (zh) 2024-02-23
US12165954B2 (en) 2024-12-10
US20240063090A1 (en) 2024-02-22
JP7638337B2 (ja) 2025-03-03

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