JP7638337B2 - Ｓセルを組み込んだコールドプレート - Google Patents

Ｓセルを組み込んだコールドプレート Download PDF

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JP7638337B2
JP7638337B2 JP2023130268A JP2023130268A JP7638337B2 JP 7638337 B2 JP7638337 B2 JP 7638337B2 JP 2023130268 A JP2023130268 A JP 2023130268A JP 2023130268 A JP2023130268 A JP 2023130268A JP 7638337 B2 JP7638337 B2 JP 7638337B2
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cell
cold plate
power
graphite
width
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Japanese (ja)
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JP2024028177A (ja
JP2024028177A5 (enExample
Inventor
チョウ フォン
紘嗣 請川
Original Assignee
トヨタ モーター エンジニアリング アンド マニュファクチャリング ノース アメリカ，インコーポレイティド
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Inverter Devices (AREA)
JP2023130268A 2022-08-19 2023-08-09 Ｓセルを組み込んだコールドプレート Active JP7638337B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/820,956 2022-08-19
US17/820,956 US12165954B2 (en) 2022-08-19 2022-08-19 Cold plates incorporating S-cells

Publications (3)

Publication Number Publication Date
JP2024028177A JP2024028177A (ja) 2024-03-01
JP2024028177A5 JP2024028177A5 (enExample) 2024-11-22
JP7638337B2 true JP7638337B2 (ja) 2025-03-03

Family

ID=89907222

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023130268A Active JP7638337B2 (ja) 2022-08-19 2023-08-09 Ｓセルを組み込んだコールドプレート

Country Status (3)

Country Link
US (1) US12165954B2 (enExample)
JP (1) JP7638337B2 (enExample)
CN (1) CN117596827B (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12096596B2 (en) * 2022-10-18 2024-09-17 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics device assemblies including dual graphite layers and cold plates incorporating the same

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5100737A (en) 1989-11-16 1992-03-31 Le Carbone Lorraine Multi-layer material comprising flexible graphite which is reinforced mechanically, electrically and thermally by a metal and a process for the production thereof
US20080286602A1 (en) 2007-05-16 2008-11-20 Kabushiki Kaisha Toshiba Heat conductor
US20120152510A1 (en) 2010-12-16 2012-06-21 Nippon Soken, Inc. Bonding structure and bonding method of heat diffusion member, and cooling unit using the same
US20160209133A1 (en) 2013-12-27 2016-07-21 Huawei Technologies Co., Ltd. Thermally conductive composite sheet and method for making same
JP2018022792A (ja) 2016-08-04 2018-02-08 日産自動車株式会社 冷却装置
US20210210477A1 (en) 2019-10-31 2021-07-08 Ut-Battelle, Llc Power module with organic layers

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52135678A (en) * 1976-05-10 1977-11-12 Toshiba Corp Semiconductor device and its productions
US6075701A (en) * 1999-05-14 2000-06-13 Hughes Electronics Corporation Electronic structure having an embedded pyrolytic graphite heat sink material
US6903931B2 (en) 2002-06-13 2005-06-07 Raytheon Company Cold plate assembly
US8804339B2 (en) * 2011-02-28 2014-08-12 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics assemblies, insulated metal substrate assemblies, and vehicles incorporating the same
CN105636411B (zh) * 2015-12-30 2018-02-16 中国电子科技集团公司第二十六研究所 液冷用金属流道制作方法及液冷金属流道冷板
US10736236B2 (en) 2018-01-16 2020-08-04 Ge Aviation Systems, Llc Power electronic conversion system
US10594230B2 (en) * 2018-03-23 2020-03-17 Sf Motors, Inc. Inverter module having multiple half-bridge modules for a power converter of an electric vehicle
CN110430723A (zh) * 2019-07-20 2019-11-08 中国船舶重工集团公司第七二四研究所 一种基于低维热扩散材料的固态冷板
TWI743557B (zh) 2019-09-05 2021-10-21 朋程科技股份有限公司 功率元件封裝結構
US12133357B2 (en) 2020-06-08 2024-10-29 Intel Corporation Cold plate architecture for liquid cooling of devices
CN113675519A (zh) * 2021-07-11 2021-11-19 吉林大学 一种耦合石墨烯与热泵的动力电池组加热及冷却装置
CN113873854A (zh) * 2021-10-18 2021-12-31 西安微电子技术研究所 一种石墨烯复合散热冷板及制备方法及6u插板模块
US11889666B2 (en) * 2021-11-03 2024-01-30 Toyota Motor Engineering & Manufacturing North America, Inc. Power device assemblies having embedded PCBs and methods of fabricating the same
US11997838B2 (en) * 2022-02-01 2024-05-28 Toyota Motor Engineering & Manufacturing North America, Inc. Power device assemblies and methods of fabricating the same
US12300653B2 (en) * 2022-03-22 2025-05-13 Toyota Motor Engineering & Manufacturing North America, Inc. Electronics assemblies with power electronic devices and three-dimensionally printed circuit boards having reduced joule heating

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5100737A (en) 1989-11-16 1992-03-31 Le Carbone Lorraine Multi-layer material comprising flexible graphite which is reinforced mechanically, electrically and thermally by a metal and a process for the production thereof
US20080286602A1 (en) 2007-05-16 2008-11-20 Kabushiki Kaisha Toshiba Heat conductor
US20120152510A1 (en) 2010-12-16 2012-06-21 Nippon Soken, Inc. Bonding structure and bonding method of heat diffusion member, and cooling unit using the same
US20160209133A1 (en) 2013-12-27 2016-07-21 Huawei Technologies Co., Ltd. Thermally conductive composite sheet and method for making same
JP2018022792A (ja) 2016-08-04 2018-02-08 日産自動車株式会社 冷却装置
US20210210477A1 (en) 2019-10-31 2021-07-08 Ut-Battelle, Llc Power module with organic layers

Also Published As

Publication number Publication date
JP2024028177A (ja) 2024-03-01
CN117596827A (zh) 2024-02-23
CN117596827B (zh) 2025-11-11
US12165954B2 (en) 2024-12-10
US20240063090A1 (en) 2024-02-22

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