JP2024027073A - 表面形状を有するセラミックウエハ及びその製造方法 - Google Patents
表面形状を有するセラミックウエハ及びその製造方法 Download PDFInfo
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- 239000000919 ceramic Substances 0.000 title claims abstract description 109
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims abstract description 22
- 230000001788 irregular Effects 0.000 claims abstract description 24
- 238000005498 polishing Methods 0.000 claims description 44
- 238000000227 grinding Methods 0.000 claims description 42
- 239000000463 material Substances 0.000 claims description 12
- 238000012545 processing Methods 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 7
- 239000010409 thin film Substances 0.000 claims description 5
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 4
- 238000003754 machining Methods 0.000 claims description 4
- 150000004767 nitrides Chemical group 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 238000001312 dry etching Methods 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- 238000001039 wet etching Methods 0.000 claims description 3
- 230000007547 defect Effects 0.000 abstract description 13
- 238000000576 coating method Methods 0.000 abstract description 10
- 239000012530 fluid Substances 0.000 abstract description 7
- 239000011248 coating agent Substances 0.000 abstract description 6
- 235000012431 wafers Nutrition 0.000 description 96
- 239000013078 crystal Substances 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000012876 topography Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 206010006514 bruxism Diseases 0.000 description 1
- 238000012993 chemical processing Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910003480 inorganic solid Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- -1 oxides Chemical class 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
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Abstract
Description
(1)セラミック生素地を高温処理してセラミックシートに加工して製造し、又は(2)表面に薄膜又は回路を有し、再生されるセラミックウエハを用意する工程1、及び
前記セラミックシート或いは前記再生されるセラミックウエハを載置円板に置き、前記セラミックシートの上面及び下面に対し研削、研磨、エッチング、プラズマ又は機械加工を含む加工処理を施し、表面形状を有するセラミックウエハを形成する工程2
を含む、前記表面形状を有するセラミックウエハの製造方法も提供する。
ここで、本発明は、上記セラミックウエハの表面欠陥を測定する。具体的に言えば、測定の流れは、セラミックウエハにコーティングを施した後、顕微鏡で欠陥の個数、大きさ、形状を検査し、測定した。
200 片面研削
210、410 砥石
220、320、420、520 セラミックウエハ
230 載置円板
300 両面研削
310 上部研削ディスク
330 下部研削ディスク
400 片面研磨
430 研磨ディスク
500 両面研磨
510 上部研磨ディスク
530 下部研磨ディスク
Claims (10)
- 上面と、下面とを有し、前記上面及び前記下面の少なくとも一方が表面形状を有し、
前記上面と前記下面との間の全面の厚みのばらつき(total thickness variation、TTV)の値が0.1~100μmの範囲である
表面形状を有するセラミックウエハ。 - 前記表面の全面の厚みのばらつきの値は、0.1~10μmの範囲である請求項1に記載の表面形状を有するセラミックウエハ。
- 前記表面形状は、表が凸で裏が平面、表が凹で裏が平面、表が不規則で裏が平面、表が凸で裏が凸、表が凹で裏が凸、表が不規則で裏が凸、表が凸で裏が凹、表が凹で裏が凹、表が不規則で裏が凹、表が凸で裏が不規則、表が凹で裏が不規則、表が不規則で裏が規則である請求項1に記載の表面形状を有するセラミックウエハ。
- 前記セラミックウエハの材料は、窒化アルミニウム、窒化ケイ素、アルミナ、酸化ケイ素、炭化ケイ素の窒化物、酸化物又は炭化物である請求項1に記載の表面形状を有するセラミックウエハ。
- 請求項1~4のいずれか一項に記載の表面形状を有するセラミックウエハの製造方法であって、
(1)セラミック生素地を高温処理してセラミックシートに加工して製造し、又は(2)表面に薄膜又は回路を有し、再生されるセラミックウエハを用意する工程1、及び、
前記セラミックシート或いは前記再生されるセラミックウエハを載置円板に置き、前記セラミックシートの上面及び下面に対し研削、研磨、エッチング、プラズマ又は機械加工を含む加工処理を施し、表面形状を有するセラミックウエハを形成する工程2
を含む、製造方法。 - 前記研削は、片面研削で、前記載置円板の角度を調整することにより、砥石で前記セラミックウエハの表面を研削させ、又は砥石或いは研削ディスクの角度を調整するか、前記砥石の角度形状を制御して前記セラミックウエハの表面を研削させる請求項5に記載の製造方法。
- 前記研削は、両面研削であり、前記セラミックウエハの表面を研削するため、研削ディスクの形状を調整する請求項5に記載の製造方法。
- 前記研磨は、片面研磨であり、前記セラミックウエハの表面を研磨するため、研磨ディスクの角度又は形状を調整する請求項5に記載の製造方法。
- 前記研磨は、両面研磨で、前記セラミックウエハの表面を研磨するため、研磨ディスクの角度又は形状を調整する請求項5に記載の製造方法。
- 前記エッチング方法は、乾式エッチング又は湿式エッチングである請求項5に記載の製造方法。
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