JP2024014054A - Control parameter adjusting method, program and recording medium - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technique that can properly adjust a discharging control parameter in accordance with an environment in which processing liquid is actually discharged to substrates, while suppressing substrates from being used.

SOLUTION: In a first adjusting step S1, a discharging control parameter is adjusted on the basis of a first pressure waveform at the time when simulated application is performed. In a third adjusting step S3, it is determined whether the discharging control parameter should be readjusted, on the basis of a second pressure waveform at the time when actual application is performed in accordance with the discharging control parameter adjusted in the first adjusting step S1, and when it is determined that the parameter should be readjusted, the discharging control parameter is readjusted on the basis of a third pressure waveform at the time when the simulated application is performed. In a fourth adjusting step S4, it is determined whether the discharging control parameter should be readjusted, on the basis of a fourth pressure waveform at the time when actual application is performed in accordance with the discharging control parameter readjusted in the third adjusting step S3, and when it is determined that the parameter should be readjusted, the discharging control parameter is readjusted on the basis of a fifth pressure waveform at the time when the actual application is performed.

SELECTED DRAWING: Figure 5

COPYRIGHT: (C)2024,JPO&INPIT

Description

The subject matter disclosed herein relates to a control parameter adjustment method, a program, and a recording medium.

In the manufacturing process of flat panel displays (FPD), a substrate processing device called a coater is sometimes used. The coater causes the nozzle to scan the substrate while discharging a processing liquid such as a resist liquid from the nozzle onto the substrate such as glass. The coater applies pressure to a processing liquid such as a resist liquid, thereby ejecting the processing liquid from a nozzle. Further, by the moving mechanism moving the substrate relative to the nozzle, a coating film of the processing liquid is formed on the surface of the substrate.

In this type of substrate processing apparatus, there are cases where it is required to make the thickness of the coating film uniform over the entire substrate. In order to make the film thickness uniform, discharge control parameters are adjusted as appropriate. In this adjustment work, for example, an engineer adjusts a plurality of discharge control parameters while visually checking the waveform of the discharge pressure. Therefore, the adjustment work largely depends on the knowledge and experience of the engineer. Therefore, adjusting the discharge control parameters requires a great deal of time and effort by engineers. Furthermore, there is a risk that a large amount of processing liquid and substrates will be consumed. Therefore, techniques for efficiently adjusting control parameters have been proposed.

For example, Patent Document 1 describes a pseudo-discharging process for discharging a processing liquid onto a surface other than a substrate, a discharging characteristic measurement process for measuring the discharging characteristics of the processing liquid in the pseudo-discharging process, and a process for measuring the deviation of the measured discharging characteristics from the target characteristics. A substrate processing method is described that includes a state quantity derivation step of deriving a state quantity, and a learning step of constructing a learning model by performing machine learning on changes in the state quantity due to parameter changes. In this substrate processing method, while the state quantity exceeds a predetermined tolerance range, the parameters are changed based on the learning model, and then the pseudo ejection process, the ejection characteristic measurement process, the state quantity derivation process, and the learning process are repeated. During execution, when the state quantity falls within the allowable range, the last changed parameter is set as the parameter when discharging the processing liquid in the processing liquid supply step.

Japanese Patent Application Publication No. 2020-040046

In Patent Document 1, since the ejection control parameters are adjusted based on pseudo ejection, it is possible to suppress the consumption of the substrate. However, pseudo-discharging differs from actual discharging of a processing liquid onto a substrate in various conditions such as the environment around the nozzle. For this reason, when using ejection control parameters adjusted by simulated ejection, it may be difficult to reproduce an ideal pressure waveform when actually applying a processing liquid to a substrate.

An object of the present invention is to provide a technique that can appropriately adjust ejection control parameters in accordance with the environment in which processing liquid is actually ejected onto a substrate while suppressing consumption of the substrate.

In order to solve the above problems, a first aspect is a control parameter adjustment method for adjusting a discharge control parameter for controlling discharge of a treatment liquid from a nozzle, the method comprising: a) discharging a treatment liquid from a nozzle to a location other than a substrate; a step of adjusting the ejection control parameter based on a first pressure waveform indicating a pressure change in the nozzle when performing a pseudo application of ejection; and b) the ejection control parameter adjusted in the step a). c) obtaining a second pressure waveform indicating a pressure change within the nozzle when actual coating is performed in which a treatment liquid is discharged onto the substrate from the nozzle; c) based on the second pressure waveform; a step of determining whether or not to readjust the discharge control parameter; and d) if it is determined to readjust the discharge control parameter in step c), a third pressure indicating a pressure change in the nozzle when the pseudo coating is performed. a step of readjusting the discharge control parameter based on the waveform; and e) showing a pressure change in the nozzle when the actual application is performed according to the discharge control parameter readjusted in step d). f) determining whether to readjust the discharge control parameter based on the fourth pressure waveform; and g) determining whether to readjust the discharge control parameter in step f). In this case, the method further includes the step of readjusting the ejection control parameter based on a fifth pressure waveform indicating a change in the pressure inside the nozzle when the actual application is performed.

A second aspect is the control parameter adjustment method of the first aspect, further comprising: h) adjusting a movement control parameter for controlling relative movement of the substrate with respect to the nozzle, and the actual application is , the processing liquid is discharged from the nozzle onto the substrate while moving the substrate relative to the nozzle according to the movement control parameters adjusted in step h).

A third aspect is the control parameter adjustment method according to the first aspect or the second aspect, wherein in the step h), the movement control parameter is adjusted based on a speed waveform indicating a change in relative speed of the substrate with respect to the nozzle. be adjusted.

A fourth aspect is a computer-executable program that causes the computer to execute the control parameter adjustment method of the first aspect or the second aspect.

A fifth aspect is a computer-readable recording medium, on which the program of the fourth aspect is recorded.

According to the control parameter adjustment methods of the first to fourth aspects, consumption of the substrate can be suppressed by adjusting and readjusting the ejection control parameters based on the pressure waveform obtained by pseudo coating. In addition, by readjusting the discharge control parameters that were adjusted based on the pressure waveform obtained in the simulated coating based on the fifth pressure waveform obtained in the actual coating, the discharge control parameters can be adjusted to match the actual coating. .

According to the control parameter adjustment method of the second aspect, by adjusting the movement control parameters, it is possible to appropriately perform coating on the substrate.

According to the control parameter adjustment method of the third aspect, the movement control parameter can be appropriately adjusted based on the speed waveform.

1 is a diagram schematically showing the overall configuration of a coating device according to an embodiment. FIG. 3 is a diagram showing the configuration of a processing liquid supply mechanism. 3 is a graph showing a movement pattern of an actuating disk portion of the pump shown in FIG. 2; FIG. 2 is a block diagram showing a configuration example of a control unit. FIG. 3 is a diagram showing a flow in which a control unit adjusts control parameters. 6 is a flowchart showing details of the first adjustment step shown in FIG. 5. FIG. 6 is a flowchart showing details of the second adjustment step shown in FIG. 5. FIG. 6 is a flowchart showing details of the third adjustment step shown in FIG. 5. FIG. FIG. 7 is a diagram showing an example of setting a second ideal waveform. 6 is a flowchart showing details of the fourth adjustment step shown in FIG. 5. FIG.

Embodiments of the present invention will be described below with reference to the accompanying drawings. Note that the components described in this embodiment are merely examples, and the scope of the present invention is not intended to be limited thereto. In the drawings, dimensions and numbers of parts may be exaggerated or simplified as necessary to facilitate understanding.

<1. Embodiment>
FIG. 1 is a diagram schematically showing the overall configuration of a coating device 1 according to an embodiment. The coating apparatus 1 is a substrate processing apparatus that applies a processing liquid to the upper surface Sf of the substrate S. The substrate S is, for example, a glass substrate for a liquid crystal display device. Note that the substrate S is a semiconductor wafer, a glass substrate for photomasks, a glass substrate for plasma displays, a glass or ceramic substrate for magnetic/optical disks, a glass substrate for organic EL, a glass substrate or silicon substrate for solar cells, other flexible substrates, and Various substrates to be processed for electronic devices such as printed circuit boards may be used. The coating device 1 is, for example, a slit coater.

In FIG. 1, an XYZ coordinate system is defined in order to explain the arrangement relationship of each element of the coating device 1. The moving direction of the substrate S is the "X direction". In the X direction, the direction in which the substrate S moves (downstream in the moving direction) is the +X direction, and the opposite direction (upstream in the moving direction) is the -X direction. Further, the direction perpendicular to the X direction is the Y direction, and the direction perpendicular to the X and Y directions is the Z direction. In the following description, the Z direction is assumed to be a vertical direction, and the X and Y directions are assumed to be horizontal directions. In the Z direction, the +Z direction is defined as an upward direction, and the -Z direction is defined as a downward direction.

The coating device 1 includes an input conveyor 100, an input transfer section 2, a floating stage section 3, an output transfer section 4, and an output conveyor 110 in this order toward the +X direction. The input conveyor 100, the input transfer section 2, the floating stage section 3, the output transfer section 4, and the output conveyor 110 constitute a movement path along which the substrate S passes. The coating device 1 further includes a moving mechanism 5, a coating mechanism 7, a treatment liquid supply mechanism 8, and a control unit 9.

The substrate S is conveyed to the input conveyor 100 from the upstream side. The input conveyor 100 includes a roller conveyor 101 and a rotational drive mechanism 102. The rotation drive mechanism 102 rotates each roller of the roller conveyor 101. By the rotation of each roller of the roller conveyor 101, the substrate S is conveyed downstream (in the +X direction) in a horizontal position. The "horizontal attitude" refers to a state in which the main surface (the surface with the largest area) of the substrate S is parallel to the horizontal plane (XY plane).

The input transfer section 2 includes a roller conveyor 21 and a rotation/elevating drive mechanism 22. The rotation/elevating drive mechanism 22 rotates each roller of the roller conveyor 21 and raises and lowers the roller conveyor 21. By the rotation of the roller conveyor 21, the substrate S is transported downstream (in the +X direction) in a horizontal position. In addition, the position of the substrate S in the Z direction is changed by raising and lowering the roller conveyor 21. The substrate S is transferred from the input conveyor 100 to the floating stage section 3 via the input transfer section 2.

As shown in FIG. 1, the floating stage section 3 has a substantially flat plate shape. The floating stage section 3 is divided into three parts along the X direction. The floating stage section 3 includes an entrance floating stage 31, a coating stage 32, and an exit floating stage 33 in this order toward the +X direction. The upper surface of the entrance floating stage 31, the upper surface of the coating stage 32, and the upper surface of the exit floating stage 33 are on the same plane. The levitation stage section 3 further includes a lift pin drive mechanism 34, a levitation control mechanism 35, and an elevation drive mechanism 36. A plurality of lift pins are arranged on the entrance floating stage 31. The lift pin drive mechanism 34 raises and lowers a plurality of lift pins. The levitation control mechanism 35 supplies compressed air for levitating the substrate S to the entrance levitation stage 31, coating stage 32, and exit levitation stage 33. The elevating drive mechanism 36 moves the exit floating stage 33 up and down.

On the upper surface of the entrance flotation stage 31 and the upper surface of the exit flotation stage 33, a large number of ejection holes for ejecting compressed air supplied from the flotation control mechanism 35 are arranged in a matrix. When compressed air is ejected from each ejection hole, the substrate S floats upward relative to the floating stage section 3. Then, the lower surface Sb of the substrate S is separated from the upper surface of the floating stage section 3 and is supported in a horizontal position. The distance (flying height) between the lower surface Sb of the substrate S and the upper surface of the floating stage section 3 when the substrate S is in a floating state is preferably 10 μm or more. The distance is preferably 500 μm or less.

On the upper surface of the coating stage 32, jet holes that jet compressed air supplied from the levitation control mechanism 35 and suction holes that suck gas are arranged alternately in the X direction and the Y direction. The levitation control mechanism 35 controls the amount of compressed air ejected from the ejection hole and the amount of air sucked from the suction hole. Thereby, the flying height of the substrate S with respect to the coating stage 32 is precisely controlled so that the position in the Z direction of the upper surface Sf of the substrate S passing above the coating stage 32 becomes a specified value. Note that the flying height of the substrate S with respect to the coating stage 32 is calculated by the control unit 9 based on the detection result of a sensor 61 or a sensor 62, which will be described later. Further, the flying height of the substrate S relative to the coating stage 32 can preferably be adjusted with high precision by airflow control.

The substrate S carried into the floating stage section 3 is given a driving force in the +X direction from the roller conveyor 21, and is transported onto the entrance floating stage 31. The entrance floating stage 31, the coating stage 32, and the exit floating stage 33 support the substrate S in a floating state. As the floating stage section 3, for example, the configuration described in Japanese Patent No. 5346643 may be adopted.

The moving mechanism 5 is arranged below the floating stage section 3. The moving mechanism 5 includes a chuck mechanism 51 and a suction/travel mechanism 52. The chuck mechanism 51 includes a suction pad (not shown) provided on a suction member. The chuck mechanism 51 supports the substrate S from below with the suction pad in contact with the peripheral edge of the lower surface Sb of the substrate S. The suction/traveling mechanism 52 suctions the substrate S onto the suction pad by applying negative pressure to the suction pad. Further, the suction/traveling mechanism 52 causes the chuck mechanism 51 to reciprocate in the X direction.

The chuck mechanism 51 holds the substrate S in a state where the lower surface Sb of the substrate S is located at a higher position than the upper surface of the floating stage section 3. With the peripheral edge of the substrate S being held by the chuck mechanism 51, the substrate S maintains a horizontal posture due to the buoyancy applied from the floating stage section 3.

As shown in FIG. 1, the coating device 1 includes a sensor 61 for measuring plate thickness. The sensor 61 is placed near the roller conveyor 21. The sensor 61 detects the position of the upper surface Sf of the substrate S held by the chuck mechanism 51 in the Z direction. Furthermore, by positioning a chuck (not shown) that does not hold the substrate S directly below the sensor 61, the sensor 61 can detect the position of the suction surface, which is the top surface of the suction member, in the vertical direction Z. There is.

The chuck mechanism 51 moves in the +X direction while holding the substrate S carried into the floating stage section 3. As a result, the substrate S is transported from above the entrance floating stage 31 to above the coating stage 32 and above the exit floating stage 33. Then, the substrate S is moved from the exit floating stage 33 to the output transfer section 4.

The output transfer unit 4 moves the substrate S from a position above the exit floating stage 33 to the output conveyor 110. The output transfer section 4 includes a roller conveyor 41 and a rotation/elevating drive mechanism 42. The rotation/elevating drive mechanism 42 rotates the roller conveyor 41 and moves the roller conveyor 41 up and down along the Z direction. As each roller of the roller conveyor 41 rotates, the substrate S moves in the +X direction. Further, as the roller conveyor 41 moves up and down, the substrate S is displaced in the Z direction.

The output conveyor 110 includes a roller conveyor 111 and a rotational drive mechanism 112. The output conveyor 110 conveys the substrate S in the +X direction by rotation of each roller of the roller conveyor 111, and discharges the substrate S to the outside of the coating apparatus 1. Note that the input conveyor 100 and the output conveyor 110 are part of the coating device 1. However, the input conveyor 100 and the output conveyor 110 may be incorporated into a device different from the coating device 1.

The coating mechanism 7 applies a treatment liquid to the upper surface Sf of the substrate S. The coating mechanism 7 is arranged above the moving path of the substrate S. The coating mechanism 7 has a nozzle 71. The nozzle 71 is a slit nozzle having a slit-shaped discharge port on the lower surface. Nozzle 71 is connected to a positioning mechanism (not shown). The positioning mechanism moves the nozzle 71 between a coating position above the coating stage 32 (the position indicated by a solid line in FIG. 1) and a maintenance position described below. The processing liquid supply mechanism 8 is connected to the nozzle 71. When the processing liquid supply mechanism 8 supplies the processing liquid to the nozzle 71, the processing liquid is discharged from the discharge port arranged on the lower surface of the nozzle 71.

In the coating device 1, the processing liquid is applied to the substrate S by the movement mechanism 5 moving the substrate S with respect to the nozzle 71 that discharges the processing liquid. However, the moving mechanism 5 may be configured to move the nozzle 71 with respect to the substrate S arranged at a fixed position. Furthermore, the moving mechanism 5 may be configured to move both the nozzle 71 and the substrate S. In this case, the moving direction of the substrate S may be opposite to the moving direction of the nozzle 71. Further, the moving direction of the substrate S may be the same as the moving direction of the nozzle 71. In this case, the moving mechanism 5 may transport the nozzle 71 and the substrate S so that the nozzle 71 chases the substrate S at a speed faster than the speed of the substrate S being transported.

FIG. 2 is a diagram showing the configuration of the processing liquid supply mechanism 8. As shown in FIG. The processing liquid supply mechanism 8 includes a pump 81 , a pipe 82 , a processing liquid replenishment unit 83 , a pipe 84 , an on-off valve 85 , a pressure gauge 86 , and a drive section 87 . The pump 81 is a supply source for supplying the processing liquid to the nozzle 71, and supplies the processing liquid by changing the volume. The pump 81 may be, for example, a bellows type pump described in JP-A-10-61558. As shown in FIG. 2, the pump 81 has a flexible tube 811 that can be elastically expanded and contracted in the radial direction. One end of the flexible tube 811 is connected to the processing liquid replenishment unit 83 via piping 82 . The other end of flexible tube 811 is connected to nozzle 71 via piping 84.

The pump 81 has a bellows 812 that is elastically deformable in the axial direction. The bellows 812 has a small bellows part 813, a large bellows part 814, a pump chamber 815, and an actuation disk part 816. Pump chamber 815 is located between flexible tube 811 and bellows 812. Pump chamber 815 is filled with an incompressible medium. Actuation disk section 816 is connected to drive section 87 .

The processing liquid replenishment unit 83 has a storage tank 831 that stores the processing liquid. Storage tank 831 is connected to pump 81 via piping 82. An on-off valve 833 is inserted into the pipe 82 . The on-off valve 833 opens and closes in response to commands from the control unit 9. When the on-off valve 833 is opened, the processing liquid can be replenished from the storage tank 831 to the flexible tube 811 of the pump 81. Further, when the on-off valve 833 closes, replenishment of the processing liquid from the storage tank 831 to the flexible tube 811 of the pump 81 is restricted.

Piping 84 is connected to the output side of pump 81. The on-off valve 85 is inserted into the pipe 84. The on-off valve 85 opens and closes in response to commands from the control unit 9. By opening and closing the on-off valve 85, feeding of the processing liquid to the nozzle 71 and stopping of liquid feeding are switched. A pressure gauge 86 is arranged in the piping 84. The pressure gauge 86 detects the pressure (discharge pressure) of the processing liquid sent to the nozzle 71 and outputs a signal indicating the detected pressure value to the control unit 9.

FIG. 3 is a graph showing a movement pattern of the actuating disk portion 816 of the pump 81 shown in FIG. In FIG. 3, the horizontal axis indicates time, and the vertical axis indicates the moving speed of the actuating disk portion 816. The drive unit 87 displaces the actuating disk portion 816 in the axial direction in accordance with a command from the control unit 9 in a movement pattern as shown in FIG. let The displacement of the actuating disk portion 816 causes the volume inside the bellows 812 to change. As a result, the flexible tube 811 expands and contracts in the radial direction to perform a pumping operation, and the processing liquid replenished from the processing liquid replenishment unit 83 is fed toward the nozzle 71 . Since the movement pattern of the actuating disk portion 816 is closely related to the discharge characteristics of the processing liquid discharged from the nozzle 71, a pressure waveform indicating a change in discharge pressure over time can be obtained in accordance with the movement pattern. Note that the discharge amount (the amount of processing liquid discharged from the nozzle 71) increases or decreases in accordance with the increase or decrease in the discharge pressure.

In this embodiment, the discharge pressure of the processing liquid discharged from the nozzle 71 is adjusted by adjusting various parameters (acceleration time, steady speed, steady speed time, deceleration time, etc.) that define the movement of the actuating disk portion 816. Optimization processing (adjustment processing) for making the pressure waveform match or approximate an ideal waveform is performed as appropriate. This optimization process will be detailed later.

As shown in FIGS. 1 and 2, a sensor 62 is arranged in the nozzle 71 to which the processing liquid is supplied from the processing liquid supply mechanism 8. The sensor 62 detects the height of the substrate S in the Z direction in a non-contact manner. The sensor 62 is connected to the control unit 9 for data communication. Based on the detection result of the sensor 62, the control unit 9 measures the distance (separation distance) between the floating substrate S and the upper surface of the coating stage 32. The control unit 9 adjusts the application position of the nozzle 71 by the positioning mechanism based on the separation distance measured by the sensor 62. Note that as the sensor 62, an optical sensor or an ultrasonic sensor may be employed.

The coating mechanism 7 includes a nozzle cleaning standby unit 72. The nozzle cleaning standby unit 72 performs predetermined maintenance on the nozzle 71 placed at the maintenance position. The nozzle cleaning standby unit 72 includes a roller 721, a cleaning section 722, and a roller butt 723. The nozzle cleaning standby unit 72 cleans the nozzle 71 and forms a liquid pool to prepare the discharge port of the nozzle 71 in a state suitable for coating processing. In addition, in the coating device 1, in order to evaluate the discharge pressure applied to the processing liquid, the nozzle 71 is placed in a maintenance position (pseudo coating position), that is, the discharge opening of the nozzle 71 is opposed to the outer peripheral surface of the roller 721. In this state, the processing liquid is discharged from the nozzle 71 onto the outer peripheral surface of the roller 721. At this time, by rotating the roller 721, the processing liquid discharged from the nozzle 71 can be applied to the moving surface. In other words, the application applied to the moving substrate S can be simulated.

Discharging the processing liquid from the nozzle 71 onto the surface of the roller 721 is referred to as "pseudo application" in which the processing liquid is discharged at a location other than the substrate S. Further, applying the processing liquid to the substrate S from the nozzle 71 is referred to as "actual application".

FIG. 4 is a block diagram showing an example of the configuration of the control unit 9. As shown in FIG. Control unit 9 controls the operation of each element of coating device 1 . The control unit 9 is a computer and includes a calculation section 91, a storage section 93, and a user interface 95. The calculation unit 91 is a processor including a CPU (Central Processing Unit) or a GPU (Graphics Processing Unit). The storage unit 93 includes a temporary storage device such as a RAM (Random Access Memory), and a non-transient auxiliary storage device such as an HDD (Hard Disk Drive) and an SSD (Solid State Drive).

User interface 95 includes a display that displays information to the user and an input device that accepts input operations by the user. As the control unit 9, for example a desktop, laptop or tablet computer can be used.

The storage unit 93 stores a program 931. The program 931 is provided by the recording medium M. That is, the recording medium M has a program 931 recorded thereon so as to be readable by the control unit 9, which is a computer. The recording medium M is, for example, a USB (Universal Serial Bus) memory, an optical disk such as a DVD (Digital Versatile Disc), a magnetic disk, or the like.

The calculation unit 91 functions as a discharge control unit 910, a discharge pressure measurement unit 911, a movement control unit 912, a speed measurement unit 913, a discharge control parameter adjustment unit 915, and a movement control parameter adjustment unit 917 by executing a program 931. .

The discharge control unit 910 controls the operation (feeding operation) of the pump 81 that feeds the processing liquid to the nozzle 71 . The discharge control unit 910 controls the feeding operation of the pump 81 according to preset discharge control parameters.

The discharge pressure measurement unit 911 measures a pressure waveform indicating a change in discharge pressure over time. That is, the discharge pressure measurement unit 911 periodically acquires the discharge pressure measured by the pressure gauge 86 at a predetermined sampling period. As a result, the discharge pressure applied to the treatment liquid during the period in which the treatment liquid is discharged from the nozzle 71 is acquired and stored in the storage unit 93 as data indicating a pressure waveform (discharge data). The discharge data is data indicating the relationship between a certain time and the discharge pressure measured at that time (that is, a change in the discharge pressure over time).

The movement control unit 912 controls the operation (moving operation) of the suction/travel mechanism 52 that moves the substrate S relative to the nozzle 71 based on preset movement control parameters.

The speed measuring unit 913 measures the moving speed of the substrate S by the chuck mechanism 51 and the suction/travel mechanism 52. The speed measuring unit 913 measures the moving speed of the substrate S based on the output of the suction/travel mechanism 52 (for example, the output of a rotary encoder, etc.). The speed measuring unit 913 stores the acquired speed in the storage unit 93 as speed data. The speed data is data that indicates the relationship between a time and a moving speed measured at that time (that is, a change in moving speed over time).

The discharge control parameter adjustment unit 915 performs processing to optimize discharge control parameters. For example, the discharge control parameter adjustment unit 915 evaluates a pressure waveform obtained by performing pseudo coating, and updates the discharge control parameter based on the evaluation result. The discharge control parameter adjustment unit 915 optimizes the discharge control parameters by repeating pseudo application, acquisition of pressure waveforms, evaluation of the pressure waveforms, and updating of the discharge control parameters.

In the coating device 1, in order to apply the processing liquid ejected from the nozzle 71 onto the upper surface Sf of the substrate S with a uniform film thickness, the ejection speed of the processing liquid when ejected from the nozzle 71, that is, the ejection pressure is adjusted. It is important to. Therefore, the discharge control parameters closely related to the pressure waveform are optimized so that the pressure waveform of the discharge pressure approaches the ideal waveform. Specifically, the discharge control parameters to be optimized are set values that define movement of the actuating disk portion 816, and are set values for 16 pump controls shown in FIG. 3 and below.
・Steady speed V1
- Acceleration time T1: Time to accelerate from a stopped state to steady speed V1 - Steady speed time T2: Time to continue steady speed V1 - Steady speed V2
- Acceleration time T3: Time to decelerate from steady speed V1 to steady speed V2 - Steady speed time T4: Time to continue steady speed V2 - Steady speed V3
- Acceleration time T5: Time to accelerate from steady speed V2 to steady speed V3 - Steady speed time T6: Time to continue steady speed V3 - Steady speed V4
- Acceleration time T7: Time to decelerate from steady speed V3 to steady speed V4 - Steady speed time T8: Time to continue steady speed V4 - Steady speed V5
- Acceleration time T9: Time to accelerate from steady speed V4 to steady speed V5 - Steady speed time T10: Time to continue steady speed V5 - Deceleration time T11: Time to decelerate from steady speed V5 to a stopped state

The 16 discharge control parameters described above correspond to control amounts for controlling the operation (feeding operation) of the pump 81 that feeds the processing liquid to the nozzle 71. Note that the type and number of discharge control parameters are not particularly limited, and can be arbitrarily set as long as they are control variables that control the feeding operation of the pump 81.

The movement control parameter adjustment unit 917 adjusts movement control parameters. The movement control parameter adjustment unit 917 updates movement control parameters based on the pseudo movement. "Pseudo movement" refers to pseudo-reproducing the relative movement of the substrate S with respect to the nozzle 71 during actual coating. In the pseudo movement, the treatment liquid is not applied to the substrate S. For example, the pseudo movement in this embodiment refers to moving the chuck mechanism 51 by the movement control unit 912 controlling the suction/travel mechanism 52 according to movement control parameters. Note that in this pseudo movement, the chuck mechanism 51 may actually hold the substrate S, or may hold a simulated member other than the substrate S. Moreover, the chuck mechanism 51 does not need to hold anything.

The movement control parameter adjustment unit 917 evaluates the velocity waveform obtained by the pseudo movement, and updates the movement control parameter based on the evaluation result. Then, the pseudo movement is executed again based on the updated movement control parameters. In this manner, the movement control parameter adjustment unit 917 optimizes the movement control parameters by repeating pseudo movement, acquisition of the speed waveform, evaluation of the speed waveform, and updating of the movement control parameters.

<Adjustment of control parameters>
FIG. 5 is a diagram showing a flow in which the control unit 9 adjusts control parameters. As shown in FIG. 5, the adjustment of the control parameters includes a first adjustment step S1, a second adjustment step S2, a third adjustment step S3, and a fourth adjustment step S4. Note that the adjustment of the control parameters is performed in the order of a first adjustment step S1, a second adjustment step S2, a third adjustment step S3, and a fourth adjustment step S4. Each step will be explained below.

<First adjustment step S1>
FIG. 6 is a flowchart showing details of the first adjustment step S1 shown in FIG. The first adjustment step S1 is a step of adjusting the ejection control parameters in advance by pseudo-coating before actual coating is performed in the coating device 1.

As shown in FIG. 6, when the first adjustment step S1 is started, the discharge control parameter adjustment section 915 first sets the discharge control parameter to a predetermined initial value (step S11). The initial value may be any value or may be a value set based on a predetermined algorithm. The discharge control parameter adjustment section 915 causes the storage section 93 to store the set discharge control parameters. Note that the ejection control parameter adjustment unit 915 may accept an input of an initial value from the user, and may store the accepted initial value in the storage unit 93.

After the discharge control parameters are set in step S11, the control unit 9 performs pseudo application and acquires a pressure waveform (step S12). Specifically, the control unit 9 moves the nozzle 71 to a predetermined maintenance position (a position facing the roller 721). Then, the control unit 9 controls the pump 81 according to the control parameters set in the first adjustment step S1, and causes the nozzle 71 to discharge the processing liquid to the roller 721. Further, while the pseudo coating is being performed, the discharge pressure measurement unit 911 samples the discharge pressure measured by the pressure gauge 86 and acquires pressure waveform data. The pressure waveform acquired in step S12 is an example of a "first pressure waveform."

After the pressure waveform of the pseudo application is acquired in step S12, the pressure waveform is evaluated (step S13). As an example of an evaluation method, the discharge control parameter adjustment unit 915 determines whether the pressure waveform acquired in step S12 is the same as the first ideal waveform Wt1 (see FIG. 9), which is the ideal pressure waveform. Specifically, it is determined whether the amount of deviation of the pressure waveform acquired in step S12 from the first ideal waveform Wt1 exceeds a predetermined allowable range.

Note that in step S13, the user may evaluate the pressure waveform. In this case, the discharge control parameter adjustment section 915 may display the pressure waveform and the first ideal waveform Wt1 on the display. Further, the discharge control parameter adjustment section 915 may display the amount of deviation on a display. In this way, by displaying various information on the display, it is possible to appropriately support the user's evaluation. Further, the ejection control parameter adjustment unit 915 may receive an input of an evaluation result from a user using an input device, and may cause the storage unit 93 to store the input evaluation result.

If the pressure waveform of the pseudo coating is evaluated to be the same as the first ideal waveform Wt1 in step S13 (for example, if the amount of deviation is within the allowable range; Yes in step S13), the coating device 1 performs the first adjustment. Step S1 is ended. On the other hand, if it is evaluated in step S13 that the pressure waveform of the pseudo coating is different from the first ideal waveform Wt1 (for example, if the amount of deviation exceeds the allowable range; if No in step S13), the coating device 1 The control parameters are updated (step S14). Specifically, the discharge control parameter adjustment unit 915 stores in the storage unit 93 based on the evaluation result in step S13 so that the pressure waveform when performing the pseudo application becomes the first ideal waveform Wt1. Update discharge control parameters. The algorithm for updating the discharge control parameters may be arbitrarily selected, such as Bayesian optimization, genetic algorithm, gradient method, or linear programming.

Note that the discharge control parameters may be updated using a learned model that has learned the relationship between the amount of change in the discharge control parameters and the amount of deviation, as described in Patent Document 1. A neural network can be used as a learning model.

Further, in step S14, the user may be able to update the ejection control parameters. In this case, the ejection control parameter adjustment section 915 may receive input of a new ejection control parameter using an input device, and may cause the storage section 93 to store the received ejection control parameter.

As described above, in the first adjustment step S1, the discharge control parameters for actual application are adjusted based on the pressure waveform obtained in the pseudo application in step S12. Therefore, consumption of the substrate S can be suppressed more than when adjusting the ejection control parameters during actual coating.

<Second adjustment step S2>
FIG. 7 is a flowchart showing details of the second adjustment step S2 shown in FIG. The second adjustment step S2 is a step in which movement control parameters are adjusted in advance by pseudo movement before actual coating is performed in the coating device 1.

As shown in FIG. 7, when the second adjustment step S2 is started, the movement control parameter adjustment unit 917 first sets the movement control parameter to a predetermined initial value (step S21). The initial value may be any value or may be a value set based on a predetermined algorithm. The movement control parameter adjustment section 917 causes the storage section 93 to store the set movement control parameters. Note that the movement control parameter adjustment unit 917 may accept an input of an initial value from the user and store the accepted initial value in the storage unit 93.

After the movement control parameters are set in step S21, the control unit 9 executes pseudo movement and acquires a speed waveform (step S22). Specifically, the movement control unit 912 moves the chuck mechanism 51 holding the substrate S by controlling the suction/travel mechanism 52 according to movement control parameters. Further, while the pseudo movement is being performed, the speed measuring unit 913 samples the moving speed of the chuck mechanism 51 based on the output of the suction/traveling mechanism 52, and acquires speed waveform data.

After the speed waveform of the pseudo movement is acquired in step S22, the speed waveform is evaluated (step S23). As an example of an evaluation method, the movement control parameter adjustment unit 917 evaluates whether the shape of the velocity waveform is the same as the shape of the pressure waveform adjusted in step S11. Note that when comparing the shape of the velocity waveform and the shape of the pressure waveform, normalization is performed to match the scale of the velocity in the velocity waveform and the scale of the pressure waveform pressure. Then, it is determined whether the amount of deviation of the velocity waveform from the pressure waveform exceeds a predetermined tolerance range.

Note that a regression parameter obtained by regressing the velocity waveform and the pressure waveform using a predetermined function may be derived as an evaluation value, and it may be determined whether the shapes match based on the evaluation value.

Furthermore, in step S23, the user may evaluate the velocity waveform. In this case, the movement control parameter adjustment section 917 may display the normalized velocity waveform and pressure waveform on the display. Furthermore, the movement control parameter adjustment unit 917 may display the amount of deviation on a display. In this way, by displaying various information on the display, it is possible to appropriately support the user's evaluation. Further, the movement control parameter adjustment unit 917 may receive an input of an evaluation result from a user using an input device, and may store the input evaluation result in the storage unit 93.

If it is evaluated in step S23 that the speed waveform of the pseudo movement is the same as the shape of the pressure waveform (for example, if the amount of deviation is within the allowable range; Yes in step S23), the coating device 1 performs the second adjustment process. End S2. On the other hand, if it is evaluated in step S23 that the speed waveform of the pseudo movement is different from the shape of the pressure waveform (for example, if the amount of deviation exceeds the allowable range; No in step S23), the coating device 1 changes the movement control parameter. Update (step S24). Specifically, the movement control parameter adjustment unit 917 updates the movement control parameters stored in the storage unit 93 so that the shape of the movement waveform when pseudo movement is performed becomes a pressure waveform. As the algorithm for updating the movement control parameters, for example, Bayesian optimization, genetic algorithm, gradient method, linear programming, etc. can be arbitrarily selected.

Further, the discharge control parameter may be updated using a learned model that has learned the relationship between the amount of change in the movement control parameter and the amount of deviation. A neural network can be used as a learning model.

Further, in step S24, the user may be able to update the movement control parameters. In this case, the movement control parameter adjustment unit 917 may receive input of new movement control parameters from the user using the input device, and may also store the received movement control parameters in the storage unit 93.

As described above, in the second adjustment step S2, the movement control parameters are adjusted so that the shape of the velocity waveform matches the shape of the pressure waveform. By performing actual coating according to the movement control parameters adjusted in this way, it becomes possible to apply the treatment liquid to the substrate S with a uniform thickness.

<Third adjustment step S3>
FIG. 8 is a flowchart showing details of the third adjustment step S3 shown in FIG. The third adjustment step S3 is a step in which the discharge control parameters adjusted in the first adjustment step S1 are readjusted based on the pressure waveform obtained in the pseudo application when actual application is performed in the application device 1.

When the third adjustment step S3 is started, the coating device 1 performs actual application according to the discharge control parameters adjusted in the first adjustment step S1 and the movement control parameters adjusted in the second adjustment step S2. At the same time, a pressure waveform is acquired (step S31). Specifically, the coating mechanism 7 moves the nozzle 71 to the coating position. The movement control section 912 moves the substrate S by controlling the suction/travel mechanism 52 according to the movement control parameters, and the discharge control section 910 controls the pump 81 according to the discharge control parameters. A processing liquid is discharged onto the substrate S from the nozzle 71. Further, while the actual coating is being performed, the discharge pressure measurement unit 911 acquires a pressure waveform by sampling the discharge pressure measured by the pressure gauge 86. The pressure waveform acquired in step S31 is an example of a "second pressure waveform."

After the pressure waveform of actual application is acquired in step S31, the pressure waveform is evaluated (step S32). The pressure waveform evaluation method in step S32 may be the same as the pressure waveform evaluation method in step S13 shown in FIG. That is, the discharge control parameter adjustment unit 915 may determine whether the amount of deviation of the pressure waveform acquired in step S31 from the first ideal waveform Wt1 exceeds a predetermined tolerance range.

Note that in step S32, the user may evaluate the pressure waveform of actual application. In this case, the discharge control parameter adjustment section 915 may display the pressure waveform and the first ideal waveform Wt1 on the display. Further, the discharge control parameter adjustment section 915 may display the amount of deviation on a display. In this way, by displaying various information on the display, it is possible to appropriately support the user's evaluation. Further, the ejection control parameter adjustment unit 915 may receive an input of an evaluation result from a user using an input device, and may cause the storage unit 93 to store the input evaluation result.

If the pressure waveform of the actual coating is evaluated to be the same as the first ideal waveform in step S32 (for example, if the amount of deviation is within the allowable range; Yes in step S32), the coating device 1 performs the third adjustment. Step S3 is ended. On the other hand, if it is evaluated in step S32 that the pressure waveform of actual application is different from the first ideal waveform Wt1 (for example, if the amount of deviation exceeds the allowable range; No in step S32), the control unit 9 controls the discharge control. It is determined that the parameters need to be readjusted, and the discharge control parameters are readjusted.

In readjusting the discharge control parameters, the discharge control parameter adjustment section 915 updates the discharge control parameters (step S33). Specifically, the discharge control parameter adjustment section 915 adjusts the discharge stored in the storage section 93 so that the pressure waveform when pseudo application is performed becomes a second ideal waveform Wt2 (see FIG. 6), which will be described later. Update control parameters. As an algorithm for updating the discharge control parameters, for example, Bayesian optimization, genetic algorithm, gradient method, linear programming, etc. can be arbitrarily selected.

Note that the discharge control parameters may be updated using a learned model that has learned the relationship between the amount of change in the discharge control parameters and the amount of deviation, as described in Patent Document 1. A neural network can be used as a learning model.

Further, in step S33, the user may be allowed to update the ejection control parameters. In this case, the ejection control parameter adjustment unit 915 may receive input of new ejection control parameters from the user using an input device, and may store the received ejection control parameters in the storage unit 93.

FIG. 9 is a diagram showing an example of setting the second ideal waveform Wt2. The second ideal waveform Wt2 is generated by, for example, the ejection control parameter adjustment section 915 and stored in the storage section 93. The second ideal waveform Wt2 has a different shape from the first ideal waveform Wt1. Specifically, the second ideal waveform Wt2 is obtained by transforming the first ideal waveform Wt1 based on the difference value (deviation amount) between the actual application pressure waveform Wr1 acquired in step S31 and the first ideal waveform Wt1. It has a similar shape. More specifically, the second ideal waveform Wt2 has a shape obtained by subtracting the difference value from the first ideal waveform Wt1. Note that the shape of the second ideal waveform Wt2 is not limited to the shape shown in FIG. 9, and may be set as appropriate.

Returning to FIG. 8, after the ejection control parameters are updated in step S33, the coating device 1 performs pseudo coating according to the updated ejection control parameters (step S34). When the nozzle 71 is at the coating position above the coating stage 32, the coating mechanism 7 moves the nozzle 71 to the maintenance position. Then, the processing liquid is discharged from the nozzle 71 to the rotating roller 721 . While the pseudo coating is being performed, the discharge pressure measurement unit 911 acquires a pressure waveform by sampling the discharge pressure measured by the pressure gauge 86. The pressure waveform acquired in step S34 is an example of a "third pressure waveform."

After the pressure waveform of the pseudo application is acquired in step S34, the pressure waveform is evaluated (step S35). The pressure waveform evaluation method may be the same as the pressure waveform evaluation method in step S13 shown in FIG. However, in step S35, the second ideal waveform Wt2 is used instead of the first ideal waveform Wt1. Specifically, the discharge control parameter adjustment unit 915 may determine whether the amount of deviation of the pressure waveform acquired in step S34 from the second ideal waveform Wt2 exceeds a predetermined tolerance range. .

Note that in step S35, the user may evaluate the pressure waveform. In this case, in step S6, the discharge control parameter adjustment section 915 may display the pressure waveform and the second ideal waveform Wt2 on the display. Further, the discharge control parameter adjustment section 915 may display the amount of deviation on a display. In this way, by displaying various information on the display, it is possible to appropriately support the user's evaluation. Further, the ejection control parameter adjustment unit 915 may receive an input of an evaluation result from a user using an input device, and may cause the storage unit 93 to store the input evaluation result.

If it is evaluated in step S35 that the pressure waveform of the pseudo coating is different from the second ideal waveform Wt2 (for example, if the amount of deviation exceeds the allowable range; No in step S35), the coating device 1 returns to step S33 (discharge control update parameters). On the other hand, if the pressure waveform of the pseudo coating is evaluated to be the same as the second ideal waveform Wt2 in step S35 (for example, if the amount of deviation is within the allowable range; Yes in step S35), the coating device 1 returns to step S31. (Acquisition of pressure waveform of actual application). In this way, the coating device 1 readjusts the discharge control parameters by repeatedly performing steps S33 to S35 until the pressure waveform obtained by the pseudo coating is evaluated to be the same as the second ideal waveform Wt2.

As described above, in the third adjustment step S3, if the pressure waveform of actual application is evaluated as not being an ideal waveform in step S32, the discharge control parameters are adjusted based on the pressure waveform obtained in the pseudo application in step S34. Readjusted. Thereby, the ejection control parameters can be readjusted while suppressing the consumption of the substrate S. By suppressing the consumption of the substrate S, the environmental load can be reduced.

Since the environmental conditions are different between the simulated application and the actual application, the obtained pressure waveform may change even if the discharge control parameters are the same. In the present embodiment, the second ideal waveform Wt2, which serves as a reference for evaluating the pressure waveform of the pseudo application, is modified by changing the first ideal waveform Wt1 according to the difference value between the pressure waveform Wr1 of the actual application and the first ideal waveform Wt1. It is shaped like this. Therefore, the discharge control parameters can be appropriately readjusted so that the pressure waveform of actual application becomes the first ideal waveform Wt1.

<Fourth adjustment step S4>
FIG. 10 is a flowchart showing details of the fourth adjustment step S4 shown in FIG. The fourth adjustment step S4 is a step in which the discharge control parameters adjusted in the third adjustment step S3 are readjusted based on the pressure waveform obtained in the actual application while performing actual application in the coating device 1.

When the fourth adjustment step S4 is started, the coating device 1 performs actual coating according to the discharge control parameters adjusted in the third adjustment step S3 and the movement control parameters adjusted in the second adjustment step S2. , a pressure waveform is acquired (step S41). The pressure waveform obtained in actual application using the discharge control parameters adjusted in the third adjustment step S3 is an example of a "fourth pressure waveform."

After the pressure waveform of actual application is acquired in step S41, the pressure waveform is evaluated (step S42). As an example of an evaluation method, the discharge control parameter adjustment unit 915 determines whether the actual application pressure waveform acquired in step S41 is the same as the first ideal waveform Wt1. More specifically, it is determined whether the amount of deviation of the actual application pressure waveform from the first ideal waveform Wt1 exceeds an allowable range.

Note that in step S42, the user may evaluate the pressure waveform. In this case, the discharge control parameter adjustment section 915 may display the pressure waveform and the first ideal waveform Wt1 on the display. Further, the discharge control parameter adjustment section 915 may display the amount of deviation on a display. In this way, by displaying various information on the display, it is possible to appropriately support the user's evaluation. Further, the discharge control parameter adjustment section 915 may receive an input of an evaluation result from a user using an input device, and may also store the input evaluation result in the storage section 93.

If it is evaluated in step S42 that the pressure waveform of actual application is different from the first ideal waveform Wt1 (for example, if the amount of deviation exceeds the allowable range; No in step S42), the discharge control parameter adjustment unit 915 adjusts the discharge control parameter is updated (step S43). Specifically, the discharge control parameter adjustment unit 915 updates the discharge control parameters stored in the storage unit 93 so that the pressure waveform of actual application becomes the first ideal waveform Wt1 based on the evaluation result of step S42. do. As an algorithm for updating the discharge control parameters, for example, Bayesian optimization, genetic algorithm, gradient method, linear programming, etc. can be arbitrarily selected.

Further, the discharge control parameters can also be updated using a learned model that has learned the relationship between the amount of change in the discharge control parameters and the amount of deviation, as described in Patent Document 1, for example. A neural network can be used as a learning model.

When the discharge control parameters are updated in step S43, the coating device 1 again executes step S41 (obtaining pressure waveform by actual coating). The pressure waveform of actual application obtained using the updated discharge control parameters is an example of the "fifth pressure waveform."

If it is evaluated in step S42 that the pressure waveform of the actual application is the same as the first ideal waveform Wt1 (for example, if the amount of deviation is within the allowable range; Yes in step S42), the application device 1 performs the actual application. It is determined whether or not to end (step S43). If it is determined in step S43 that the actual coating is to be finished (for example, if there is no substrate S to be coated; Yes in step S43), the coating apparatus 1 finishes the fourth adjustment step S4. If it is determined in step S43 that actual coating is to be continued (for example, if there is a substrate S to be coated; No in step S43), the coating apparatus 1 performs step S41 again.

As described above, in the first adjustment step S1 and the third adjustment step S3, the discharge control parameters are updated based on the pressure waveform obtained in the simulated coating, so the discharge control parameters are sufficiently adjusted to match the actual coating. There may be cases where it is not possible to do so. On the other hand, in the fourth adjustment step S4, the discharge control parameters are updated based on the pressure waveform obtained in actual application. Therefore, the discharge control parameters can be adjusted to suit actual application. Therefore, an ideal pressure waveform can be reproduced in actual application.

Furthermore, if an attempt is made to adjust the discharge control parameters only in the fourth adjustment step S4 without performing the first adjustment step S1 and the third adjustment step S3, there is a risk that a large amount of substrates will be consumed and the environmental load will increase. There is. In this embodiment, the ejection control parameters are first adjusted to some extent in the first adjustment step S1 and the third adjustment step S3, and then the fourth adjustment step S4 is performed, so that the consumption of the substrate S can be suppressed. This allows the environmental load to be reduced.

<2. Modified example>
Although the embodiments have been described above, the present invention is not limited to the above, and various modifications are possible.

For example, in the embodiment described above, the pseudo coating is performed by discharging the coating liquid onto the roller 721. However, the coating liquid may be discharged to a location other than the roller 721. For example, the coating liquid may be discharged into a container such as the roller vat 723 that can receive the coating liquid discharged from the nozzle 71.

Although this invention has been described in detail, the above description is illustrative in all aspects, and the invention is not limited thereto. It is understood that countless variations not illustrated can be envisaged without departing from the scope of the invention. The configurations described in each of the above embodiments and modified examples can be appropriately combined or omitted as long as they do not contradict each other.

1 Coating device 5 Moving mechanism 7 Coating mechanism 8 Processing liquid supply mechanism 9 Control unit 51 Chuck mechanism 52 Adsorption/travel mechanism 71 Nozzle 81 Pump 83 Processing liquid replenishment unit 86 Pressure gauge 910 Discharge control section 911 Discharge pressure measurement section 912 Movement control section 913 Speed measurement section 915 Discharge control parameter adjustment section 917 Movement control parameter adjustment section 931 Program M Recording medium S Substrate

Claims (5)

A control parameter adjustment method for adjusting a discharge control parameter for controlling discharge of a processing liquid from a nozzle, the method comprising:
a) adjusting the ejection control parameter based on a first pressure waveform indicating a pressure change in the nozzle when performing a pseudo application in which the processing liquid is ejected from the nozzle to a location other than the substrate;
b) Obtaining a second pressure waveform indicating a pressure change within the nozzle when actual coating is performed in which the treatment liquid is discharged onto the substrate from the nozzle according to the discharge control parameters adjusted in step a). process and
c) determining whether to readjust the discharge control parameters based on the second pressure waveform;
d) If it is determined to readjust in step c), readjusting the discharge control parameter based on a third pressure waveform indicating a pressure change in the nozzle when the pseudo application is performed;
e) obtaining a fourth pressure waveform indicating a pressure change in the nozzle when the actual application is performed according to the discharge control parameters readjusted in step d);
f) determining whether to readjust the discharge control parameter based on the fourth pressure waveform;
g) If it is determined to readjust in step f), readjusting the discharge control parameter based on a fifth pressure waveform indicating a change in pressure inside the nozzle when the actual application is performed;
Control parameter adjustment methods, including: The control parameter adjustment method according to claim 1,
h) adjusting movement control parameters for controlling relative movement of the substrate with respect to the nozzle;
further including;
In the actual coating, the processing liquid is discharged from the nozzle onto the substrate while moving the substrate relative to the nozzle according to the movement control parameter adjusted in step h). The control parameter adjustment method according to claim 1 or 2,
In the step h), the movement control parameter is adjusted based on a velocity waveform indicating a change in relative velocity of the substrate with respect to the nozzle. A program executable by a computer,
A program that causes the computer to execute the control parameter adjustment method according to claim 1 or 2. A computer readable recording medium,
A recording medium on which the program according to claim 4 is recorded.

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