KR20240013041A - Control parameter adjustment method, program and recording medium - Google Patents

Abstract

(Problem) Provide a technology that can appropriately adjust discharge control parameters according to the environment in which processing liquid is actually discharged onto a substrate while suppressing substrate consumption.
(Solution) In the first adjustment process (S1), the discharge control parameter is adjusted based on the first pressure waveform when pseudo application is performed. In the third adjustment process (S3), it is determined whether to readjust the discharge control parameter based on the second pressure waveform when actual application is performed according to the discharge control parameter adjusted in the first adjustment process (S1), In the case of readjustment, the discharge control parameters are readjusted based on the third pressure waveform when pseudo application was performed. In the fourth adjustment step (S4), it is determined whether to readjust the discharge control parameter based on the fourth pressure waveform when actual application is performed according to the discharge control parameter readjusted in the third adjustment step (S3), In the case of readjustment, the discharge control parameters are readjusted based on the fifth pressure waveform when actual application was performed.

Description

Control parameter adjustment method, program and recording medium {CONTROL PARAMETER ADJUSTMENT METHOD, PROGRAM AND RECORDING MEDIUM}

The subject matter disclosed in this specification relates to control parameter adjustment methods, programs, and recording media.

In the manufacturing process of a flat panel display (FPD), a substrate processing device called a coater is sometimes used. The coater scans the nozzle with respect to the substrate while discharging a processing liquid, such as a resist liquid, from the nozzle onto the substrate, such as glass. The coater applies pressure to the processing liquid, such as a resist liquid, and discharges the processing liquid from the nozzle. Additionally, when the moving mechanism moves the substrate relative to the nozzle, a coating film of the processing liquid is formed on the surface of the substrate.

In this type of substrate processing apparatus, it is sometimes required to make the film thickness of the coating film uniform across the entire substrate. In order to make the film thickness uniform, the discharge control parameters are appropriately adjusted. In this adjustment work, for example, a technician adjusts a plurality of discharge control parameters while visually checking the waveform of the discharge pressure. For this reason, the adjustment work largely depends on the technician's knowledge and experience. Therefore, adjustment of discharge control parameters requires a lot of time and effort from technicians. Additionally, there is a risk of consuming a large amount of processing liquid or substrate. For this reason, techniques for efficiently adjusting control parameters have been proposed to this day.

For example, in Patent Document 1, a simulated discharge process for discharging a processing liquid other than a substrate, a discharge characteristics measurement process for measuring the discharge characteristics of the processing liquid in the simulated discharge process, and the measured discharge characteristics are target characteristics. It describes a substrate processing method having a state quantity derivation process for deriving the state quantity of a deviation from , and a learning process for building a learning model by machine learning the change in the state quantity accompanying a change in the parameter. In this substrate processing method, while the state quantity exceeds a predetermined allowable range, the parameters are changed based on the learning model, and then the pseudo discharge process, discharge characteristic measurement process, state quantity derivation process, and learning process are repeatedly executed. , If the state quantity falls within the allowable range, the last changed parameter is set as the parameter when discharging the processing liquid in the processing liquid supply process.

Japanese Patent Publication No. 2020-040046

In Patent Document 1, since the discharge control parameters are adjusted based on simulated discharge, it is possible to suppress consumption of the substrate. However, in the case of pseudo discharge, various conditions such as the environment around the nozzle are different from those in which the processing liquid is actually discharged onto the substrate. For this reason, when discharge control parameters adjusted by pseudo discharge are used, it may be difficult to reproduce an ideal pressure waveform when actually applying the processing liquid to the substrate.

The purpose of the present invention is to provide a technology that can appropriately adjust discharge control parameters according to the environment in which processing liquid is actually discharged to a substrate while suppressing substrate consumption.

In order to solve the above problem, the first aspect is a control parameter adjustment method for adjusting a discharge control parameter for controlling the discharge of a processing liquid from a nozzle, comprising: a) a pseudo-discharge method of discharging the processing liquid from the nozzle to a point other than the substrate; a step of adjusting the discharge control parameter based on a first pressure waveform representing a change in pressure within the nozzle when application is performed; b) adjusting the discharge control parameter of the nozzle according to the discharge control parameter adjusted by step a); a process of acquiring a second pressure waveform representing a change in pressure within the nozzle when actual application of discharging a processing liquid onto a substrate is performed; and c) readjusting the discharge control parameter based on the second pressure waveform. a step of determining whether or not to readjust, and d) when it is determined to readjust by the step c), readjusting the discharge control parameter based on a third pressure waveform representing a change in pressure within the nozzle when the pseudo application is performed. a process; e) a process of acquiring a fourth pressure waveform indicating a change in pressure within the nozzle when the actual application is performed according to the discharge control parameter readjusted by the process d); and f) the fourth pressure. a step of determining whether to readjust the discharge control parameter based on the waveform; g) when it is determined to readjust by the step f), a fifth pressure representing a change in pressure within the nozzle when the actual application is performed; and a process of readjusting the discharge control parameters based on the waveform.

The second aspect is the control parameter adjustment method of the first aspect, further comprising the step of h) adjusting a movement control parameter for controlling the relative movement of the substrate with respect to the nozzle, wherein the actual application includes the process h) The processing liquid is discharged from the nozzle to the substrate while moving the substrate relative to the nozzle according to the movement control parameter adjusted by.

A third aspect is the control parameter adjustment method of the first aspect or the second aspect, wherein the step h) includes adjusting the movement control parameter based on a speed waveform representing a change in the relative speed of the substrate with respect to the nozzle. do.

The fourth aspect is a computer-executable program that causes the computer to execute the control parameter adjustment method of the first aspect or the second aspect.

The fifth aspect is a computer-readable recording medium on which the program of the fourth aspect is recorded.

According to the control parameter adjustment method of the first to fourth aspects, consumption of the substrate can be suppressed by adjusting and readjusting the discharge control parameter based on the pressure waveform obtained by pseudo application. Additionally, the discharge control parameters adjusted based on the pressure waveform obtained by simulated application can be readjusted based on the fifth pressure waveform obtained by actual application, so that the discharge control parameter can be adjusted to suit actual application.

According to the control parameter adjustment method of the second aspect, application to the substrate can be appropriately performed by adjusting the movement control parameter.

According to the control parameter adjustment method of the third aspect, the movement control parameters can be appropriately adjusted based on the speed waveform.

1 is a diagram schematically showing the overall configuration of the coating device according to the embodiment.
FIG. 2 is a diagram showing the configuration of a processing liquid supply mechanism.
FIG. 3 is a graph showing the movement pattern of the operating disk portion of the pump shown in FIG. 2.
Fig. 4 is a block diagram showing a configuration example of a control unit.
Fig. 5 is a diagram showing a flow in which a control unit adjusts control parameters.
FIG. 6 is a flowchart showing details of the first adjustment process shown in FIG. 5.
FIG. 7 is a flowchart showing details of the second adjustment process shown in FIG. 5.
FIG. 8 is a flowchart showing details of the third adjustment process shown in FIG. 5.
Fig. 9 is a diagram showing a setting example of the second abnormal waveform.
FIG. 10 is a flowchart showing details of the fourth adjustment process shown in FIG. 5.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention will be described with reference to the attached drawings. In addition, the components described in this embodiment are merely examples and are not intended to limit the scope of the present invention to these only. In the drawings, for ease of understanding, the dimensions or number of each part may be exaggerated or simplified as necessary.

<1. Embodiment>

1 is a diagram schematically showing the overall configuration of the coating device 1 according to the embodiment. The coating device 1 is a substrate processing device that applies a processing liquid to the upper surface Sf of the substrate S. The substrate S is, for example, a glass substrate for a liquid crystal display device. Additionally, the substrate (S) may be a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a plasma display, a glass or ceramic substrate for a magnetic/optical disk, a glass substrate for organic EL, a glass substrate or silicon substrate for a solar cell, etc. It may be a variety of substrates to be processed for electronic devices, such as flexible substrates and printed circuit boards. The coating device 1 is, for example, a slit coater.

In FIG. 1, in order to explain the arrangement relationship of each element of the coating device 1, an XYZ coordinate system is defined. The direction of movement of the substrate S is “X direction.” In the Additionally, the direction perpendicular to the X direction is the Y direction, and the direction perpendicular to the X and Y directions is the Z direction. In the following description, the Z direction is taken as the vertical direction, and the X and Y directions are taken as the horizontal directions. In the Z direction, the +Z direction is referred to as the upward direction, and the -Z direction is referred to as the downward direction.

The applicator 1 includes, in order in the +X direction, an input conveyor 100, an input transfer part 2, a floating stage part 3, and an output transfer part 4. , and is equipped with an output conveyor (110). The input conveyor 100, the input transfer part 2, the floating stage part 3, the output transfer part 4, and the output conveyor 110 constitute a movement path through which the substrate S passes. . In addition, the applicator 1 further includes a moving mechanism 5, an applicator 7, a treatment liquid supply mechanism 8, and a control unit 9.

The substrate S is conveyed to the input conveyor 100 from the upstream side. The input conveyor 100 is provided with a roller conveyor 101 and a rotation drive mechanism 102. The rotation drive mechanism 102 rotates each roller of the roller conveyor 101. By rotation of each roller of the roller conveyor 101, the substrate S is conveyed downstream (+X direction) in a horizontal position. “Horizontal posture” refers to a state in which the main surface (the surface with the largest area) of the substrate S is parallel to the horizontal plane (XY plane).

The input transfer part 2 is provided with a roller conveyor 21 and a rotation/elevation drive mechanism 22. The rotation/elevation drive mechanism 22 rotates each roller of the roller conveyor 21 and raises and lowers the roller conveyor 21. By rotation of the roller conveyor 21, the substrate S is conveyed downstream (+X direction) in a horizontal position. Additionally, the position of the substrate S in the Z direction changes as the roller conveyor 21 moves up and down. The substrate S is transferred from the input conveyor 100 to the floating stage unit 3 through the input transfer unit 2.

As shown in FIG. 1, the floating stage portion 3 is substantially flat. The floating stage portion 3 is divided into three along the X direction. The floating stage unit 3 is provided with an inlet floating stage 31, an application stage 32, and an outlet floating stage 33 in that order toward the +X direction. The upper surface of the inlet floating stage 31, the upper surface of the application stage 32, and the upper surface of the outlet floating stage 33 are on the same plane. The levitation stage unit 3 is further equipped with a lift pin drive mechanism 34, a levitation control mechanism 35, and an elevation drive mechanism 36. A plurality of lift pins are arranged on the entrance floating stage 31. The lift pin driving mechanism 34 raises and lowers a plurality of lift pins. The floating control mechanism 35 supplies compressed air for floating the substrate S to the inlet floating stage 31, the application stage 32, and the outlet floating stage 33. The lifting/lowering drive mechanism 36 raises/lowers the exit floating stage 33.

On the upper surface of the inlet floating stage 31 and the upper surface of the outlet floating stage 33, a plurality of blowing holes for blowing out compressed air supplied from the floating control mechanism 35 are arranged in a matrix. When compressed air is blown out from each blowing hole, the substrate S floats upward with respect to the floating stage part 3. Then, the lower surface Sb of the substrate S is separated from the upper surface of the floating stage portion 3 and is supported in a horizontal position. The distance (floating amount) between the lower surface Sb of the substrate S and the upper surface of the floating stage portion 3 when the substrate S is in a floating state is preferably 10 μm or more. The distance is preferably 500 μm or less.

On the upper surface of the application stage 32, blowing holes for blowing out compressed air supplied from the levitation control mechanism 35 and suction holes for sucking in gas are alternately arranged in the X and Y directions. The levitation control mechanism 35 controls the blowing amount of compressed air from the blowing hole and the suction amount of air from the suction hole. As a result, the amount of floating of the substrate S relative to the application stage 32 is precisely adjusted so that the position in the Z direction of the upper surface Sf of the substrate S passing above the application stage 32 is a specified value. It is controlled. In addition, the floating amount of the substrate S with respect to the application stage 32 is calculated by the control unit 9 based on the detection result of the sensor 61 or sensor 62 described later. In addition, the amount of floating of the substrate S on the application stage 32 can preferably be adjusted with high precision by airflow control.

The substrate S loaded into the floating stage unit 3 is given a driving force in the +X direction from the roller conveyor 21 and is conveyed on the entrance floating stage 31. The entrance floating stage 31, the application stage 32, and the exit floating stage 33 support the substrate S in a floating state. As the floating stage portion 3, for example, the configuration described in Japanese Patent No. 5346643 may be adopted.

The moving mechanism 5 is arranged below the floating stage portion 3. The moving mechanism 5 includes a chuck mechanism 51 and an adsorption/traveling mechanism 52. The chuck mechanism 51 is provided with a suction pad (not shown) formed on a suction member. The chuck mechanism 51 supports the substrate S from below with the suction pad in contact with the peripheral portion of the lower surface Sb of the substrate S. The suction/travel mechanism 52 causes the substrate S to be adsorbed to the suction pad by applying negative pressure to the suction pad. Additionally, the suction/travel mechanism 52 causes the chuck mechanism 51 to reciprocate in the X direction.

The chuck mechanism 51 holds the substrate S in a state in which the lower surface Sb of the substrate S is positioned at a higher position than the upper surface of the floating stage portion 3. With the peripheral portion of the substrate S held by the chuck mechanism 51, the substrate S maintains a horizontal posture due to the buoyancy applied from the floating stage portion 3.

As shown in FIG. 1, the coating device 1 is equipped with a sensor 61 for measuring plate thickness. The sensor 61 is arranged near the roller conveyor 21. The sensor 61 detects the position of the upper surface Sf of the substrate S held by the chuck mechanism 51 in the Z direction. In addition, by placing a chuck (not shown) in a state not holding the substrate S directly below the sensor 61, the sensor 61 is positioned in the vertical direction Z of the adsorption surface, which is the upper surface of the adsorption member. can be detected.

The chuck mechanism 51 moves in the +X direction while holding the substrate S loaded into the floating stage portion 3. Thereby, the board|substrate S is conveyed from above the entrance floating stage 31 via the upper part of the application|coating stage 32, and above the exit floating stage 33. Then, the substrate S is moved from the exit floating stage 33 to the output transfer unit 4.

The output transfer unit 4 moves the substrate S from a position above the exit floating stage 33 to the output conveyor 110. The output transfer unit 4 is provided with a roller conveyor 41 and a rotation/elevation drive mechanism 42. The rotation/elevation drive mechanism 42 rotates the roller conveyor 41 and elevates the roller conveyor 41 along the Z direction. As each roller of the roller conveyor 41 rotates, the substrate S moves in the +X direction. Additionally, as the roller conveyor 41 moves up and down, the substrate S is displaced in the Z direction.

The output conveyor 110 is provided with a roller conveyor 111 and a rotation drive mechanism 112. The output conveyor 110 conveys the substrate S in the +X direction by rotating each roller of the roller conveyor 111, and sends the substrate S out of the coating device 1. Additionally, the input conveyor 100 and the output conveyor 110 are part of the coating device 1. However, the input conveyor 100 and the output conveyor 110 may be combined in a device different from the coating device 1.

The application mechanism 7 applies the treatment liquid to the upper surface Sf of the substrate S. The application mechanism 7 is disposed above the movement path of the substrate S. The application mechanism 7 has a nozzle 71. The nozzle 71 is a slit nozzle having a slit-shaped discharge port on its lower surface. The nozzle 71 is connected to a positioning mechanism (not shown). The positioning mechanism moves the nozzle 71 between the application position above the application stage 32 (position indicated by a solid line in FIG. 1) and a maintenance position described later. The processing liquid supply mechanism 8 is connected to the nozzle 71. When the processing liquid supply mechanism 8 supplies the processing liquid to the nozzle 71, the processing liquid is discharged from the discharge port disposed on the lower surface of the nozzle 71.

In the coating device 1, the processing liquid is applied to the substrate S by the movement mechanism 5 moving the substrate S relative to the nozzle 71 that discharges the processing liquid. However, the moving mechanism 5 may be configured to move the nozzle 71 with respect to the substrate S disposed at a certain position. Additionally, the moving mechanism 5 may be configured to move both the nozzle 71 and the substrate S. In this case, the direction of movement of the substrate S may be opposite to the direction of movement of the nozzle 71. Additionally, the moving direction of the substrate S may be the same as the moving direction of the nozzle 71. In this case, the moving mechanism 5 may transport the nozzle 71 and the substrate S so that the nozzle 71 follows the substrate S at a faster speed than the speed of the transported substrate S.

FIG. 2 is a diagram showing the configuration of the processing liquid supply mechanism 8. The processing liquid supply mechanism 8 includes a pump 81, a pipe 82, a processing liquid replenishment unit 83, a pipe 84, an opening/closing valve 85, a pressure gauge 86, and a driving unit. (87) is provided. The pump 81 is a supply source for supplying the processing liquid to the nozzle 71, and supplies the processing liquid by changing the volume. The pump 81 may be, for example, a bellows type pump described in Japanese Patent Application Publication No. Hei 10-61558. As shown in FIG. 2, the pump 81 has a flexible tube 811 that can elastically expand and contract freely in the radial direction. One end of the flexible tube 811 is connected to the processing liquid replenishment unit 83 through a pipe 82. The other end of the flexible tube 811 is connected to the nozzle 71 through a pipe 84.

The pump 81 has a bellows 812 that can be freely elastically deformed in the axial direction. The bellows 812 has a small bellows portion 813, a large bellows portion 814, a pump chamber 815, and an operating disk portion 816. The pump chamber 815 is located between the flexible tube 811 and the bellows 812. In the pump chamber 815, an incompressible medium is enclosed. The operating disk unit 816 is connected to the drive unit 87.

The processing liquid replenishment unit 83 has a storage tank 831 that stores the processing liquid. The storage tank 831 is connected to the pump 81 through a pipe 82. An opening/closing valve 833 is inserted into the pipe 82. The on-off valve 833 is opened and closed in accordance with a command from the control unit 9. When the on-off valve 833 is opened, the treatment liquid can be supplied from the storage tank 831 to the flexible tube 811 of the pump 81. Additionally, when the on-off valve 833 is closed, replenishment of the treatment liquid from the storage tank 831 to the flexible tube 811 of the pump 81 is regulated.

The pipe 84 is connected to the output side of the pump 81. The on-off valve 85 is inserted into the pipe 84. The on-off valve 85 is opened and closed in accordance with a command from the control unit 9. By opening and closing the on-off valve 85, the supply of the processing liquid to the nozzle 71 and the stop of the supply are switched. The pressure gauge 86 is disposed in the pipe 84. The pressure gauge 86 detects the pressure (discharge pressure) of the processing liquid supplied to the nozzle 71 and outputs a signal indicating the detected pressure value to the control unit 9.

FIG. 3 is a graph showing the movement pattern of the operating disk portion 816 of the pump 81 shown in FIG. 2. In FIG. 3, the horizontal axis represents time, and the vertical axis represents the moving speed of the operating disk unit 816. The drive unit 87 moves the operating disk unit 816 in a movement pattern (a pattern showing a change in the speed of the operating disk unit 816 over time) as shown in FIG. 3 in accordance with instructions from the control unit 9. ) is displaced in the axial direction. Due to the displacement of the actuating disk portion 816, the volume inside the bellows 812 changes. As a result, the flexible tube 811 expands and contracts in the radial direction to perform a pump operation, and the processing liquid supplied from the processing liquid replenishment unit 83 is supplied toward the nozzle 71. Since the movement pattern of the actuating disk unit 816 is closely related to the discharge characteristics of the processing liquid discharged from the nozzle 71, a pressure waveform showing the time change of the discharge pressure is obtained according to the movement pattern. Additionally, as the discharge pressure increases or decreases, the discharge amount (the amount of processing liquid discharged from the nozzle 71) increases or decreases.

In this embodiment, the processing liquid discharged from the nozzle 71 is adjusted by adjusting various parameters (acceleration time, steady speed, normal speed time, deceleration time, etc.) that define the movement of the operating disk unit 816. , optimization processing (adjustment processing) is appropriately performed to match or approximate the pressure waveform of the discharge pressure to the ideal waveform. This optimization process will be explained in detail later.

As shown in FIGS. 1 and 2 , a sensor 62 is disposed at the nozzle 71 through which the processing liquid is supplied from the processing liquid supply mechanism 8 . The sensor 62 detects the height of the substrate S in the Z direction without contact. The sensor 62 is connected to enable data communication with the control unit 9. Based on the detection result of the sensor 62, the control unit 9 measures the distance (separation distance) between the floating substrate S and the upper surface of the application stage 32. The control unit 9 adjusts the application position of the nozzle 71 by the positioning mechanism based on the separation distance measured by the sensor 62. Additionally, as the sensor 62, an optical sensor or an ultrasonic sensor can be employed.

The application mechanism 7 is equipped with a nozzle cleaning standby unit 72. The nozzle cleaning standby unit 72 performs predetermined maintenance on the nozzle 71 disposed at the maintenance position. The nozzle cleaning standby unit 72 has a roller 721, a cleaning unit 722, and a roller bat 723. The nozzle cleaning standby unit 72 cleans the nozzle 71 and forms a liquid puddle, thereby maintaining the discharge port of the nozzle 71 in a state suitable for application processing. In addition, in the coating device 1, in order to evaluate the discharge pressure applied to the processing liquid, the nozzle 71 is placed in the maintenance position (pseudo application position), that is, the discharge port of the nozzle 71 is positioned at the roller ( The processing liquid is discharged from the nozzle 71 onto the outer peripheral surface of the roller 721 in a state facing the outer peripheral surface of the roller 721. At this time, the roller 721 rotates, allowing the processing liquid discharged from the nozzle 71 to be applied to the moving surface. In other words, the coating applied to the moving substrate S can be simulated.

Discharging the processing liquid from the nozzle 71 onto the surface of the roller 721 is called “pseudo application,” in which the processing liquid is discharged from a point other than the substrate S. In addition, applying the processing liquid to the substrate S from the nozzle 71 is called “actual application.”

FIG. 4 is a block diagram showing a configuration example of the control unit 9. The control unit 9 controls the operation of each element of the applicator 1. The control unit 9 is a computer and includes an arithmetic unit 91, a storage unit 93, and a user interface 95. The calculation unit 91 is a processor comprised of a CPU (Central Processing Unit) or a GPU (Graphics Processing Unit). The storage unit 93 is comprised of a transient storage device such as RAM (Random Access Memory) and a non-transient auxiliary storage device such as a HDD (Hard Disk Drive) and an SSD (Solid State Drive).

The user interface 95 includes a display that displays information to the user, and an input device that accepts input operations by the user. As the control unit 9, for example, a desktop, laptop, or tablet type computer can be used.

The memory unit 93 stores the program 931. The program 931 is provided by the recording medium (M). That is, on the recording medium M, the program 931 is recorded so that it can be read by the control unit 9, which is a computer. The recording medium (M) is, for example, a USB (Universal Serial Bus) memory, an optical disk such as a DVD (Digital Versatile Disc), or a magnetic disk.

The calculation unit 91 executes the program 931 to control the discharge control unit 910, the discharge pressure measurement unit 911, the movement control unit 912, the speed measurement unit 913, the discharge control parameter adjustment unit 915, and the movement control unit. It functions as a parameter adjustment unit 917.

The discharge control unit 910 controls the operation (supply operation) of the pump 81 that supplies the processing liquid to the nozzle 71. The discharge control unit 910 controls the supply operation of the pump 81 according to preset discharge control parameters.

The discharge pressure measuring unit 911 measures a pressure waveform showing the time change in discharge pressure. That is, the discharge pressure measurement unit 911 periodically acquires the discharge pressure measured by the pressure gauge 86 at a predetermined sampling period. As a result, the discharge pressure applied to the processing liquid during the period in which the processing liquid is discharged from the nozzle 71 is acquired and stored in the storage unit 93 as data representing the pressure waveform (discharge data). Discharge data is data representing the relationship between a certain time and the discharge pressure measured at that time (that is, change in discharge pressure over time).

The movement control unit 912 controls the operation (movement operation) of the suction/travel mechanism 52 that moves the substrate S with respect to the nozzle 71 based on preset movement control parameters.

The speed measurement unit 913 measures the moving speed of the substrate S by the chuck mechanism 51 and the suction/travel mechanism 52. The speed measurement unit 913 measures the moving speed of the substrate S based on the output of the suction/travel mechanism 52 (for example, the output of the rotary encoder, etc.). The speed measurement unit 913 stores the acquired speed as speed data in the storage unit 93. Speed data is data that represents the relationship between a time and a moving speed measured at that time (that is, a change in moving speed over time).

The discharge control parameter adjustment unit 915 performs processing to optimize the discharge control parameters. The discharge control parameter adjustment unit 915 evaluates the pressure waveform obtained by, for example, performing pseudo application, and updates the discharge control parameter based on the evaluation result. The discharge control parameter adjustment unit 915 optimizes the discharge control parameters by repeating pseudo application and acquisition of the pressure waveform, evaluation of the pressure waveform, and update of the discharge control parameters.

In the coating device 1, in order to apply the processing liquid discharged from the nozzle 71 to the upper surface Sf of the substrate S with a uniform film thickness, the processing liquid is discharged when discharged from the nozzle 71. It is important to adjust the speed, that is, the discharge pressure. For this reason, discharge control parameters closely related to the pressure waveform are optimized so that the pressure waveform of the discharge pressure approaches an ideal waveform. Specifically, the discharge control parameters to be optimized are setting values that regulate the movement of the operating disk unit 816, and are setting values for controlling the 16 pumps shown in FIG. 3 and below.

·Normal speed (V1)

·Acceleration time (T1): Time to accelerate from stop to normal speed (V1)

·Normal speed time (T2): Time to continue normal speed (V1)

·Normal speed (V2)

·Deceleration time (T3): Time to decelerate from normal speed (V1) to normal speed (V2)

·Normal speed time (T4): Time to continue normal speed (V2)

·Normal speed (V3)

·Acceleration time (T5): Time to accelerate from normal speed (V2) to normal speed (V3)

·Normal speed time (T6): Time to continue normal speed (V3)

·Normal speed (V4)

·Deceleration time (T7): Time to decelerate from normal speed (V3) to normal speed (V4)

·Normal speed time (T8): Time to continue normal speed (V4)

·Normal speed (V5)

·Acceleration time (T9): Time to accelerate from normal speed (V4) to normal speed (V5)

·Normal speed time (T10): Time to continue normal speed (V5)

·Deceleration time (T11): Time to decelerate from normal speed (V5) to a stop state

The above 16 discharge control parameters correspond to control amounts for controlling the operation (supply operation) of the pump 81 that supplies the processing liquid to the nozzle 71. Additionally, the type and number of discharge control parameters are not particularly limited and can be set arbitrarily as long as it is a control amount that controls the supply operation of the pump 81.

The movement control parameter adjustment unit 917 adjusts the movement control parameters. The movement control parameter adjustment unit 917 updates the movement control parameters based on the pseudo movement. “Simulated movement” refers to simulated reproduction of the relative movement of the substrate S with respect to the nozzle 71 during actual coating. In pseudo movement, the processing liquid is not applied to the substrate S. For example, the pseudo movement of this embodiment means that the movement control unit 912 moves the chuck mechanism 51 by controlling the suction/travel mechanism 52 according to the movement control parameters. In addition, in this pseudo movement, the chuck mechanism 51 may actually hold the substrate S or may hold a simulative member other than the substrate S. Additionally, the chuck mechanism 51 does not need to hold anything.

The movement control parameter adjustment unit 917 evaluates the speed waveform obtained by the pseudo movement and updates the movement control parameters based on the evaluation result. Then, based on the updated movement control parameters, the pseudo movement is executed again. In this way, the movement control parameter adjustment unit 917 optimizes the movement control parameters by repeating acquisition of the pseudo movement and speed waveforms, evaluation of the speed waveforms, and updating of the movement control parameters.

<Adjustment of control parameters>

FIG. 5 is a diagram showing a flow in which the control unit 9 adjusts control parameters. As shown in FIG. 5 , adjustment of control parameters includes a first adjustment process (S1), a second adjustment process (S2), a third adjustment process (S3), and a fourth adjustment process (S4). Additionally, the control parameters are adjusted in the order of the first adjustment process (S1), the second adjustment process (S2), the third adjustment process (S3), and the fourth adjustment process (S4). Hereinafter, each process will be described.

<First adjustment process (S1)>

FIG. 6 is a flowchart showing details of the first adjustment process (S1) shown in FIG. 5. The first adjustment process (S1) is a process of adjusting the discharge control parameters in advance through simulated application when performing actual application with the application device 1.

As shown in FIG. 6 , when the first adjustment process (S1) is started, first, the discharge control parameter adjustment unit 915 sets the discharge control parameter to a predetermined initial value (step S11). The initial value may be an arbitrary value, or may be a value set based on a predetermined algorithm. The discharge control parameter adjustment unit 915 stores the set discharge control parameters in the storage unit 93. Additionally, the discharge control parameter adjustment unit 915 may accept an input of an initial value from the user and store the received initial value in the storage unit 93.

After the discharge control parameters are set in step S11, the control unit 9 performs pseudo application and acquires a pressure waveform (step S12). Specifically, the control unit 9 moves the nozzle 71 to a predetermined maintenance position (a position opposite to the roller 721). Then, the control unit 9 controls the pump 81 according to the control parameters set in the first adjustment process (S1) to discharge the processing liquid from the nozzle 71 to the roller 721. Additionally, while the pseudo application is being performed, the discharge pressure measurement unit 911 samples the discharge pressure measured by the pressure gauge 86 and acquires data of the pressure waveform. The pressure waveform acquired in step S12 is an example of a “first pressure waveform.”

After the pressure waveform of the pseudo application is acquired in step S12, evaluation of the pseudo waveform is performed (step S13). As an example of the evaluation method, the discharge control parameter adjusting unit 915 determines whether the pressure waveform acquired in step S12 is the same as the first abnormal waveform Wt1 (see FIG. 9), which is an ideal pressure waveform. . Specifically, it is determined whether the amount of deviation of the pressure waveform acquired in step S12 from the first abnormal waveform Wt1 exceeds a predetermined allowable range.

Additionally, in step S13, the user may evaluate the pressure waveform. In this case, the discharge control parameter adjustment unit 915 may display the pressure waveform and the first abnormal waveform Wt1 on the display. Additionally, the discharge control parameter adjustment unit 915 may display the amount of deviation on the display. In this way, by displaying various information on the display, the user's evaluation can be appropriately supported. Additionally, the discharge control parameter adjusting unit 915 may receive an input of an evaluation result from a user through an input device and store the inputted evaluation result in the storage unit 93.

When it is evaluated in step S13 that the pressure waveform of the pseudo application is the same as the first abnormal waveform Wt1 (for example, when the amount of deviation is within the allowable range; Yes in step S13), the applicator 1 1 End the adjustment process (S1). On the other hand, when it is evaluated in step S13 that the pressure waveform of the pseudo application is different from the first abnormal waveform Wt1 (for example, when the amount of deviation exceeds the allowable range; in the case of No in step S13), application Device 1 updates discharge control parameters (step S14). Specifically, based on the evaluation result of step S13, the discharge control parameter adjusting unit 915 stores a pressure waveform in the storage unit 93 such that the pressure waveform when pseudo-coating is performed becomes the first abnormal waveform Wt1. Update discharge control parameters. The algorithm for updating the discharge control parameters can be arbitrarily selected, for example, Bayesian optimization, genetic algorithm, gradient method, linear programming method, etc.

Additionally, as described in Patent Document 1, the update of the discharge control parameters may be performed using a learned model that has learned the relationship between the amount of change in the discharge control parameter and the amount of deviation. As a model for learning, a neural network can be used.

Additionally, in step S14, the user may be able to update the discharge control parameters. In this case, the discharge control parameter adjusting unit 915 may accept the input of a new discharge control parameter through an input device and store the received discharge control parameters in the storage unit 93.

As described above, in the first adjustment process (S1), the discharge control parameters for actual application are adjusted based on the pressure waveform obtained by the simulated application in step S12. For this reason, consumption of the substrate S can be suppressed compared to the case where the discharge control parameter is adjusted by actual application.

<Second adjustment process (S2)>

FIG. 7 is a flowchart showing details of the second adjustment process (S2) shown in FIG. 5. The second adjustment process (S2) is a process of adjusting the movement control parameters in advance by pseudo movement when performing actual application with the coating device 1.

As shown in FIG. 7 , when the second adjustment process (S2) is started, first, the movement control parameter adjustment unit 917 sets the movement control parameter to a predetermined initial value (step S21). The initial value may be an arbitrary value, or may be a value set based on a predetermined algorithm. The movement control parameter adjustment unit 917 stores the set movement control parameters in the storage unit 93. Additionally, the movement control parameter adjustment unit 917 may accept an input of an initial value from the user and store the received initial value in the storage unit 93.

After the movement control parameters are set in step S21, the control unit 9 executes a pseudo movement and acquires a speed waveform (step S22). Specifically, the movement control unit 912 moves the chuck mechanism 51 holding the substrate S by controlling the suction/travel mechanism 52 according to the movement control parameters. Additionally, while the pseudo movement is being performed, the speed measurement unit 913 samples the moving speed of the chuck mechanism 51 based on the output of the suction/travel mechanism 52 and acquires speed waveform data.

After the speed waveform of the pseudo movement is acquired in step S22, evaluation of the speed waveform is performed (step S23). As an example of the evaluation method, the movement control parameter adjustment unit 917 evaluates whether the shape of the speed waveform is the same as the shape of the pressure waveform adjusted in step S11. Additionally, when comparing the shape of the velocity waveform and the shape of the pressure waveform, normalization is performed to match the velocity scale in the velocity waveform and the pressure scale in the pressure waveform. Then, it is determined whether the amount of deviation of the velocity waveform from the pressure waveform exceeds a predetermined allowable range.

Additionally, a regression parameter obtained by regressing the velocity waveform and the pressure waveform with a predetermined function may be derived as an evaluation value, and based on the evaluation value, it may be determined whether the shapes match.

Additionally, in step S23, the user may evaluate the speed waveform. In this case, the movement control parameter adjustment unit 917 may display the normalized speed waveform and pressure waveform on the display. Additionally, the movement control parameter adjustment unit 917 may display the amount of deviation on the display. In this way, by displaying various information on the display, the user's evaluation can be appropriately supported. Additionally, the movement control parameter adjusting unit 917 may receive an input of an evaluation result from a user through an input device and store the inputted evaluation result in the storage unit 93.

When it is evaluated in step S23 that the speed waveform of the pseudo movement is the same as the shape of the pressure waveform (for example, when the amount of deviation is within the allowable range; Yes in step S23), the applicator 1 performs the second adjustment process. (S2) ends. On the other hand, when it is evaluated in step S23 that the speed waveform of the pseudo movement is different from the shape of the pressure waveform (for example, when the amount of deviation exceeds the allowable range; no in step S23), the applicator 1 , update the movement control parameters (step S24). Specifically, the movement control parameter adjusting unit 917 updates the movement control parameters stored in the storage unit 93 so that the shape of the movement waveform when the pseudo movement is performed becomes a pressure waveform. The algorithm for updating the movement control parameters can be arbitrarily selected, for example, Bayesian optimization, genetic algorithm, gradient method, linear programming method, etc.

Additionally, the update of the movement control parameters may be performed using a learned model that has learned the relationship between the amount of change in the movement control parameter and the amount of deviation. As a model for learning, a neural network can be used.

Additionally, in step S24, the user may be able to update the movement control parameters. In this case, the movement control parameter adjusting unit 917 may accept an input of a new movement control parameter from the user through an input device and store the received movement control parameters in the storage unit 93.

As described above, in the second adjustment process (S2), the movement control parameters are adjusted so that the shape of the velocity waveform matches the shape of the pressure waveform. By performing actual application according to the movement control parameters adjusted in this way, it becomes possible to apply the processing liquid to the substrate S with a uniform thickness.

<Third adjustment process (S3)>

FIG. 8 is a flowchart showing details of the third adjustment process (S3) shown in FIG. 5. The third adjustment process (S3) is a process of readjusting the discharge control parameters adjusted in the first adjustment process (S1) based on the pressure waveform obtained by simulated application when performing actual application with the applicator 1. am.

When the third adjustment process (S3) is started, the applicator 1 is adjusted according to the discharge control parameter adjusted by the first adjustment process (S1) and the movement control parameter adjusted by the second adjustment process (S2). , actual application is carried out and a pressure waveform is acquired (step S31). Specifically, the application mechanism 7 moves the nozzle 71 to the application position. Then, the movement control unit 912 moves the substrate S by controlling the suction/travel mechanism 52 according to the movement control parameters, and the discharge control unit 910 controls the pump 81 according to the discharge control parameters. ) is controlled to discharge the processing liquid from the nozzle 71 to the substrate S. Additionally, while actual application is being performed, the discharge pressure measurement unit 911 acquires a pressure waveform by sampling the discharge pressure measured by the pressure gauge 86. The pressure waveform acquired in step S31 is an example of a “second pressure waveform.”

After the pressure waveform of actual application is acquired in step S31, evaluation of the pressure waveform is performed (step S32). The evaluation method of the pressure waveform in step S32 may be the same as the evaluation method of the pressure waveform in step S13 shown in FIG. 6. That is, the discharge control parameter adjustment unit 915 may determine whether the amount of deviation of the pressure waveform acquired in step S31 from the first abnormal waveform Wt1 exceeds a predetermined allowable range.

Additionally, in step S32, the user may evaluate the pressure waveform of actual application. In this case, the discharge control parameter adjustment unit 915 may display the pressure waveform and the first abnormal waveform Wt1 on the display. Additionally, the discharge control parameter adjustment unit 915 may display the amount of deviation on the display. In this way, by displaying various information on the display, the user's evaluation can be appropriately supported. Additionally, the discharge control parameter adjusting unit 915 may receive an input of an evaluation result from a user through an input device and store the inputted evaluation result in the storage unit 93.

When it is evaluated in step S32 that the pressure waveform of the actual application is the same as the first abnormal waveform (for example, when the amount of deviation is within the allowable range; Yes in step S32), the applicator 1 performs the third adjustment. The process (S3) ends. On the other hand, in step S32, when it is evaluated that the pressure waveform of the actual application is different from the first abnormal waveform (Wt1) (for example, when the amount of deviation exceeds the allowable range; no in step S32), the control unit (9) determines that it is necessary to readjust the discharge control parameters, and readjusts the discharge control parameters.

In readjusting the discharge control parameters, the discharge control parameter adjustment unit 915 updates the discharge control parameters (step S33). Specifically, the discharge control parameter adjustment unit 915 controls the discharge stored in the storage unit 93 so that the pressure waveform when pseudo-coating is performed becomes the second abnormal waveform Wt2 (see FIG. 6) described later. Update control parameters. The algorithm for updating the discharge control parameters can be arbitrarily selected, for example, Bayesian optimization, genetic algorithm, gradient method, linear programming method, etc.

Additionally, as described in Patent Document 1, the update of the discharge control parameters may be performed using a learned model that has learned the relationship between the amount of change in the discharge control parameter and the amount of deviation. As a model for learning, a neural network can be used.

Additionally, in step S33, the user may be able to update the discharge control parameters. In this case, the discharge control parameter adjusting unit 915 may accept input of a new discharge control parameter from the user through an input device and store the received discharge control parameters in the storage unit 93.

Fig. 9 is a diagram showing a setting example of the second abnormal waveform (Wt2). The second abnormal waveform Wt2 is generated, for example, by the discharge control parameter adjustment unit 915 and stored in the storage unit 93. The second abnormal waveform (Wt2) has a different shape from the first abnormal waveform (Wt1). Specifically, the second abnormal waveform (Wt2) is the difference value (displacement amount) between the first abnormal waveform (Wt1) and the pressure waveform (Wr1) of the actual application obtained in step S31 and the first abnormal waveform (Wt1). It has a modified shape based on . More specifically, the second abnormal waveform (Wt2) has a shape obtained by subtracting the above difference value from the first abnormal waveform (Wt1). Additionally, the shape of the second abnormal waveform Wt2 is not limited to the shape shown in FIG. 9 and can be set appropriately.

Returning to FIG. 8 , after the discharge control parameters are updated in step S33, the applicator 1 performs pseudo application according to the updated discharge control parameters (step S34). When the nozzle 71 is at the application position above the application stage 32, the application mechanism 7 moves the nozzle 71 to the maintenance position. Then, the processing liquid is discharged from the nozzle 71 to the rotating roller 721. While pseudo application is being performed, the discharge pressure measurement unit 911 acquires a pressure waveform by sampling the discharge pressure measured by the pressure gauge 86. The pressure waveform acquired in step S34 is an example of the “third pressure waveform”.

After the pressure waveform of the pseudo application is acquired in step S34, the pressure waveform is evaluated (step S35). The pressure waveform evaluation method may be the same as the pressure waveform evaluation method in step S13 shown in FIG. 6. However, in step S35, the second abnormal waveform (Wt2) is used instead of the first abnormal waveform (Wt1). Specifically, the discharge control parameter adjustment unit 915 may determine whether the amount of deviation of the pressure waveform acquired in step S34 from the second abnormal waveform Wt2 exceeds a predetermined allowable range.

Additionally, in step S35, the user may evaluate the pressure waveform. In this case, the discharge control parameter adjustment unit 915 may display the pressure waveform and the second abnormal waveform Wt2 on the display. Additionally, the discharge control parameter adjustment unit 915 may display the amount of deviation on the display. In this way, by displaying various information on the display, the user's evaluation can be appropriately supported. Additionally, the discharge control parameter adjusting unit 915 may receive an input of an evaluation result from a user through an input device and store the inputted evaluation result in the storage unit 93.

When it is evaluated in step S35 that the pressure waveform of the pseudo application is different from the second abnormal waveform (Wt2) (for example, when the amount of deviation exceeds the allowable range; no in step S35), the applicator 1 , perform step S33 (update of discharge control parameters) again. On the other hand, when it is evaluated in step S35 that the pressure waveform of the pseudo application is the same as the second abnormal waveform Wt2 (for example, when the amount of deviation is within the allowable range; Yes in step S35), the applicator 1 , perform step S31 (acquisition of pressure waveform of actual application) again. In this way, the applicator 1 readjusts the discharge control parameters by repeatedly performing steps S33 to S35 until the pressure waveform obtained by the simulated application is evaluated to be the same as the second abnormal waveform Wt2. .

As described above, in the third adjustment process (S3), when it is evaluated in step S32 that the pressure waveform of the actual application is not an ideal waveform, the discharge control parameters are readjusted based on the pressure waveform obtained by the simulated application in step S34. do. Thereby, it is possible to readjust the discharge control parameters while suppressing consumption of the substrate S. By suppressing the consumption of the substrate S, the environmental load can be reduced.

Since the environmental conditions are different between simulated application and actual application, the resulting pressure waveform may change even if the discharge control parameters are the same. In this embodiment, the second abnormal waveform (Wt2), which is a standard for evaluating the pressure waveform of simulated application, is divided into the first abnormal waveform (Wt1), the pressure waveform (Wr1) of actual application, and the first abnormal waveform (Wt1). The shape is transformed according to the difference value. For this reason, the discharge control parameters can be appropriately readjusted so that the pressure waveform of actual application becomes the first abnormal waveform (Wt1).

<Fourth adjustment process (S4)>

FIG. 10 is a flowchart showing details of the fourth adjustment process (S4) shown in FIG. 5. The fourth adjustment process (S4) readjusts the discharge control parameters adjusted by the third adjustment process (S3) based on the pressure waveform obtained by actual application while performing actual application in the applicator 1. It's fair.

When the fourth adjustment process (S4) is started, the applicator 1 is adjusted according to the discharge control parameter adjusted by the third adjustment process (S3) and the movement control parameter adjusted by the second adjustment process (S2). Along with actual application, a pressure waveform is acquired (step S41). The pressure waveform acquired in actual application using the discharge control parameter adjusted in the third adjustment process (S3) is an example of the “fourth pressure waveform”.

After the pressure waveform of actual application is acquired in step S41, evaluation of the pressure waveform is performed (step S42). As an example of the evaluation method, the discharge control parameter adjustment unit 915 determines whether the pressure waveform of the actual application obtained in step S41 is the same as the first abnormal waveform Wt1. More specifically, it is determined whether the amount of deviation of the pressure waveform of actual application from the first abnormal waveform (Wt1) exceeds the allowable range.

Additionally, in step S42, the user may evaluate the pressure waveform. In this case, the discharge control parameter adjustment unit 915 may display the pressure waveform and the first abnormal waveform Wt1 on the display. Additionally, the discharge control parameter adjustment unit 915 may display the amount of deviation on the display. In this way, by displaying various information on the display, the user's evaluation can be appropriately supported. Additionally, the discharge control parameter adjusting unit 915 may receive an input of an evaluation result from a user through an input device and store the inputted evaluation result in the storage unit 93.

When it is evaluated in step S42 that the pressure waveform of the actual application is different from the first abnormal waveform (Wt1) (for example, when the amount of deviation exceeds the allowable range; no in step S42), the discharge control parameter adjustment unit 915 ) updates the discharge control parameters (step S43). Specifically, the discharge control parameter adjustment unit 915 sets the discharge control parameters stored in the storage unit 93 so that the pressure waveform of the actual application becomes the first abnormal waveform Wt1, based on the evaluation result of step S42. Update . The algorithm for updating the discharge control parameters can be arbitrarily selected, for example, Bayesian optimization, genetic algorithm, gradient method, linear programming method, etc.

Additionally, as described in Patent Document 1, for example, the update of the discharge control parameters can also be performed using a learned model that has learned the relationship between the amount of change in the discharge control parameter and the amount of deviation. As a model for learning, a neural network can be used.

When the discharge control parameter is updated in step S43, the applicator 1 performs step S41 (acquisition of pressure waveform by actual application) again. The pressure waveform of actual application obtained using the updated discharge control parameters is an example of the “fifth pressure waveform.”

When it is evaluated in step S42 that the pressure waveform of the actual application is the same as the first abnormal waveform Wt1 (for example, when the amount of deviation is within the allowable range; YES in step S42), the applicator 1 It is determined whether or not to end actual application (step S43). When it is determined in step S43 that actual coating is finished (for example, when there is no substrate S to be coated; YES in step S43), the coating device 1 performs a fourth adjustment process (S4). ) ends. When it is determined in step S43 that actual coating is to be continued (for example, when there is a substrate S to be coated; no in step S43), the coating device 1 performs step S41 again. .

As described above, in the first adjustment process (S1) and the third adjustment process (S3), the discharge control parameters are updated based on the pressure waveform obtained by simulated application, so the discharge control parameters can be sufficiently adjusted to suit actual application. There may be cases where this is not possible. In contrast, in the fourth adjustment process (S4), the discharge control parameter is updated based on the pressure waveform obtained by actual application. For this reason, the discharge control parameters can be adjusted to suit actual application. Therefore, in actual application, an ideal pressure waveform can be reproduced.

In addition, if the discharge control parameter is adjusted only through the fourth adjustment process (S4) without performing the first adjustment process (S1) and the third adjustment process (S3), the environmental load will increase by consuming a large amount of substrate. There are concerns. In this embodiment, the discharge control parameters are first adjusted to some extent through the first adjustment process (S1) and the third adjustment process (S3), and then the fourth adjustment process (S4) is performed, so that the Consumption can be curbed. Thereby, the environmental load can be reduced.

<2. Variation example>

Although the embodiments have been described above, the present invention is not limited to the above, and various modifications are possible.

For example, in the above embodiment, pseudo-coating is performed by discharging the coating liquid onto the roller 721. However, the coating liquid may be discharged at points other than the roller 721. For example, the coating liquid may be discharged into a container that can accommodate the coating liquid discharged from the nozzle 71, such as the roller bat 723.

Although the present invention has been described in detail, the above description is illustrative in all aspects and does not limit the present invention thereto. It is understood that numerous modifications not illustrated may be contemplated without departing from the scope of the invention. Each configuration described in each of the above-described embodiments and each modification can be appropriately combined or omitted as long as they do not contradict each other.

1: Applicator
5: moving mechanism
7: Applicator
8: Treatment liquid supply mechanism
9: control unit
51: Chuck mechanism
52: Suction/driving mechanism
71: nozzle
81: pump
83: Treatment liquid replenishment unit
86: pressure gauge
910: Discharge control unit
911: Discharge pressure measuring unit
912: movement control unit
913: Speed measurement unit
915: Discharge control parameter adjustment unit
917: Movement control parameter adjustment unit
931: program
M: recording medium
S: substrate

Claims (5)

A control parameter adjustment method for adjusting discharge control parameters for controlling discharge of processing liquid from a nozzle, comprising:
a) a step of adjusting the discharge control parameter based on a first pressure waveform indicating a change in pressure within the nozzle when pseudo-coating is performed to discharge the processing liquid from a nozzle to a point other than the substrate;
b) a process of acquiring a second pressure waveform indicating a change in pressure within the nozzle when actual application of discharging the processing liquid onto the substrate from the nozzle is performed according to the discharge control parameter adjusted by the process a); ,
c) a process of determining whether to readjust the discharge control parameter based on the second pressure waveform;
d) a step of readjusting the discharge control parameters based on a third pressure waveform indicating a pressure change in the nozzle when the pseudo-coating is performed, when it is determined to be readjusted by the step c);
e) a step of acquiring a fourth pressure waveform indicating a change in pressure within the nozzle when the actual application is performed according to the discharge control parameter readjusted by the step d);
f) a process of determining whether to readjust the discharge control parameter based on the fourth pressure waveform;
g) When it is determined to be readjusted by the step f), a control parameter including a step of readjusting the discharge control parameter based on a fifth pressure waveform indicating a pressure change in the nozzle when the actual application is performed. How to adjust. According to claim 1,
h) further comprising the process of adjusting a movement control parameter to control the relative movement of the substrate with respect to the nozzle,
The control parameter adjustment method wherein the actual application discharges a processing liquid from the nozzle to the substrate while moving the substrate relative to the nozzle according to a movement control parameter adjusted in the step h). The method of claim 1 or 2,
In step h), the movement control parameter is adjusted based on a speed waveform representing a change in the relative speed of the substrate with respect to the nozzle. As a computer-executable program,
A program that causes the computer to execute the control parameter adjustment method according to claim 1 or 2. A computer-readable recording medium,
A recording medium on which the program according to claim 4 is recorded.

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